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Rene Kunz

from Mountain View, CA
Age ~84
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Connected to:
Abby M Kunz, 35Alan R Kunz, 68Albert F Kunz, 73Alexis Kunz, 30Anjali N Kunz, 49Bethanne M Kunz, 48Branden Kunz, 41Brent Kunz, 54Bryan Kunz, 41Carrie L Kunz, 48

Rene Kunz Phones & Addresses

  • 505 Cypress Point Dr, Mountain View, CA 94043
  • 505 Cypress Point Dr UNIT 159, Mountain View, CA 94043
  • Red Bank, NJ
  • 505 Cypress Point Dr UNIT 15, Mountain View, CA 94043

Work

Company: Amd 1987 to 1999 Position: Member technical staff

Education

Specialities: Mechanical Engineering

Skills

Engineering • Semiconductors • Product Development • Engineering Management • Manufacturing • R&D • Product Marketing • Cross Functional Team Leadership • Electronics • Reliability • Ic • Design For Manufacturing • Six Sigma • Spc • Semiconductor Industry • Failure Analysis • Automation • Product Engineering • Metrology • Mems • Yield • Thin Films • Design of Experiments • Silicon • Microelectronics • Fmea • Sensors • Research and Development

Languages

English • German

Interests

Outdoors • Automobiles • Aviation • Reading

Industries

Electrical/Electronic Manufacturing

Resumes

Resumes

Rene Kunz Photo 1

Rene Kunz

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Location:
505 Cypress Point Dr, Mountain View, CA 94043
Industry:
Electrical/Electronic Manufacturing
Work:
Amd 1987 - 1999
Member Technical Staff
Skills:
Engineering
Semiconductors
Product Development
Engineering Management
Manufacturing
R&D
Product Marketing
Cross Functional Team Leadership
Electronics
Reliability
Ic
Design For Manufacturing
Six Sigma
Spc
Semiconductor Industry
Failure Analysis
Automation
Product Engineering
Metrology
Mems
Yield
Thin Films
Design of Experiments
Silicon
Microelectronics
Fmea
Sensors
Research and Development
Interests:
Outdoors
Automobiles
Aviation
Reading
Languages:
English
German

Publications

Us Patents

Methods Of Making Microelectronic Assemblies Using Bonding Stage And Bonding Stage Therefor

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US Patent:
6534392, Mar 18, 2003
Filed:
Sep 14, 2001
Appl. No.:
09/952140
Inventors:
Jim Behlen - Sunnyvale CA
Philip Damberg - Cupertino CA
Rene Kunz - Mountain View CA
Assignee:
Tessera, Inc. - San Jose CA
International Classification:
H01L 2144
US Classification:
438617
Abstract:
A method of making a microelectronic assembly comprises connecting a lead to a contact on a microelectronic element and to a stage. The microelectronic element is juxtaposed with a microelectronic component and the lead is disconnected from the stage. The lead is bonded to a terminal pad on the microelectronic component. A stage for making a microelectronic assembly has a conduit for introducing a bonding tool toward a lead bonded to the stage and extending across the conduit while the microelectronic element is juxtaposed with the microelectronic component.

Bonding Semiconductor Chips To A Mounting Surface Utilizing Adhesive Applied In Starfish Patterns

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US Patent:
48031240, Feb 7, 1989
Filed:
Aug 14, 1987
Appl. No.:
7/085355
Inventors:
Rene Kunz - Mountain View CA
Assignee:
Alphasem Corporation - Sunnyvale CA
International Classification:
B05D 114
B32B 3100
B05C 302
US Classification:
428200
Abstract:
A method of bonding semiconductor chips to a mounting surface and a nozzle for same includes the steps of applying a first deposit of a die attach adhesive material to the mounting surface in a manner wherein the first deposit has the general shape of a starfish. This starfish shape is characterized by a raised central portion disposed at the intersection of the radially inner ends of a plurality of centrally thickened arms. The next step is to apply the bonding surface of a semiconductor chip against the deposit to cause the deposit to spread therebeneath while removing air pockets and hence any voids within the die attach adhesive material. The volume of the deposit being proportional to the surface area of the bonding surface and the configuration of the first deposit being defined to cause uniform and symmetrical spreading of the first deposite across the bonding surface provides full coverage of the bonding surface with a uniformly thick layer of adhesive. A die attach dispensing tool or nozzle includes a bottom shape including recessed portions whereby when the bottom of the tool is disposed in confronting relation to a mounting surface a flow passage carrying die attach adhesive material can be employed to fill the recessed portions and thereby define a deposit of die attach material in the general shape of a starfish.
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Rene Kunz from Mountain View, CA, age ~84 Get Report