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Markus P Hehlen

from Los Gatos, CA
Age ~58

Markus Hehlen Phones & Addresses

  • 118 Belwood Ln, Los Gatos, CA 95032
  • 118A Belwood Ln, Los Gatos, CA 95032
  • 511 Grand Canyon Dr, Los Alamos, NM 87544 (505) 672-9146
  • 404 Meadow Ln, Los Alamos, NM 87544 (505) 672-9146
  • White Rock, NM
  • Ann Arbor, MI

Work

Company: Scriptrevision Jan 2006 to Dec 2013 Position: Owner

Education

Degree: Doctorates, Doctor of Philosophy School / High School: University of Bern 1985 to 1994 Specialities: Chemistry

Skills

Physics • Chemistry • Numerical Analysis • Technology Transfer • Science • Photonics • Materials Science • R&D • Instrumentation • Materials • Spectroscopy • Simulations • Optics • Design of Experiments • Characterization • Vacuum Chambers • Engineering • Fiber Optics • Sensors • Nanotechnology • Research and Development

Ranks

Certificate: Photon Engineering, Llc

Industries

Research

Resumes

Resumes

Markus Hehlen Photo 1

Scientist 4

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Location:
Los Alamos, NM
Industry:
Research
Work:
Scriptrevision Jan 2006 - Dec 2013
Owner

Los Alamos National Laboratory Jan 2006 - Dec 2013
Scientist 4

Gemfire Corporation 1998 - 2002
Senior Research Scientist and Program Manager
Education:
University of Bern 1985 - 1994
Doctorates, Doctor of Philosophy, Chemistry
Skills:
Physics
Chemistry
Numerical Analysis
Technology Transfer
Science
Photonics
Materials Science
R&D
Instrumentation
Materials
Spectroscopy
Simulations
Optics
Design of Experiments
Characterization
Vacuum Chambers
Engineering
Fiber Optics
Sensors
Nanotechnology
Research and Development
Certifications:
Photon Engineering, Llc
Fred Optical Engineering Software

Publications

Us Patents

Doped Fiber Amplifier Utilizing Integrated Circulator Array

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US Patent:
6560387, May 6, 2003
Filed:
Feb 11, 2002
Appl. No.:
10/073754
Inventors:
Markus P. Hehlen - Los Gatos CA, 95032
William K. Bischel - Menlo Park CA, 94025
International Classification:
G02B 626
US Classification:
385 39, 372 6, 372703, 385 14, 385 11, 385 24, 385 31, 385129, 385132, 359122, 359134, 359156, 3593411, 3593412, 3593413
Abstract:
A reflective doped fiber amplifier array utilizes an integrated circulator array to effect routing of optical signals. The integrated circulator array has a plurality of waveguide pairs coupled by polarization multiplexers formed in a planar substrate, and a nonreciprocal polarization rotation element positioned between sections of the waveguide pairs. Pump light is coupled into and out of the doped fibers by wavelength-selective reflectors.

Integrated Optical Circulator Array

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US Patent:
6580842, Jun 17, 2003
Filed:
Feb 11, 2002
Appl. No.:
10/073814
Inventors:
Markus P. Hehlen - Los Gatos CA, 95032
William K. Bischel - Menlo Park CA, 94025
International Classification:
G02B 600
US Classification:
385 11, 385 24, 385 27, 385 31, 385 73, 359484, 359497, 372703
Abstract:
A circulator array is constructed in a planar substrate by forming a plurality of waveguide pair structures, each waveguide pair structure having first and second sections respectively coupled by first and second polarization multiplexers. A nonreciprocal polarization rotation element is positioned in the optical paths of the waveguide pair structures and is configured to rotate the polarization of light passing from the second sections of the waveguides to the first sections while leaving unchanged the polarization of light passing from the first sections to the second sections, such that optical signals received at one port of the circulator structure are routed along a predetermined path to another port of the circulator structure.

Multi-Channel Laser Pump Source For Optical Amplifiers

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US Patent:
7235150, Jun 26, 2007
Filed:
Jul 23, 2004
Appl. No.:
10/898537
Inventors:
William K. Bischel - Menlo Park CA, US
David K. Wagner - San Jose CA, US
Harald Guenther - Los Gatos CA, US
Simon J. Field - Palo Alto CA, US
Markus P. Hehlen - Los Gatos CA, US
Richard B. Tompane - Los Altos CA, US
Andrew T. Ryan - Sunnyvale CA, US
C. Geoffrey Fanning - Hillsboro OR, US
Jim W. Li - Fremont CA, US
Nina D. Morozova - San Jose CA, US
Assignee:
Gemfire Corporation - Fremont CA
International Classification:
B32B 37/10
US Classification:
156212, 156300, 156299, 156298, 156297
Abstract:
An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Multi-Channel Laser Pump Source For Optical Amplifiers

