Ken K Liu

58412913, Nov 24, 1998

Dec 12, 1996

8/764511

Ken Kuang-Fu Liu - Saratoga CA
Robert John Moti - San Jose CA
Syed A. Husain - Milpitas CA

MicroModule Systems - Cupertino CA

G01R 3102

324755

First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester structure. Second and third conductive regions are electrically connected respectively to the power and ground terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region to filter high-frequency noise components from power and ground potentials provided by the power source.

58475710, Dec 8, 1998

Jul 3, 1996

8/675416

Ken Kuang-Fu Liu - Saratoga CA
Kunio Sano - Yamanashi, JP
Takashi Sato - Nirasaki, JP

MicroModule Systems - Cupertino CA

G01R 1073

324754

First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester. A probe frame is bonded to the substrate between connector frames bonded at opposite ends of the substrate. Alternatively, a pair of bumps exposed on the same surface of a flexible substrate are electrically connected at different positions along a conductive run. One of the bumps is oriented for contact with a pad of a die under test, and the other is in contact with a pad on a surface of a printed circuit board directed away from the die. The pad of the printed circuit board is provided for electrical connection to a tester.