Joseph M Anostario

6573342, Jun 3, 2003

Feb 21, 2002

10/079730

Navjot Singh - Hastings-on-Hudson NY
Joseph Michael Anostario - Albany NY

General Electric Company - Niskayuna NY

C08F28300

525474, 523201, 523206, 523209, 525534

Solid blends of rubbery polymers and amorphous or crystalline polymers, said blends being free-flowing at temperatures lower than the glass transition temperature or crystalline melting temperature of the amorphous or crystalline polymer, are prepared by intimate mixing procedures. In general, said mixing conditions include high shear conditions sufficient to convert polymer A to dispersed particles coated with polymer B and produce a free-flowing powder blend.

6646052, Nov 11, 2003

May 7, 2002

10/139968

Navjot Singh - Rye NY
Joseph Michael Anostario - Albany NY

General Electric Company - Niskayuna NY

C08F 800

525191, 523201, 523206, 525197, 525219, 525231, 525232, 525240, 525390, 525391

Solid blends of rubbery polymers and amorphous or crystalline polymers, said blends being free-flowing at temperatures lower than the glass transition temperature or crystalline melting temperature of the amorphous or crystalline polymer, are prepared by intimate mixing procedures. In general, said mixing conditions include high shear conditions sufficient to convert polymer A to dispersed particles coated with polymer B and produce a free-flowing powder blend.

6713532, Mar 30, 2004

Feb 28, 2003

10/377353

Navjot Singh - Rye NY
Joseph Michael Anostario - Albany NY

General Electric Company - Niskayuna NY

C08J 300

523201, 523200, 523205, 523206, 523209, 523212, 523223, 525100, 525101, 525106

Solid blends of rubbery polymers and amorphous or crystalline polymers, said blends being free-flowing at temperatures lower than the glass transition temperature or crystalline melting temperature of the amorphous or crystalline polymer, are prepared by intimate mixing procedures. In general, said mixing conditions include high shear conditions sufficient to convert polymer A to dispersed particles coated with polymer B and produce a free-flowing powder blend.

20040101688, May 27, 2004

Nov 22, 2002

10/301904

Slawomir Rubinsztajn - Niskayuna NY, US
John Campbell - Clifton Park NY, US
Joseph Anostario - Albany NY, US
Ananth Prabhakumar - Niskayuna NY, US
Donna Sherman - East Greenbush NY, US
Sandeep Tonapi - Niskayuna NY, US

B32B027/38

428/413000

A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica, cure catalyst, and optional reagents. Further embodiments of the present invention include a method for making the curable epoxy formulation and a semiconductor package comprising the curable epoxy formulation.

20040102529, May 27, 2004

Nov 22, 2002

10/301903

John Campbell - Clifton Park NY, US
Slawomir Rubinsztajn - Niskayuna NY, US
Joseph Anostario - Albany NY, US

B01F017/00

516/079000

A composition is provided in the present invention comprising functionalized colloidal silica. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. Further embodiments of the present invention include dispersions comprising the functionalized colloidal silica and methods for making.

20040138343, Jul 15, 2004

Dec 19, 2003

10/741899

John Campbell - Clifton Park NY, US
Slawomir Rubinsztajn - Niskayuna NY, US
Joseph Anostario - Albany NY, US

C01B033/12
C08K003/34
C08K009/00

523/216000, 423/335000, 524/492000

A composition is provided in the present invention comprising functionalized colloidal silica. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. Further embodiments of the present invention include dispersions comprising the functionalized colloidal silica and methods for making.

20050181214, Aug 18, 2005

Dec 7, 2004

11/006265

John Robert Campbell - Clifton Park NY, US
Slawomir Rubinsztajn - Niskayuna NY, US
Florian Johannes Schattenmann - Ballston Lake NY, US
Sandeep Shrikant Tonapi - Niskayuna NY, US
Ananth Prabhakumar - Schenectady NY, US
Wing-Keung Woo - San Ramon CA, US
Joseph Michael Anostario - Albany NY, US
Donna Marie Sherman - East Greenbush NY, US

B32B027/38
C08L063/00

428413000, 523440000

A curable epoxy formulation comprises an epoxy monomer, an epoxy oligomer, or a combination thereof; an organofunctionalized colloidal silica; a cure catalyst; and optional reagents. Further embodiments of the present invention include a method for making the curable epoxy formulation and a semiconductor package comprising the curable epoxy formulation. Embodiments of cured formulations can have low coefficients of thermal expansion and/or high glass transition temperatures.

61945188, Feb 27, 2001

Dec 22, 1998

9/218925

Navjot Singh - Clifton Park NY
Joseph Michael Anostario - Albany NY

General Electric Company - Schenectady NY

C08F 800
C08L 8300
C08L 2700
C08L 7112
C08G 6548

525191

Solid blends of rubbery polymers and amorphous or crystalline polymers, said blends being free-flowing at temperatures lower than the glass transition temperature or crystalline melting temperature of the amorphous or crystalline polymer, are prepared by intimate mixing procedures. In general, said mixing conditions include high shear conditions sufficient to convert polymer A to dispersed particles coated with polymer B and produce a free-flowing blend.