Andrew P. Lane - Westminster TX Norris E. Tidwell - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 2102
US Classification:
437239
Abstract:
A wafer 2 is supported polished (active) face down in a recess formed in the upper surface of a second wafer 4 which serves as a wafer support. The two wafers 2, 4 are disposed in an atmosphere of steam at 900. degree. C. at a pressure of 500 psi which results in forming an oxide on the polished face of the wafer 2.