Pardeep Kumar Bhatti

6407922, Jun 18, 2002

Sep 29, 2000

09/675055

Michael Z. Eckblad - Auburn WA
Pardeep K. Bhatti - University Place WA

Intel Corporation - Santa Clara CA

H05K 720

361704, 361707, 361709, 174 163, 165185, 257720

A heat spreader, method of making the heat spreader, and incorporation of the heat spreader in an assembly such as an electronic assembly, are disclosed. The heat spreader includes a matrix material, which has incorporated therein carbon nanotubes and/or thermal pyrolytic graphite flakes. The carbon nanotubes and/or thermal pyrolytic graphite flakes are situated between a first surface and a second surface of the heat spreader, to transfer heat from a heat source (e. g. , an electronic component) adjacent the first surface to, e. g. , a heat sink adjacent the second surface when the heat spreader is incorporated in the assembly. The first surface has a smaller surface area than that of the second surface. Desirably, the carbon nanotubes and/or thermal pyrolytic graphite flakes are aligned extending between the first and second surfaces, and spread out in a direction from the first surface to the second surface, to provide more effective heat transfer and uniform spreading of the heat. The matrix material can be a metal or plastic, and can be compliant, flexible and soft to provide better thermal contact of the heat spreader with the electronic component and heat sink, even if surfaces are uneven, and to provide protection for fragile electronic components against shock and vibration and during structural loading.

6473305, Oct 29, 2002

Oct 26, 2000

09/695933

Glen P. Gordon - Graham WA
Pardeep K. Bhatti - University Place WA

Intel Corporation - Santa Clara CA

H05K 720

361704, 361707, 361700, 361702, 361719, 257718, 257715, 257727, 174 163, 165 803, 165185, 411 57, 24452

A fastening system and a method for retaining temperature control devices used on semiconductor dies transfers the load of the temperature control devices around the semiconductor dies using a spring collet arrangement. An elongated spring collet is installed in a hole in the temperature control device so as to extend outwardly from the temperature control device with the spring collet being movable in the hole relative to the temperature control device in the direction of elongation of the spring collet. An expansion spring resiliently biases the spring collet so as to extend outwardly. An outer end of the spring collet is positioned in a pocket of a retention mechanism of a support member. An electrical connection is made as the temperature control device with semiconductor die is forced down until a pin grid array thereon is properly seated in a socket on the support member. A retention screw is then extended through the spring collet for connection with the retention mechanism and expansion of the spring collet into locking engagement with the temperature control device to retain the temperature control device.

58958835, Apr 20, 1999

Aug 11, 1997

8/908019

Pardeep Kumar Bhatti - Carmel IN
John Allen Hearn - Kokomo IN
Jack A. Bednarz - Kokomo IN
Daniel Alan Lawlyes - Cicero IN

Delco Electronics Corp. - Kokomo IN

H05K 500

174 17LF

An apparatus for dampening movement of passivation material in an electronic module and a method for manufacturing an electronic module incorporating such an apparatus are disclosed. The apparatus includes a housing defining a cavity sized to contain an electrical circuit and a non-solid passivation material. The apparatus further includes means for limiting movement of the passivation material within the cavity in at least one direction. In a preferred embodiment, the limiting means comprises at least one dam.

20190043778, Feb 7, 2019

Dec 26, 2015

16/061324

- Santa Clara CA, US
Shinobu KOURAKATA - Tsukuba-shi, JP
Kazuo OGATA - Tsukuba, JP
Paul R. START - Chandler AZ, US
Syadwad JIAN - Chandler AZ, US
William Nicholas LABANOK - Gilbert AZ, US
Wei HU - Chandler AZ, US
Peng LI - Chandler AZ, US
Douglas R. YOUNG - Tempe AZ, US
Gregory S. CONSTABLE - Chandler AZ, US
John J. Beatty - Chandler AZ, US
Pardeep K. BHATTI - Gilbert AZ, US
Luke J. GARNER - Chandler AZ, US
Aravindha R. ANTONISWAMY - Phoenix AZ, US

H01L 23/367
H01L 21/48
H01L 25/065

Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.