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Philip J Beucler

from Danville, NH
Age ~64

Philip Beucler Phones & Addresses

  • 34 Tempo Dr, Danville, NH 03819 (603) 382-1279 (603) 382-5763
  • Haverhill, MA
  • Jaffrey, NH
  • 34 Tempo Dr, Danville, NH 03819 (603) 382-5763

Work

Position: Service Occupations

Publications

Us Patents

Leadframe-Based Chip Scale Package

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US Patent:
20020149091, Oct 17, 2002
Filed:
Sep 28, 2001
Appl. No.:
09/966222
Inventors:
William Palmteer - North Andover MA, US
Philip Beucler - Danville NH, US
International Classification:
H01L023/495
US Classification:
257/667000
Abstract:
An improved leadframe-based CSP and a method of forming the leadframe-based CSP are provided. The leadframe-based CSP includes a leadframe including a die attach pad and a plurality of wire bonding pads, at least one aperture disposed in the die attach pad, at least one die on the die attach pad, at least one bonding wire for electrically connecting the die and the wire bonding pads, and a mold compound for encapsulating the die and the bonding wire to form a chip package, wherein the mold compound is formed in the aperture.
Philip J Beucler from Danville, NH, age ~64 Get Report