Resumes
Resumes
Do Shin Phones & Addresses
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568 Reed Rd #1, Broomall, PA 19008
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4139 W Pico Blvd, Los Angeles, CA 90019
Publications
Wikipedia
Us Patents
Low Cost, Pilotless, Feed Forward Compensation For A Power Amplifier
View pageUS Patent:
6531918, Mar 11, 2003
Filed:
Nov 10, 1998
Appl. No.:
09/189642
Inventors:
Richard D. Posner - Woodland Hills CA
Charles R. Gentzler - Thousand Oaks CA
Kwang Kim - Northridge CA
Do B. Shin - Laguna Hills CA
Charles R. Gentzler - Thousand Oaks CA
Kwang Kim - Northridge CA
Do B. Shin - Laguna Hills CA
Assignee:
Powerwave Technologies, Inc. - Santa Ana CA
International Classification:
H03F 126
US Classification:
330151, 330149
Abstract:
The invention relates to a low cost feed forward RF power amplifier arrangement for amplifying an RF input signal using a main power amplifier operating as a class A/B amplifier. The method and apparatus modify the input signal to the main amplifier to compensate for the distortion added by the main power amplifier. The circuit provides for injecting a delayed version of the input signal, through a fixed gain-phase circuity, at a point whereby the resulting signal is amplified by the error amplifier of the second loop. A digitally controlled processor iteratively modifies various phase and gain controls to adjust the output of the amplifier. Different gain and phase control lines are iteratively updated at different rates.
Wide Frequency Band Transition Between Via Rf Transmission Lines And Planar Transmission Lines
View pageUS Patent:
59306653, Jul 27, 1999
Filed:
Dec 5, 1997
Appl. No.:
8/985750
Inventors:
Ching-Fai Cho - Tujunga CA
Helmut Carl Maiershofer - Valencia CA
Do Bum Shin - Santa Clarita CA
Avery Yee Quil - Simi Valley CA
Helmut Carl Maiershofer - Valencia CA
Do Bum Shin - Santa Clarita CA
Avery Yee Quil - Simi Valley CA
Assignee:
ITT Industries, Inc. - White Plains NY
International Classification:
H01L 2144
US Classification:
438612
Abstract:
A multi-layer circuit structure including a plurality of substrate layers. At least one planar transmission line, including microstrip, stripline, or coplanar line, disposed on the plurality of substrate layers. A via transmission line connected to that at least one planar transmission line and extending through the plurality of substrate layers. The via transmission lines having the same topology as the at least one planar transmission line for providing wide frequency band transition between the via transmission lines and the at least one planar transmission line.
Feedforward Amplification System Having Mask Detection Compensation
View pageUS Patent:
61442550, Nov 7, 2000
Filed:
Oct 19, 1998
Appl. No.:
9/174640
Inventors:
Sandip Patel - Costa Mesa CA
Wayne Roberts - Tustin CA
Kwang Kim - Northridge CA
Stefan Klein - Lake Forest CA
Richard D. Posner - Woodland Hills CA
Do B. Shin - Laguna Hills CA
Wayne Roberts - Tustin CA
Kwang Kim - Northridge CA
Stefan Klein - Lake Forest CA
Richard D. Posner - Woodland Hills CA
Do B. Shin - Laguna Hills CA
Assignee:
Powerwave Technologies, Inc. - Irvine CA
International Classification:
H03F 100
US Classification:
330151
Abstract:
A method and apparatus for reducing out-of-band frequency components of an RF amplified input signal, the amplified signal having both in-band frequency components and out-of-band frequency components, employ a feedforward network in which a microprocessor can sweep a frequency generator output connected to a mixer, the other input of the mixer being the amplified output, to find the carrier frequency of the input signal, and thereafter modify or control the feedforward circuit to reduce out-of-band frequency component energies in a particular manner. For example, gain and phase of a variable gain-phase network in a feedforward circuit structure can be modified for reducing the out-of-band frequency component energy.
Wide Frequency Band Transition Between Via Rf Transmission Lines And Planar Transmission Lines
View pageUS Patent:
57572526, May 26, 1998
Filed:
Jun 11, 1996
Appl. No.:
8/661557
Inventors:
Ching-Fai Cho - Tujunga CA
Helmut Carl Maiershofer - Valencia CA
Do Bum Shin - Santa Clarita CA
Avery Yee Quil - Simi Valley CA
Helmut Carl Maiershofer - Valencia CA
Do Bum Shin - Santa Clarita CA
Avery Yee Quil - Simi Valley CA
Assignee:
ITT Industries, Inc. - White Plains NY
International Classification:
H01P 308
H01P 500
H05K 111
H01P 500
H05K 111
US Classification:
333246
Abstract:
A multi-layer circuit structure including a plurality of substrate layers. At least one planar transmission line, including microstrip, stripline, or coplanar line, disposed on the plurality of substrate layers. A via transmission line connected to that at least one planar transmission line and extending through the plurality of substrate layers. The via transmission lines having the same topology as the at least one planar transmission line for providing wide frequency band transition between the via transmission lines and the at least one planar transmission line.