Kedar V Bhatawadekar

20130286700, Oct 31, 2013

Apr 25, 2012

13/456100

Kaochi Im - Bothell WA, US
Kedar V. Bhatawadekar - Santa Clara CA, US
Jianhua Chen - Sunnyvale CA, US
Matthew P. Galla - Holly Springs NC, US
Patrick J. Hibbs - Murphy TX, US

Tyco Electronics Corporation - Berwyn PA

H02M 7/06

363126

A controller circuit for activating and deactivating an electrical power converter that provides power to a device includes power input terminals on a primary side, and power output terminals on a secondary side, which are configured to provide power to the device. The controller circuit includes a detection circuit configured to determine whether the device is connected and, if connected, causes power to be routed to the electrical power converter to activate the electrical power converter. When the device is not detected, the electrical power converter is deactivated until the device is reconnected.

20130286701, Oct 31, 2013

Apr 25, 2012

13/456106

Kaochi Im - Bothell WA, US
Kedar V. Bhatawadekar - Santa Clara CA, US
Jianhua Chen - Sunnyvale CA, US
Matthew P. Galla - Holly Springs NC, US
Patrick J. Hibbs - Murphy TX, US

Tyco Electronics Corporation - Berwyn PA

H02M 7/06

363126

A controller circuit for activating and deactivating an electrical power converter that provides power to a device includes power input terminals on a primary side, and power output terminals on a secondary side, which are configured to provide power to the device. The controller circuit includes a detection circuit configured to determine whether the device is connected and, if connected, causes power to be routed to the electrical power converter to activate the electrical power converter. When the device is not detected, the electrical power converter is deactivated until the device is reconnected.

20200355736, Nov 12, 2020

May 9, 2019

16/407624

- Chicago IL, US
Martin Pineda - Fremont CA, US
Kedar V. Bhatawadekar - Santa Clara CA, US

Littelfuse, Inc. - Chicago IL

G01R 31/07
G01R 31/02
H02H 9/02
H01C 1/14
H01C 1/144

A circuit protection device including a primary fuse, and a positive temperature coefficient (PTC) device and a secondary fuse electrically connected in series with one another and in parallel with the primary fuse, the secondary fuse formed of a quantity of solder disposed on a dielectric surface, wherein the dielectric surface exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the dielectric surface to create a galvanic opening.

20190222100, Jul 18, 2019

Jan 11, 2019

16/245538

- Chicago IL, US
Kedar Bhatawadekar - Santa Clara CA, US
Martin Pineda - Fremont CA, US
Werner Johler - Samstagern, CH

Littelfuse, Inc. - Chicago IL

H02K 11/02
H01G 7/06
H02H 7/085
H01C 7/02

A protection device may include a resistor, the resistor including a first end for coupling between a load and a second end for coupling to a DC source. The protection device may also include a capacitor having a first terminal coupled between the second end of the resistor and the DC source, and a second terminal coupled to ground, the capacitor further comprising a capacitor body, wherein the capacitor body comprises a ferroelectric material.

20190131039, May 2, 2019

Nov 2, 2017

15/801689

- Chicago IL, US
Kedar Bhatawadekar - Santa Clara CA, US
Dong Yu - Fremont CA, US

Littelfuse, Inc. - Chicago IL

H01C 17/00
H01C 7/02
H01C 7/13
H01C 1/14
H01C 17/28

A method of forming a positive temperature coefficient (PTC) device, the method including providing a core formed of a PTC material, the core having an electrode disposed on a first surface thereof and a second electrode disposed on a second surface thereof, connecting a first lead element to the first electrode, applying an oxygen barrier epoxy to at least portions of the core, the first electrode, the second electrode, and the first lead element, and curing the oxygen barrier epoxy to form an oxygen barrier package surrounding at least portions of the core, the first electrode, the second electrode, and the first lead element.

20180366293, Dec 20, 2018

Jun 16, 2017

15/625191

- Chicago IL, US
Kedar Bhatawadekar - Santa Clara CA, US
Dong Yu - Fremont CA, US

Littelfuse, Inc. - Chicago IL

H01H 85/055
H01H 85/048
H01H 85/165
H01H 85/02
H01H 85/143
H01H 85/20

A fuse suitable for arc quenching is disclosed. The fuse incorporates a high-resistive material or element placed in parallel relationship with the fusible element to mitigate, minimize and/or prevent arcing during an overcurrent condition. By incorporating a high-resistive material or element in parallel with a fusible element an alternate or second path for current flow during an overcurrent condition is provided. As such, during normal operating conditions, current travels through the fusible element. However, during an overcurrent condition, the resistance through the fusible element increases. Once the resistance through the fusible element is greater than the resistance through the high-resistive material or element, the current will bypass the fusible element and travel through the high-resistive material or element. In this manner, arcing through the fusible element during the overcurrent condition can be prevented or minimized.

20160104559, Apr 14, 2016

Oct 14, 2014

14/513568

Mario G. Sepulveda - Newark CA, US
Martin G. Pineda - Fremont CA, US
Anthony Vranicar - Santa Clara CA, US
Kedar V. Bhatawadekar - Santa Clara CA, US
Minh V. Ngo - San Jose CA, US
Dov Nitzan - San Jose CA, US

Tyco Electronics Corporation - Berwyn PA

H01C 17/00
H01C 1/034
H01C 7/02

A method of manufacturing a surface mount device includes forming a plaque from a material, forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. The liquid encapsulant is cured and when cured encapsulant has an oxygen permeability of less than about 0.4 cm3mm/m2atmday. The assembly is cut to provide a plurality of components. After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.

20160105965, Apr 14, 2016

Oct 14, 2014

14/513552

Mario G. Sepulveda - Newark CA, US
Martin G. Pineda - Fremont CA, US
Anthony Vranicar - Santa Clara CA, US
Kedar V. Bhatawadekar - Santa Clara CA, US
Minh V. Ngo - San Jose CA, US
Dov Nitzan - San Jose CA, US

Tyco Electronics Corporation - Berwyn PA

H05K 1/18
H05K 3/30

A method of manufacturing a surface mount device includes providing at least one core device and at least one lead frame. The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant. The encapsulant comprises a liquid epoxy that when cured has an oxygen permeability of less than approximately 0.4 cm3•mm/m2•atm•day.