Oliver R Astley

7388534, Jun 17, 2008

Jul 20, 2006

11/458713

Oliver Richard Astley - Clifton Park NY, US
John Eric Tkaczyk - Delanson NY, US
Naresh Kesavan Rao - Clifton Park NY, US
James Walter LeBlanc - Niskayuna NY, US
Wen Li - Clifton Park NY, US
Yanfeng Du - Rexford NY, US

General Electric Company - Niskayuna NY

H03M 1/12

341155, 341157

An adaptive data acquisition circuit () includes an amplifier () for amplifying electrical pulses generated by a detector () responsive to energy incident at the detector. The adaptive data acquisition circuit also includes a counting circuit () for counting amplified electrical pulses generated by the amplifier. In addition, the adaptive data acquisition circuit includes a digital logic circuit () for determining a pulse parameter indicative of a pulse rate and an amount of energy present in the amplified electrical pulses and for generating a control signal () responsive to the pulse parameter for controlling an operating parameter of the data acquisition circuit.

7586096, Sep 8, 2009

Nov 17, 2006

11/560873

Oliver Richard Astley - Clifton Park NY, US
James Wilson Rose - Guilderland NY, US
Joe James Lacey - Cambridge WI, US
Jonathan David Short - Saratoga Springs NY, US
Ashutosh Joshi - Waukesha WI, US

General Electric Company - Niskayuna NY

G01T 1/24

25037015

An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.

7936299, May 3, 2011

Jun 30, 2009

12/495794

Oliver Richard Astley - Niskayuna NY, US
Naresh Kesavan Rao - Niskayuna NY, US
Feng Chen - Niskayuna NY, US

General Electric Company - Niskayuna NY

H03M 1/12

341172, 341155, 341156

A circuit for converting a charge signal into a binary format of output bits comprises: an integration circuit including an operational transconductance amplifier having an inverting input terminal and an output terminal, an integrating capacitor connected between the inverting input terminal and the output terminal, the integrating capacitor for storing a charge input selectively provided by a sensor diode; and a folding circuit having a fold capacitor, the fold capacitor switchably coupled either to a fold voltage source via a fold buffer for charging the fold capacitor to a predetermined fold charge value, or to the integrating capacitor for selectively removing at least a portion of the stored charge input.

8041003, Oct 18, 2011

Aug 31, 2009

12/551355

Oliver Richard Astley - Niskayuna NY, US
Naveen Chandra - Kenosha WI, US
James Rose - Niskayuna NY, US

General Electric Company - Niskayuna NY

H05G 1/60

378 19

A modular sensor assembly comprises: sensor arrays electrically coupled to a sensor substrate; a plurality of integrated circuits with sensor signal processors electrically coupled to a package substrate; and an interconnect assembly including electrical paths configured to electrically couple analog output signals from a first sensor array to a first integrated circuit and from a second sensor to a second integrated circuit, the first sensor disposed adjacent to the second sensor.

8492762, Jul 23, 2013

Jun 27, 2006

11/426617

James Wilson Rose - Guilderland NY, US
Kevin Matthew Durocher - Waterford NY, US
Donna Marie Sherman - East Greenbush NY, US
Oliver Richard Astley - Clifton Park NY, US

General Electric Company - Niskayuna NY

H01L 23/58

257 48, 257691, 257416, 257422, 257433, 257435, 257443, 257659

An interface circuit for a sensor array is provided. The interface circuit may be made up of an integrated circuit package that provides a first region and a second region. The first region may be spaced apart and opposite to the second region of the package. The first region of the package may provide a plurality of interfaces for interconnecting to an integrated circuit in the package a plurality of signals from the sensor array and having a first electrical characteristic, such as analog and test signals. The second region of the package may provide a plurality of interfaces for interconnecting to the integrated circuit a plurality of signals having at least one electrical characteristic different than the first characteristic, such as power and operational digital signals.

20030149364, Aug 7, 2003

Feb 1, 2002

10/062334

Ajay Kapur - Clifton Park NY, US
Jeffrey Eberhard - Albany NY, US
Boris Yamrom - Bronx NY, US
Kai Thomenius - Clifton Park NY, US
Donald Buckley - Schenectady NY, US
Roger Johnson - Hagaman NY, US
Reinhold Wirth - Ballston Spa NY, US
Oliver Astley - Clifton Park NY, US
Beale Opsahl-Ong - Darien CT, US
Serge Muller - Guyancourt, FR
Steve Karr - Scotia NY, US

A61B005/05
A61B008/00
A61B008/12
A61B008/14

600/439000

A method for generating an image of an object of interest includes acquiring a first three-dimensional dataset of the object at a first position using an X-ray source and a detector, acquiring a second three-dimensional dataset of the object at the first position using an ultrasound probe, and combining the first three-dimensional dataset and the second three-dimensional dataset to generate a three-dimensional image of the object.

20050089205, Apr 28, 2005

Oct 23, 2003

10/692450

Ajay Kapur - Clifton Park NY, US
Boris Yamrom - Bronx NY, US
Oliver Astley - Clifton Park NY, US

G06K009/00

382128000

A method for viewing an abnormality in different kinds of images is described. The method includes scanning an object using a first imaging system to obtain at least a first image of the object, determining coordinates of a region of interest (ROI) visible on the first image, wherein the ROI includes the abnormality, and using the coordinates of the ROI to scan the object with a second imaging system.

20060038712, Feb 23, 2006

Aug 12, 2005

11/203493

Daniel Harrison - Delanson NY, US
Naresh Rao - Clifton Park NY, US
Shobhana Mani - Clifton Park NY, US
Naveen Chandra - Kenosha WI, US
Oliver Astley - Clifton Park NY, US
Donald McGrath - Fort Collins CO, US

H03M 1/12

341155000

A multi-channel analog to digital conversion circuit and methods thereon are provided. The multi-channel analog to digital conversion cirucit comprises a plurality of linearized channels wherein each channel comprises a multi-stage pipelined charge-to-digital converter and an integrating capacitor within each stage of the multi-stage converter wherein analog residue is processed by subsequent analog to digital converter stages. Each stage of respective linearized channels is configured for calculating gain and offset for each stage in the channel and such gain and offset is used in subsequent integration periods.