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US Patent:
7653109, Jan 26, 2010
Filed:
Jun 25, 2007
Appl. No.:
11/768150
Inventors:
William K. Bischel - Menlo Park CA, US
David K. Wagner - San Jose CA, US
Harald Guenther - Los Gatos CA, US
Simon J. Field - Palo Alto CA, US
Markus P. Hehlen - Los Gatos CA, US
Richard B. Tompane - Los Altos CA, US
Andrew T. Ryan - Sunnyvale CA, US
C. Geoffrey Fanning - Hillsboro OR, US
Jim W. Li - Fremont CA, US
Nina D. Morozova - San Jose CA, US
Assignee:
Gemfire Corporation - Fremont CA
International Classification:
H01S 5/00
US Classification:
372 5012, 156212
Abstract:
An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Integrated Optical Isolator Array

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US Patent:
7263247, Aug 28, 2007
Filed:
Feb 11, 2002
Appl. No.:
10/073763
Inventors:
Markus P. Hehlen - Los Gatos CA, US
William K. Bischel - Menlo Park CA, US
Assignee:
Gemfire Corporation - Fremont CA
International Classification:
G02B 6/12
G02B 6/28
US Classification:
385 14, 385 24
Abstract:
An integrated isolator array is provided having a plurality of waveguides fabricated in a planar optical substrate, each waveguide having input and output sections. An isolator subassembly is received within a transverse trench formed in the substrate between the input and output sections such that it intersects the optical paths of the waveguides. The isolator subassembly, which may consist of layers of Faraday rotator material sandwiched between layers of birefringent crystal material, permits the forward passage of light from the input sections to the output sections of the waveguides while preventing the backward passage of light from the output to the input sections. Each waveguide input section is preferably adapted with a mode-expanding input taper to collimate light propagating through the waveguide. Similarly, each output section is preferably adapted with a mode-reducing output taper to reduce the mode size of forward-traveling light to match that of an output fiber, as well as to collimate light traveling backward within the output section.

Optically Integrating Pixel Microstructure

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US Patent:
20020003928, Jan 10, 2002
Filed:
Dec 15, 2000
Appl. No.:
09/738607
Inventors:
William Bischel - Menlo Park CA, US
David Deacon - Los Altos CA, US
Nigel Cockroft - Los Gatos CA, US
Markus Hehlen - Los Gatos CA, US
David Wagner - San Jose CA, US
Richard Tompane - Los Altos CA, US
Simon Field - Palo Alto CA, US
Assignee:
Gemfire Corporation
International Classification:
G02B006/26
US Classification:
385/039000, 385/027000, 385/047000
Abstract:
An integrated optical microstructure includes a substrate carrying an optical waveguide and supporting a medium disposed to receive optical energy from the waveguide. The medium includes an optical re-radiator such as a phosphor, which re-radiates optical energy in response to optical energy received from the waveguide. The structure further includes a reflector disposed to redirect some of the input optical energy emanating from the medium back into the medium, to achieve spatial confinement of the input light delivered by the input waveguide. The structure can thereby increase the efficiency of the light conversion processes of re-radiating materials. An aperture in the reflector permits optical energy emitted by the re-radiator to emerge from the structure and to propagate in a preferred direction, such as toward a viewer or sensor. The structure is useful for increasing the brightness of various kinds of small emissive elements which are excited by light delivered from an integrated optical waveguide, including pixels in an information display.

Multi-Channel Laser Pump Source For Optical Amplifiers

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US Patent:
20020110328, Aug 15, 2002
Filed:
Feb 14, 2001
Appl. No.:
09/784687
Inventors:
William Bischel - Menlo Park CA, US
David Wagner - San Jose CA, US
Harald Guenther - Los Gatos CA, US
Simon Field - Palo Alto CA, US
Markus Hehlen - Los Gatos CA, US
Richard Tompane - Los Altos CA, US
Andrew Ryan - Sunnyvale CA, US
C. Fanning - Hillsboro OR, US
Jim Li - Fremont CA, US
Nina Morozova - San Jose CA, US
International Classification:
G02B006/30
US Classification:
385/049000, 385/089000, 385/027000, 372/070000
Abstract:
An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Multi-Channel Laser Pump Source For Optical Amplifiers

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US Patent:
20040105611, Jun 3, 2004
Filed:
Jul 9, 2003
Appl. No.:
10/616008
Inventors:
William Bischel - Menlo Park CA, US
David Wagner - San Jose CA, US
Harald Guenther - Los Gatos CA, US
Simon Field - Palo Alto CA, US
Markus Hehlen - Los Gatos CA, US
Richard Tompane - Los Altos CA, US
Andrew Ryan - Sunnyvale CA, US
C. Fanning - Hillsboro OR, US
Jim Li - Fremont CA, US
Nina Morozova - San Jose CA, US
Assignee:
Gemfire Corporation
International Classification:
G02B006/12
US Classification:
385/014000
Abstract:
An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
Markus P Hehlen from Los Gatos, CA, age ~58 Get Report