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Marcelino Essien

from Cedar Crest, NM
Age ~64
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Connected to:
Adwoba A Essien, 47Aniedi G Essien, 52Crystal M Essien, 41Ekomobong E Essien, 36Ime E Essien, 48Koko A Essien, 58Kweku P Essien, 48Mary E Essien, 54Seth Essien, 44Stephen J Essien, 69

Marcelino Essien Phones & Addresses

  • 61 Manana Dr, Cedar Crest, NM 87008 (505) 286-5872
  • Albuquerque, NM
  • 61 Manana Dr, Cedar Crest, NM 87008

Work

Position: Professional/Technical

Education

Degree: Graduate or professional degree

Publications

Us Patents

Apparatuses And Method For Maskless Mesoscale Material Deposition

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US Patent:
7045015, May 16, 2006
Filed:
Jan 17, 2003
Appl. No.:
10/346935
Inventors:
Michael J. Renn - Hudson WI, US
Bruce H. King - Albuquerque NM, US
Marcelino Essien - Cedar Crest NM, US
Lemna J. Hunter - Corrales NM, US
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
B05C 11/06
US Classification:
118686, 118 62, 118 63, 118500
Abstract:
Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100 C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

Laser Processing For Heat-Sensitive Mesoscale Deposition

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US Patent:
7294366, Nov 13, 2007
Filed:
Sep 27, 2004
Appl. No.:
10/952108
Inventors:
Michael J. Renn - Hudson WI, US
Bruce H. King - Albuquerque NM, US
Marcelino Essien - Cedar Crest NM, US
Manampathy G. Giridharan - Mason OH, US
Jyh-Cherng Sheu - Hsinchu, TW
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
B05D 3/06
US Classification:
427554, 427226, 4273722, 427596
Abstract:
A method of depositing various materials onto heat-sensitive targets. Heat-sensitive targets are generally defined as targets that have thermal damage thresholds that are lower than the temperature required to process a deposited material. The invention uses precursor solutions and/or particle or colloidal suspensions, along with optional pre-deposition treatment and/or post-deposition treatment to lower the laser power required to drive the deposit to its final state. The present invention uses Maskless Mesoscale Material Deposition (MD™) to perform direct deposition of material onto the target in a precise, highly localized fashion. Features with linewidths as small as 4 microns may be deposited, with little or no material waste. A laser is preferably used to heat the material to process it to obtain the desired state, for example by chemical decomposition, sintering, polymerization, and the like. This laser processing may be performed in an ambient environment with laser powers of less than 100 milliwatts.

Apparatuses And Methods For Maskless Mesoscale Material Deposition

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US Patent:
7485345, Feb 3, 2009
Filed:
Dec 22, 2005
Appl. No.:
11/317457
Inventors:
Michael J. Renn - Hudson WI, US
Bruce H. King - Albuquerque NM, US
Marcelino Essien - Cedar Crest NM, US
Gregory J. Marquez - Albuquerque NM, US
Manampathy G. Giridharan - Mason OH, US
Jyh-Cherng Sheu - Hsinchu, TW
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
B05D 5/00
US Classification:
4274211, 4274274, 427101, 427384
Abstract:
Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100 C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

Aerodynamic Jetting Of Aerosolized Fluids For Fabrication Of Passive Structures

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US Patent:
7674671, Mar 9, 2010
Filed:
Dec 12, 2005
Appl. No.:
11/302481
Inventors:
Michael J. Renn - Hudson WI, US
Marcelino Essien - Cedar Crest NM, US
Bruce H. King - Albuquerque NM, US
Jason A. Paulsen - Centerville MN, US
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
H01L 21/8234
US Classification:
438238, 438382, 438763, 438782
Abstract:
Method and apparatus for direct writing of passive structures having a tolerance of 5% or less in one or more physical, electrical, chemical, or optical properties. The present apparatus is capable of extended deposition times. The apparatus may be configured for unassisted operation and uses sensors and feedback loops to detect physical characteristics of the system to identify and maintain optimum process parameters.

