Khalil N Nikmanesh

6411521, Jun 25, 2002

Aug 28, 2000

09/649369

Khalil N. Nikmanesh - Broomfield CO

Avaya Inc. - Basking Ridge NJ

H05K 114

361799, 361752, 361759, 361801, 174 51, 439108

Allowing printed circuit boards to be secured in a printed circuit carrier by means of a retaining bar that is secured at its ends to the printed circuit board carrier. Contact is established between the retaining bar and each individual printed circuit board by depositing a copper area on the back face of the printed circuit board and making contact with this area by the retaining bar. The conductive area is connected to the ground of the printed circuit board, and the retaining bar is conductive in nature and makes contact at either end with the printed circuit board carrier. The retaining bar is designed to provide vertical strength throughout its length.

6587580, Jul 1, 2003

May 6, 1999

09/306590

Khalil N. Nikmanesh - Broomfield CO

Avaya Technology Corp. - Basking Ridge NJ

G06K 900

382145, 382146, 382149, 382156

A system for determining the optimal settings for parameter of a stencil printing machine. The system generates a model mapping parameter inputs to output results. The model is then used to determine the optimal settings of parameter inputs in order to produce the desired results. One form of mapping is to generate a neural network model of a system. The neural network is generated from data that includes multiple sets of input parameter settings and the resulting output associated with the inputs. Back propagation is then performed on the neural network to determine the optimal settings.

55302025, Jun 25, 1996

Jan 9, 1995

8/370040

Jack L. Dais - Lakewood CO
Khalil N. Nikmanesh - Broomfield CO

AT&T Corp. - Murray Hill NJ

H05K 900

174 35R

A metallic RF or thermal shield (200, 200', 200") has a non-perforated area (202) around its center of mass, of a radius (203) sufficient for pick-up and placement of the shield by automatic vacuum pick-up equipment during automated surface-mount circuit assembly.

61828831, Feb 6, 2001

Jul 8, 1998

9/112031

Khalil N. Nikmanesh - Broomfield CO

Lucent Technologies Inc. - Murray Hill NJ

B23K 108
B23K 3706
B23K 100
B23K 500

228 33

The precise solder paste application process makes use of mask registration apertures that are formed in the printed circuit board and that are adapted to receive a component solder paste mask that conforms to the conductor pattern of the component to be replaced. The component solder paste mask comprises a mask that has formed therein apertures that correspond to the pattern of solder paste that is to be applied to the printed circuit board surface mount pads to correspond to the conductors of the component. The component solder paste mask includes registration features that mate with the registration apertures formed in the printed circuit board to thereby ensure precise placement of the component solder paste mask over the area of the printed circuit board that receives the replacement component. The repair person can therefore simply and precisely place the component solder paste mask on the printed circuit board, apply the solder paste to the printed circuit surface mount pads exposed through the apertures formed in the component solder paste mask and thereby ensure that the pattern of solder paste precisely corresponds to the printed circuit board surface mount pads. This ensures that the component, when placed on the printed circuit board surface mount pads, can be soldered to these surface mount pads without solder overflow.