Inventors:
Ping Chao - Los Altos Hills CA
Wei-Jin Dai - Cupertino CA
Mitsuru Igusa - Los Gatos CA
Wei-Lun Kao - Cupertino CA
Assignee:
Silicon Perspective Corporation - San Jose CA
International Classification:
G06F 1750
Abstract:
Disclosed herein is a method for dividing an integrated circuit (IC) design into several circuit partitions, each including one or more circuit modules, and then separately carrying out placement and routing for each circuit partition, with each partition being implemented within a separate area of an IC substrate. The method initially generates a whole-chip trial placement that tends to cluster cells of each circuit module together. An IC substrate floor plan assigning modules to various partitions is prepared, with the size, shape and relative position of each partition being determined by size, shape and relative position of areas of the substrate occupied by those modules in the trial floor plan. A trial routing is also performed with information on which to base a pin assignment plan for each module. A detailed placement and routing process is then independently performed for each partition, with placement and routing of cells within each partition constrained by the floor plan and pin assignment plan.