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Joseph A Abys

from Guilford, CT
Age ~71

Joseph Abys Phones & Addresses

  • 676 Nut Plains Rd, Guilford, CT 06437 (203) 533-5684 (203) 533-5874
  • 4 Blue Jay Ct, Warren, NJ 07059 (908) 580-1133 (908) 580-1184 (908) 580-4184
  • Orange, CT
  • Milford, CT
  • Bridgewater, NJ
  • North Plainfield, NJ
  • 676 Nut Plains Rd, Guilford, CT 06437 (732) 620-2890

Work

Position: Executive, Administrative, and Managerial Occupations

Business Records

Name / Title
Company / Classification
Phones & Addresses
Joseph A. Abys
ABYS CONSULTING, LLC
676 Nut Pln Rd, Guilford, CT 06437

Publications

Us Patents

Metal Article Coated With Multilayer Surface Finish For Porosity Reduction

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US Patent:
6335107, Jan 1, 2002
Filed:
Sep 23, 1999
Appl. No.:
09/404059
Inventors:
Joseph Anthony Abys - Warren NJ
Chonglun Fan - Bridgewater NJ
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
B32B 1501
US Classification:
428680, 257666, 257677, 428670, 428672, 428675, 428678, 428679, 428681, 428901, 428926, 428929, 439 55
Abstract:
In accordance with the invention, a metal substrate is coated with a multilayer surface finish comprising, in succession, an amorphous metal underlayer, a corrosion-resistent metal middle layer and one or more outer layers of precious metal. In an exemplary embodiment the metal substrate comprises copper alloy, the amorphous metal underlayer is NiâP, the middle layer is nickel and the outer layer is palladium. The resulting structure is particularly useful as an electrical connector.

Process For Synthesizing A Palladium Replenisher For Electroplating Baths

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US Patent:
6346222, Feb 12, 2002
Filed:
Jun 1, 1999
Appl. No.:
09/323607
Inventors:
Joseph Anthony Abys - Warren NJ
Conor Anthony Dullaghan - Louth, IE
Peter Epstein - Manalapan NJ
Assignee:
Agere Systems Guardian Corp. - Orlando FL
International Classification:
C01G 5500
US Classification:
423 22, 423544, 423548, 106 128, 205265
Abstract:
This invention provides a process of making a palladium replenisher comprising a complex of palladium tetraammine sulfate. The process includes distilling a palladium nitrate solution at a temperature maintained at or below about 115Â C. Palladium sulfate and ammonium hydroxide are then added to make the palladium tetraamine sulfate replenisher from solution. The replenisher of the invention is used to replenish depleted palladium during palladium electroplating to maintain the palladium concentration in the bath within from about 5 to about 10 weight percent of recommended plating bath levels.

Conformable Nickel Coating And Process For Coating An Article With A Conformable Nickel Coating

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US Patent:
6399220, Jun 4, 2002
Filed:
Mar 22, 2000
Appl. No.:
09/533001
Inventors:
Joseph Anthony Abys - Warren NJ
Chonglun Fan - Bridgewater NJ
Igor Veljko Kadija - Ridgewood NJ
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
B32B 1501
US Classification:
428675, 428679, 428929, 428935, 257677
Abstract:
The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or iron alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least about 82 degrees with a bend radius of about 100 m to about 300 m. Bending the lead frame in this manner causes surface deformations in the lead frame substrate. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 m.

Process For Making Gold Salt For Use In Electroplating

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US Patent:
6423202, Jul 23, 2002
Filed:
Jun 30, 2000
Appl. No.:
09/606957
Inventors:
Joseph Anthony Abys - Warren NJ, 07059
Joseph John Maisano - Branchburg NJ, 08876
International Classification:
C25D 348
US Classification:
205266, 205247, 106 118, 106 123
Abstract:
A process for producing sodium gold sulfite in solution is described. The sodium gold sulfite solution is useful in gold electroplating baths, and can be used in applications which require pure, soft gold deposits.

Ultra-Thin Composite Surface Finish For Electronic Packaging

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US Patent:
6452258, Sep 17, 2002
Filed:
Nov 6, 2000
Appl. No.:
09/707042
Inventors:
Joseph Anthony Abys - Warren NJ
Alan Blair - Murray Hill NJ
Chonglun Fan - Bridgewater NJ
Chen Xu - New Providence NJ
Jimmy Chun Wah Kwok - Kowloon, HK
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
H01L 23495
US Classification:
257677, 257666, 257673
Abstract:
In accordance with the invention, a packaged electronic device comprises at least one electronic device and leads sealed within a protective package. The leads comprise a conductive metal substrate having a composite metal finish with a total thickness of 1000 or less. The finish comprises, in succession from the substrate, 25-750 of palladium alloy and 5-250 of wirebondable and solderable material. The substrate is advantageously nickel-plated copper alloy or FeâNi alloy. The content of palladium in the palladium alloy coating can range from 10-95 weight percent. This finish meets requirements of wirebonding and solderability at a thickness surprisingly lower than previously used packaging finishes.

Method Of Manufacture Of Printed Wiring Boards Having Multi-Purpose Finish

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US Patent:
6517893, Feb 11, 2003
Filed:
Aug 28, 2001
Appl. No.:
09/941086
Inventors:
Joseph A. Abys - Warren NJ
Chonglun Fan - Bridgewater NJ
Brian T. Smith - Somerville NJ
Bruce F. Stacy - North Brunswick NJ
Chen Xu - New Providence NJ
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
B05D 512
US Classification:
427 96, 427118, 427125, 427405
Abstract:
A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.

Multi-Purpose Finish For Printed Wiring Boards And Method Of Manufacture Of Such Boards

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US Patent:
6534192, Mar 18, 2003
Filed:
Sep 24, 1999
Appl. No.:
09/405368
Inventors:
Joseph A. Abys - Warren NJ
Chonglun Fan - Bridgewater NJ
Brian T. Smith - Somerville NJ
Bruce F. Stacy - North Brunswick NJ
Chen Xu - New Providence NJ
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
H05K 109
US Classification:
428620, 428652, 428670, 428671, 428675, 174256
Abstract:
A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.

Copper Metallization Of Through Silicon Via

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US Patent:
7670950, Mar 2, 2010
Filed:
Aug 4, 2008
Appl. No.:
12/185641
Inventors:
Thomas B. Richardson - Killingworth CT, US
Yun Zhang - Warren NJ, US
Chen Wang - New Haven CT, US
Vincent Paneccasio, Jr. - Madison CT, US
Cai Wang - Milford CT, US
Xuan Lin - Northford CT, US
Richard Hurtubise - Clinton CT, US
Joseph A. Abys - Warren NJ, US
Assignee:
Enthone Inc. - West Haven CT
International Classification:
H01L 21/44
US Classification:
438675, 438 42, 438361, 438533, 257E21174, 257E21575, 257E21585
Abstract:
A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate comprising immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition comprising a source of copper ions, an organic sulfonic acid or inorganic acid, or one or more organic compounds selected from among polarizers and/or depolarizers, and chloride ions.

Wikipedia

New Jersey Inventors Hall of Fame

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Joseph Abys; Edwin Howard Armstrong; William O. Baker; Allen B. DuMont; Nikil S. Jayant; Henry M. Rowan. 1997. Alfred Y. Cho; James L. Flanagan; Ezra Gould ...

Joseph A Abys from Guilford, CT, age ~71 Get Report