Annular Aerosol Jet Deposition Using An Extended Nozzle

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US Patent:
7938079, May 10, 2011
Filed:
Dec 13, 2004
Appl. No.:
11/011366
Inventors:
Bruce H. King - Albuquerque NM, US
Michael J. Renn - Hudson WI, US
Marcelino Essien - Cedar Crest NM, US
Gregory J. Marquez - Albuquerque NM, US
Manampathy G. Giridharan - Mason OH, US
Jyh-Cherng Sheu - Hsinchu, TW
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
B05C 5/00
B05C 19/00
F23D 11/10
US Classification:
118300, 118308, 239418, 239601
Abstract:
Method and apparatus for improved maskless deposition of electronic and biological materials using an extended nozzle. The process is capable of direct deposition of features with linewidths varying from a few microns to a fraction of a millimeter, and can be used to deposit features on targets with damage thresholds near 100 C. or less. Deposition and subsequent processing may be performed under ambient conditions and produce linewidths as low as 1 micron, with sub-micron edge definition. The extended nozzle reduces particle overspray and has a large working distance; that is, the orifice to target distance may be several millimeters or more, enabling direct write onto non-planar surfaces. The nozzle allows for deposition of features with linewidths that are approximately as small as one-twentieth the size of the nozzle orifice diameter, and is preferably interchangeable, enabling rapid variance of deposited linewidth.

Apparatuses And Methods For Maskless Mesoscale Material Deposition

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US Patent:
7987813, Aug 2, 2011
Filed:
Jan 6, 2009
Appl. No.:
12/349279
Inventors:
Michael J. Renn - Hudson WI, US
Bruce H. King - Albuquerque NM, US
Marcelino Essien - Cedar Crest NM, US
Gregory J. Marquez - Albuquerque NM, US
Manampathy G. Giridharan - Mason OH, US
Jyh-Cherng Sheu - Hsinchu, TW
Assignee:
Optomec, Inc. - Albuquerque NM
International Classification:
B05C 11/00
B05C 11/06
B05B 1/08
B05B 5/00
US Classification:
118686, 118 62, 118 63, 118500, 118641, 118642, 2391022, 239338
Abstract:
Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100 C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

Laser Processing For Heat-Sensitive Mesoscale Deposition Of Oxygen-Sensitive Materials

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US Patent:
8110247, Feb 7, 2012
Filed:
May 8, 2006
Appl. No.:
11/430636
Inventors:
Michael J. Renn - Hudson WI, US
Bruce H. King - Albuquerque NM, US
Marcelino Essien - Cedar Crest NM, US
Manampathy G. Giridharan - Mason OH, US
Jyh-Cherng Sheu - Hsinchu, TW
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
B41J 2/015
US Classification:
427 961, 427508, 427553, 427554, 428901
Abstract:
A method of depositing various materials onto heat-sensitive targets, particularly oxygen-sensitive materials. Heat-sensitive targets are generally defined as targets that have thermal damage thresholds that are lower than the temperature required to process a deposited material. The invention uses precursor solutions and/or particle or colloidal suspensions, along with optional pre-deposition treatment and/or post-deposition treatment to lower the laser power required to drive the deposit to its final state. The present invention uses Maskless Mesoscale Material Deposition (MD™) to perform direct deposition of material onto the target in a precise, highly localized fashion. Features with linewidths as small as 4 microns may be deposited, with little or no material waste. A laser is preferably used to heat the material to process it to obtain the desired state, for example by chemical decomposition, sintering, polymerization, and the like. This laser processing may be performed in an ambient environment with laser powers of less than 100 milliwatts.

Apparatuses And Methods For Maskless Mesoscale Material Deposition

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US Patent:
8455051, Jun 4, 2013
Filed:
Dec 22, 2010
Appl. No.:
12/976906
Inventors:
Michael J. Renn - Hudson WI, US
Bruce H. King - Albuquerque NM, US
Marcelino Essien - Cedar Crest NM, US
Gregory J. Marquez - Albuquerque NM, US
Manampathy G. Giridharan - Mason OH, US
Jyh-Cherng Sheu - Hsinchu City, TW
Assignee:
Optomec, Inc. - Albuquerque NM
International Classification:
B05D 5/12
US Classification:
427256, 427 58, 427 984, 427102
Abstract:
Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100 C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.
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Marcelino Essien from Cedar Crest, NM, age ~64 Get Report