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Kevin Lammi Phones & Addresses

  • Chicago, IL
  • Mountain View, CA
  • San Jose, CA
  • Minneapolis, MN
  • Blaine, MN

Work

Company: Emerson process management Jun 2011 Position: Component engineer, rosemount

Education

Degree: Electrical Engineering School / High School: University of Minnesota-Twin Cities 2007 to 2011 Specialities: Engineering

Skills

Electrical Engineering • Power Systems • Passive Components • Energy • Root Cause Analysis • Product Development • Counterfeit Component Prevention • Dmaic • Cross Functional Coordination • Engineering Change Management • Microelectronic Packaging • Wearable Electronics • Component Miniaturization • Microelectronics • Automation • Electricians • Continuous Improvement • Engineering

Ranks

Certificate: Emerson Process Management

Interests

Children • Education

Industries

Utilities

Resumes

Resumes

Kevin Lammi Photo 1

Component Engineer, Hardware

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Location:
800 High School Way, Mountain View, CA 94041
Industry:
Utilities
Work:
Emerson Process Management since Jun 2011
Component Engineer, Rosemount

Xcel Energy Jun 2009 - May 2011
Distribution Engineer

University of Minnesota Jun 2008 - Sep 2008
Undergraduate Reseacher
Education:
University of Minnesota-Twin Cities 2007 - 2011
Electrical Engineering, Engineering
Skills:
Electrical Engineering
Power Systems
Passive Components
Energy
Root Cause Analysis
Product Development
Counterfeit Component Prevention
Dmaic
Cross Functional Coordination
Engineering Change Management
Microelectronic Packaging
Wearable Electronics
Component Miniaturization
Microelectronics
Automation
Electricians
Continuous Improvement
Engineering
Interests:
Children
Education
Certifications:
Emerson Process Management
Dakota County Technical College
University of Maryland Calce
Esda
Six Sigma Yellow Belt Training
Lean Advocate
Ipc-A-610
Workshop: Counterfeit Part Avoidance and Detection
Through Hole Solder Joint Workmanship Standards
Surface Mount Solder Joint Workmanship Standards
Esd Control For Electronics Assembly

Publications

Us Patents

Hearing Assistance Device Incorporating System In Package Module

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US Patent:
20180098162, Apr 5, 2018
Filed:
Oct 4, 2016
Appl. No.:
15/285299
Inventors:
- Eden Prairie MN, US
Douglas F. Link - Plymouth MN, US
Shawn Mahon - Howard Lake MN, US
Kevin Lammi - Minneapolis MN, US
International Classification:
H04R 25/00
Abstract:
A hearing assistance device comprises a system in package (SIP) disposed within an enclosure. The SIP module comprises a first substrate having a first surface and an opposing second surface, the first substrate supporting a first subsystem configured to perform a first function. A second substrate has a first surface and an opposing second surface, the second substrate supporting a second subsystem configured to perform a second function. The second surfaces face each other and at least one of the second surfaces supports one or more components. An interconnect layer is separate from and bonded to and between the first and second substrates. The interconnect layer comprises a window and a region peripheral to the window. The window is sized to accommodate the one or more components and the peripheral region comprising electrical pathways for electrically connecting the first subsystem and the second subsystem.
Kevin R Lammi from Chicago, IL, age ~35 Get Report