Raymond Duff Phones & Addresses
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72 Juliette St, North Dartmouth, MA 02747 (508) 996-6115
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73 Juliette St, North Dartmouth, MA 02747
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Dartmouth, MA
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Farmington, ME
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North Port, FL
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Taunton, MA
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Swansea, MA
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Sarasota, FL
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New Bedford, MA
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72 Juliette St, North Dartmouth, MA 02747 (508) 446-0033
Work
Position:
Professional/Technical
Education
Degree:
Graduate or professional degree
Business Records
Name / Title
Company / Classification
Phones & Addresses
President
DTRAQ CORP
Myles Standish Industrial Park 125 John Hancock Rd, Taunton, MA 02780
72 Juliette St, North Dartmouth, MA 02747
72 Juliette St, North Dartmouth, MA 02747
Publications
Us Patents
System For Packaging Of Electronic Circuits
View pageUS Patent:
44515405, May 29, 1984
Filed:
Aug 30, 1982
Appl. No.:
6/413169
Inventors:
Phillips C. Baird - Lakeville MA
Raymond J. Duff - South Dartmouth MA
Raymond J. Duff - South Dartmouth MA
Assignee:
Isotronics, Inc. - New Bedford MA
International Classification:
H01L 2302
US Classification:
428615
Abstract:
A brazing technique is described for providing a standard flat pack with a Thermkon base brazed to a Kovar frame through the utilization of an intermediary ring of high thermal conductivity material which prevents flashing onto the Thermkon base. Brazing is accomplished either in a one-step process in which the parts with the intermediary ring are brazed together all at one time with a single heat treatment, or in a two-step process in which the intermediary ring is first brazed to the frame. In a subsequent step, the frame with the intermediary ring brazed thereto, is brazed to the Thermkon base. In either process, the high thermal conductivity of the intermediary ring permits the ring to quickly reach brazing temperature for minimizing flashing.
Method Of Making A Package For Microelectronic Devices Using Iron Oxide As A Bonding Agent
View pageUS Patent:
62618679, Jul 17, 2001
Filed:
Mar 13, 1998
Appl. No.:
9/039058
Inventors:
John R. Robichaud - Seekonk MA
Raymond Duff - North Dartmouth MA
Donald C. Taber - Berkley MA
Raymond Duff - North Dartmouth MA
Donald C. Taber - Berkley MA
Assignee:
Stratedge Corporation - San Diego CA
International Classification:
H01L 2144
H01L 2148
H01L 2150
H01L 2306
H01L 2148
H01L 2150
H01L 2306
US Classification:
438118
Abstract:
A package for a microelectronic device, and a method for making the package, include a thermally conductive base containing a metal composite including a high conductivity metal and a ferrous alloy, the base having a surface with an iron oxide deposit disposed thereon. An insulating substrate is disposed on the surface of the base, the substrate having an aperture formed therein for exposing a portion of the surface of the base for mounting the device on the base. A conductive lead has a portion thereof embedded within the insulating substrate and is adapted to be electrically connected to the device. The insulating substrate is bonded to the iron oxide deposit disposed on the surface of the base, such as by heating.
Lead Grounding
View pageUS Patent:
44530331, Jun 5, 1984
Filed:
Mar 18, 1982
Appl. No.:
6/359209
Inventors:
Raymond J. Duff - North Dartmouth MA
Steven A. Tower - North Dartmouth MA
Jay S. Greenspan - South Dartmouth MA
Steven A. Tower - North Dartmouth MA
Jay S. Greenspan - South Dartmouth MA
Assignee:
Isotronics, Inc. - New Bedford MA
International Classification:
H05K 504
US Classification:
174 52FP
Abstract:
A microcircuit package in which one or more leads can be grounded to the package by a simple procedure which is performed on a package of usual construction. A braze preform is placed over a lead to be grounded, a metal washer is disposed over the lead and preform, and the assembly is brazed to cause fusing of the washer to the lead and to the header to provide a low resistance grounding connection between the lead and package.