Inventors:
James R. Ronemus - Lehighton PA
Lowell Sentman - Catasauqua PA
William R. Wanesky - Wescosville PA
Assignee:
AT&T Technologies, Inc. - New York NY
International Classification:
G01N 308
Abstract:
The bond strength of electrical leads (12) bonded to a device (13), such as a silicon integrated circuit chip, is tested by mounting the device (13) onto a pedestal (22) and then pulling on such lead with a freely manipulatable grasping tool (52). The pedestal (22) is coupled to a load sensitive mechanism, such as a simple balance arm (19), or a movable element (21) coupled to a load cell (56). Such mechanism is adjusted to register that part of the pulling force exerted by the grasping tool (52), which is transmitted through the interface between the lead (12) and the device (13).