Marijan D Grgas

6700913, Mar 2, 2004

May 29, 2001

09/867042

George G. Pinneo - Manhattan Beach CA
Marijan D. Grgas - Rancho Palos Verdes CA
Kriss A. Bennett - Long Beach CA

Northrop Grumman Corporation - Los Angeles CA

H01S 500

372 43, 372 50, 372 66, 372 75, 372 88, 372 36

A semiconductor laser diode array including a plurality of laser diode bars, each carried by a submount and forming a subassembly. Each subassembly is separated by a flexible or compliant electrically conductive spacer. All connections within the array are by way of a non-fluxed solder, that may be hard and/or soft, reflowed in a non-oxidizing atmosphere in a simple mechanical stack fixture to create nearly void-free solder joints with relatively high thermal integrity and electrical conductivity. Flexible electrically conductive spacers are disposed between the subassemblies to eliminate tensile stress on the laser diode bars while providing electrical conductivity between subassemblies. The subassemblies are carried by a thermally conductive dielectric substrate, allowing waste heat generated from the bars to be conducted to a cooling device. The invention eliminates known failure modes in interconnections, minimizing tensile strength on the diode arrays, and increasing the useful life of the array.

20120152454, Jun 21, 2012

Dec 9, 2011

13/315590

Steven J. Mass - La Palma CA, US
Anthony L. Long - Redondo Beach CA, US
Mansoor K. Siddiqui - Torrance CA, US
Marijan D. Grgas - Rancho Palos Verdes CA, US
Gershon Akerling - Culver City CA, US

G02B 6/10
B22D 19/00
B32B 38/08
B29C 70/00
H01L 23/06
H05K 7/20

156280, 174565, 174547, 361714, 264259, 164 98

An electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled.

52236722, Jun 29, 1993

Jun 11, 1990

7/535628

George G. Pinneo - Manhattan Beach CA
Marijan D. Grgas - San Pedro CA

TRW Inc. - Redondo Beach CA

H01L 2302
H01B 1726

174 524

A hybrid package in which Kovar feedthroughs are friction welded to an aluminum housing. Friction welding produces a very strong weld joint which resists the thermal stresses induced between the aluminum housing and Kovar feedthroughs by the large difference in their coefficients of thermal expansion. Friction welding also produces a very small heat affected zone, while brazing, soldering and other types of welding produce large heat affected zones which can cause annealing problems. The aluminum package is easy to machine, light in weight and provides good heat dissipation for the hybrid microcircuits in the package.

20190081381, Mar 14, 2019

Oct 2, 2018

16/149672

- Falls Church VA, US
Anthony L. Long - Redondo Beach CA, US
Mansoor K. Siddiqui - Torrance CA, US
Marijan D. Grgas - Rancho Palos Verdes CA, US
Gershon Akerling - Culver City CA, US

H01P 11/00
H01P 3/12
H01P 3/08
H01P 3/06

A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.

20160149286, May 26, 2016

Feb 2, 2016

15/013551

- Falls Church VA, US
Anthony L. Long - Redondo Beach CA, US
Mansoor K. Siddiqui - Torrance CA, US
Marijan D. Grgas - Rancho Palos Verdes CA, US
Gershon Akerling - Culver City CA, US

H01P 11/00

A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.