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Michael Hezlep Phones & Addresses

  • Milford, OH
  • 1087 Beacon St, Cincinnati, OH 45230 (513) 624-9676
  • 504 Gennie Ln, Cincinnati, OH 45244 (513) 528-3448
  • 504 Gennie Ln, Cincinnati, OH 45244 (513) 624-9676

Work

Position: Professional/Technical

Education

Degree: Associate degree or higher

Resumes

Resumes

Michael Hezlep Photo 1

Senior Electrical Engineer

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Location:
Cincinnati, OH
Industry:
Design
Work:
Oystar North America since Jul 2011
Electrical Engineer

Hixson Engineering Apr 2009 - Jul 2011
Project Engineer

3M Precision Optics Nov 2007 - Jan 2009
Specialist Electrical Engineering

3M Precision Optics Jun 2005 - Nov 2007
Senior Electrical Engineer

3M Precision Optics Jun 1993 - Jun 2005
Project Engineer, Engineering Team Leader
Education:
Ohio University 1988 - 1993
BS, Electrical Engineering
Skills:
Manufacturing
Engineering Management
Engineering
Six Sigma
Manufacturing Engineering
Robotics
Product Development
Injection Molding
Electrical Engineering
Plc
Programming
Software Installation
Product Design
Automation
Fanuc Robots
Electricians
Michael Hezlep Photo 2

Principal Engineer

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Location:
Cincinnati, OH
Work:
Intelligrated
Principal Engineer
Michael Hezlep Photo 3

Electrical Engineer At Oystar North America

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Position:
Electrical Engineer at Oystar North America
Location:
Cincinnati Area
Industry:
Design
Work:
Oystar North America since Jul 2011
Electrical Engineer

Hixson Engineering Apr 2009 - Jul 2011
Project Engineer

3M Precision Optics Nov 2007 - Jan 2009
Specialist Electrical Engineering

3M Precision Optics Jun 2005 - Nov 2007
Senior Electrical Engineer

3M Precision Optics Jun 1993 - Jun 2005
Project Engineer, Engineering Team Leader
Education:
Ohio University 1988 - 1993
BS, Electrical Engineering
Skills:
Engineering Management
Six Sigma
Engineering
Product Development
Manufacturing
PLC
Software Installation
Manufacturing Engineering
Product Design
Programming

Publications

Us Patents

Automated Polishing Apparatus And Method Of Polishing

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US Patent:
20030003847, Jan 2, 2003
Filed:
Jun 28, 2001
Appl. No.:
09/894477
Inventors:
Allen Yi - Cincinnati OH, US
Tomasz Pol - Cincinnati OH, US
Michael Hezlep - Cincinnati OH, US
Assignee:
Corning Precision Lens, Inc. - Cincinnati OH
International Classification:
B24B049/00
B24B051/00
B24B001/00
US Classification:
451/009000, 451/008000, 451/028000
Abstract:
A polishing system for polishing a surface of a substrate, such as the surface of an optical pin mold, to a desired surface finish and profile under the automated control of a computer during a polishing cycle. The polishing system includes a polishing spindle assembly that holds and rotates a polishing tool that is contacted under pressure with a surface of the mold pin. A torque sensor is associated with the polishing spindle assembly to sense a torque on the polishing tool during the polishing cycle. The polishing system further includes a feedback control system that dynamically adjusts the position of the polishing spindle assembly in response to the torque sensed by the torque sensor to maintain a substantially constant torque on the polishing tool during the polishing cycle.
Michael Patrick Hezlep from Milford, OH, age ~54 Get Report