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Randall G Kemink

from Poughkeepsie, NY
Age ~76
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Also known as:
Randall Gail Kemink
Phone and address:
71 Scenic Hills Dr, Poughkeepsie, NY 12603
(845) 473-0766
Related to:
Sarah E Ellenson, 48David J Gonzalez, 35Alicia Westall, 33Floyd Westall, 63Jill Borkenhagen, 45Linda Byzewski, 77
Connected to:
Amy J Kemink, 61Cheryl A Kemink, 71David W Kemink, 73Robert A Kemins, 66Gale E Kemis, 65Matthew J Kemish, 42Zohrab S Kemkemian, 76Brad P Kemker, 59Frank E Kemker, 59Tanya M Kemker, 34

Randall Kemink Phones & Addresses

  • 71 Scenic Hills Dr, Poughkeepsie, NY 12603 (845) 473-0766 (845) 473-4070 (845) 473-1070

Professional Records

License Records

Randall G Kemink

License #:
E-1700 - Expired
Category:
Engineering Intern

Publications

Us Patents

Separable Hybrid Cold Plate And Heat Sink Device And Method

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US Patent:
6829145, Dec 7, 2004
Filed:
Sep 25, 2003
Appl. No.:
10/671263
Inventors:
Joseph P. Corrado - Marlboro NY
Gary F. Goth - Pleasant Valley NY
Randall G. Kemink - Poughkeepsie NY
William P. Kostenko - Poughkeepsie NY
Budy D. Notohardjono - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 720
US Classification:
361704, 361707, 361709, 361711, 257712, 257718, 257719, 165 803, 165185, 174 151, 174 161, 174 163
Abstract:
An apparatus and method of cooling of an electronic module. The apparatus and method include a heat sink thermally coupled to the module, and a fastener configured to alter a clamping force therebetween as a result of the heat sink and the module formed of materials having a higher coefficient of thermal expansion (CTE) than the fastener.

Heat Sink And Method Of Making The Same

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US Patent:
7100281, Sep 5, 2006
Filed:
Mar 15, 2004
Appl. No.:
10/800564
Inventors:
Randall G. Kemink - Poughkeepsie NY, US
Prabjit Singh - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B23P 15/26
H05K 7/20
US Classification:
29890054, 2989003, 29890043, 29890047, 361709, 361710, 361711
Abstract:
A method for manufacturing a heat sink including heating a metal base to melt solder in grooves formed in the base. The base has a first coefficient of thermal expansion. The solder has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion. The metal base and the solder are cooled and the metal base experiences tensile stresses and the solder experiences compressive stresses to form a concavity in a thermal face of the base. The thermal face is then planed. Over time, the tensile stresses and the compressive stresses reduce such that the thermal face becomes convex.

Conductive Heat Transport Cooling System And Method For A Multi-Component Electronics System

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US Patent:
7408776, Aug 5, 2008
Filed:
Oct 10, 2006
Appl. No.:
11/539905
Inventors:
Levi A. Campbell - Poughkeepsie NY, US
Richard C. Chu - Hopewell Junction NY, US
Madhusudan K. Iyengar - Woodstock NY, US
Randall G. Kemink - Poughkeepsie NY, US
Roger R. Schmidt - Poughkeepsie NY, US
Robert E. Simons - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 7/20
F28F 7/00
US Classification:
361699, 165 804, 361702, 361711
Abstract:
A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.

Conductive Heat Transport Cooling System And Method For A Multi-Component Electronics System

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US Patent:
7639498, Dec 29, 2009
Filed:
Jun 24, 2008
Appl. No.:
12/144859
Inventors:
Levi A. Campbell - Poughkeepsie NY, US
Richard C. Chu - Hopewell Junction NY, US
Madhusudan K. Iyengar - Woodstock NY, US
Randall G. Kemink - Poughkeepsie NY, US
Roger R. Schmidt - Poughkeepsie NY, US
Robert E. Simons - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 7/20
F28F 7/00
US Classification:
361699, 165 802, 165 804, 361702
Abstract:
A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.

Low Compressive Force, Non-Silicone, High Thermal Conducting Formulation For Thermal Interface Material And Package

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US Patent:
7816785, Oct 19, 2010
Filed:
Jan 22, 2009
Appl. No.:
12/357744
Inventors:
Sushumna Iruvanti - Wappingers Falls NY, US
Randall G. Kemink - Poughkeepsie NY, US
Rajneesh Kumar - Poughkeepsie NY, US
Steven P. Ostrander - Poughkeepsie NY, US
Prabjit Singh - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 23/10
US Classification:
257707, 257706
Abstract:
An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5. 5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.

In-Line Memory Module Cooling System

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US Patent:
8125780, Feb 28, 2012
Filed:
Dec 22, 2009
Appl. No.:
12/645400
Inventors:
Gary F. Goth - Pleasant Valley NY, US
Randall G. Kemink - Poughkeepsie NY, US
Katie L. Pizzolato - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 7/20
US Classification:
361699, 165 804, 361704, 361708, 361715, 361719
Abstract:
A system to aid in cooling an in-line memory module may include a thermal interface material adjacent the in-line memory module. The system may also include a heat spreader adjacent the thermal interface material. The system may further include a cold-plate adjacent the heat spreader, the cold-plate, heat spreader, and thermal interface material to aid in cooling the in-line memory module.

System To Improve An In-Line Memory Module

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US Patent:
8248805, Aug 21, 2012
Filed:
Sep 24, 2009
Appl. No.:
12/566591
Inventors:
Mark A. Brandon - Poughkeepsie NY, US
Shawn Canfield - Poughkeepsie NY, US
David L. Edwards - Poughkeepsie NY, US
Robert R. Genest - Poughkeepsie NY, US
Randall G. Kemink - Poughkeepsie NY, US
Robert K. Mullady - Highland NY, US
John G. Torok - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 7/20
H01L 23/36
US Classification:
361719, 361702, 361707, 361709, 361715, 361720, 36167954, 257707, 257719
Abstract:
A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

Automatically Reconfigurable Liquid-Cooling Apparatus For An Electronics Rack

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US Patent:
8274790, Sep 25, 2012
Filed:
Nov 16, 2010
Appl. No.:
12/947302
Inventors:
Levi A. Campbell - Poughkeepsie NY, US
Richard C. Chu - Hopewell Junction NY, US
Madhusudan K. Iyengar - Woodstock NY, US
Randall G. Kemink - Poughkeepsie NY, US
Robert E. Simons - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 7/20
F28F 7/00
F28D 15/00
US Classification:
361696, 165 804, 16510433, 361699, 361701
Abstract:
An apparatus is provided for cooling an electronics rack, which includes an electronic subsystem across which air passing through the rack flows. A cooling unit provides, via system coolant supply and return manifolds, system coolant in parallel to the electronic subsystem and an air-to-liquid heat exchanger disposed to cool, in normal-mode, air passing through the rack. A controller monitors coolant associated with the cooling unit and automatically transitions the cooling apparatus from normal-mode to failure-mode responsive to detecting a failure of the coolant. In transitioning to failure-mode, multiple isolation valves are employed in switching to a serial flow of system coolant from the electronic subsystem to the heat exchanger for rejecting, via the system coolant, heat from the electronic subsystem to air passing across the heat exchanger.
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Randall G Kemink from Poughkeepsie, NY, age ~76 Get Report