Richard M Dekeuster

6681597, Jan 27, 2004

Nov 4, 2002

10/287388

Jian-Min Yin - Kenosha WI
Stephen Memory - Kenosha WI
Richard M. DeKeuster - Racine WI

Modine Manufacturing Company - Racine WI

F25B 4300

62503, 62513

An integrated unit ( ) in a refrigeration system ( ) wherein a low-pressure conduit ( ) and high-pressure conduit ( ) are in conductive heat exchange relation to each other within an accumulator housing ( ). The low pressure conduit ( ) and high-pressure conduit ( ) may be flat tubes wherein broad sides of the flat tubes are in conductive heat exchange relation to each other. The low-pressure conduit ( ) and high-pressure conduit ( ) or tubes have longitudinal axes ( , respectively) that extend parallel to one another over a length ( ) within the integrated unit ( ).

7017655, Mar 28, 2006

Dec 18, 2003

10/739759

Michael J. Wilson - Racine WI, US
Kevin L. Wert - Halifax PA, US
Jonathan Wattelet - Gurnee IL, US
Richard DeKeuster - Racine WI, US
Donald Lightner - Franksville WI, US

Modine Manufacturing Co. - Racine WI

H05K 7/20
F28F 3/12

165 804, 165168, 16510433, 361699

A heat exchanger for cooling a heat generating device is provided that includes a plurality of plates each defining at least one through-bore. The plates are laminated together to form a stack so that a plurality of enclosed chambers are formed by an alignment of a first portion of the through-bores within the block, and a plurality of passageways are formed by an alignment of a second portion of the through-bores within the stack such that at least one of the passageways is arranged in fluid communication with at least two of the chambers. A baffle-plate is disposed within a portion of the stack so as to form a chamber boundary and thereby to define a circuitous fluid flow path between the chambers through the at least one passageway. A fluid entrance port is defined in a first outer one of the plates and arranged in fluid communication with one of the chambers, and a fluid exit port is also defined in a second outer one of the plates and arranged in fluid communication with another one of the chambers.

7149087, Dec 12, 2006

Sep 7, 2005

11/220456

Michael J. Wilson - Racine WI, US
Jonathan Wattelet - Gurnee IL, US
Donald Lightner - Franksville WI, US
Richard DeKeuster - Racine WI, US
Ernest H. Dubble - Lancaster PA, US
Gregg J. Baldassarre - Lititz PA, US

Thermal Corp. - Wilmington DE

H05K 7/20

361699, 361701, 361702, 361704, 257714, 257718, 174 151, 165 804

A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

7312995, Dec 25, 2007

Nov 4, 2005

11/266812

Michael J. Wilson - Racine WI, US
Jonathan P. Wattelet - Gurnee IL, US
Donald S. Lightner - Franksville WI, US
Richard M. DeKeuster - Racine WI, US

Modine Manufacturing Company - Racine WI

H05K 7/20
F28F 7/00

361701, 165 804, 165121, 361699, 361696, 361702, 361695, 454184

A cooling system is provided for supplying a coolant flow to a cold plate associated with a processing chip of an electronic device to cool the processing chip. The system includes an electric motor driven fan; a radiator; an accumulator tank connected to the radiator for the transfer of coolant between the accumulator and the radiator; an electric driven pump connected to at least one of the radiator, the accumulator, and the cold plate to provide the coolant flow through the radiator and the cold plate; and a fan shroud adapted to direct the airflow provided by the fan. The fan, the radiator, the accumulator tank, and the pump are mounted on the shroud to be carried thereby, and the pump is located on an exterior side of the of the fan shroud and outside of the radiator and the accumulator tank.

7414844, Aug 19, 2008

Dec 12, 2006

11/637633

Michael J. Wilson - Racine WI, US
Jonathan Wattelet - Gurnee IL, US
Donald Lightner - Franksville WI, US
Richard DeKeuster - Racine WI, US
Ernest H. Dubble - Lancaster PA, US
Gregg J. Baldassarre - Lititz PA, US

Thermal Corp. - Wilmington DE

H05K 7/20

361699, 361701, 361702, 361704, 257714, 257718, 165 804, 174 151

A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

20120244404, Sep 27, 2012

Oct 13, 2010

13/501450

Kem Obasih - Brookfield WI, US
Richard M. DeKeuster - Racine WI, US
Jason D. Fuhr - Sussex WI, US
Xugang Zhang - Milwaukee WI, US
Wataru Tsutsui - West Lafayette IN, US

H01M 10/50
H01M 2/10

429 99, 429120

A battery module includes a plurality of electrochemical cells provided side-by-side one another and a thermal management feature extending substantially the length of the battery module. The thermal management feature is coupled to a first side of each of the electrochemical cells and includes a passage though which a thermal management fluid may pass and a heat sink provided within the passage to transfer heat between the electrochemical cells and the thermal management fluid.

20120247107, Oct 4, 2012

Mar 29, 2012

13/434459

Mikhail S. Balk - Brown Deer WI, US
Richard M. DeKeuster - Racine WI, US
Binbin Fan - Shanghai, CN

Johnson Controls Technology LLC - Wilmington DE

F02B 73/00
H01M 10/04
F01B 21/04
H01M 2/10

60718, 429100, 296231, 180 6522, 903907

A battery module includes a rigid external casing made, for example, of a metallic sheet material. Securement features, tabs, and so forth may be formed in the material of the casing. The casing may be made by stamping and bending metallic sheet. A liner is disposed in the casing, and one or more battery cells are disposed in the liner. The liner may comprise an insulative sheet material that is cut and folded to generally conform to the casing. The structure may include a bus bar assembly, compression members, a thermal component and other structural and functional elements.

20120263988, Oct 18, 2012

Apr 12, 2012

13/445244

Kem Obasih - Brookfield WI, US
Robert J. Mack - Miwaukee WI, US
Gary P. Houchin-Miller - Milwaukee WI, US
Jason D. Fuhr - Sussex WI, US
Richard M. DeKeuster - Racine WI, US

Johnson Controls Technology LLC - Wilmington DE

H01M 10/50
H01M 2/10

429 98

Battery systems and modules having external thermal management systems are provided. In one embodiment, a battery module includes a housing and at least one electrochemical cell disposed within the housing. The battery module also includes a thermal interface having a first side in contact with the at least one electrochemical cell. The battery module also includes a heat sink in contact with a second side of the thermal interface. The thermal interface is adapted to enable heat transfer from the at least one electrochemical cell to the heat sink.