John W Osenbach

6342442, Jan 29, 2002

Nov 20, 1998

09/197074

David L. Angst - New Tripoli PA
David Gerald Coult - Oley PA
John William Osenbach - Kutztown PA
Brian Stauffer Auker - Denver PA

Agere Systems Guardian Corp. - Orlando FL

H01L 2348

438612, 438613

An improved method and solder composition for kinetically controlled part bonding. The method involves applying at least a first chemical element layer of an intermetallic compound to a first part and applying at least a second chemical element layer of the intermetallic compound to a second part. The first and second parts are placed together so that the chemical element layers contact each other. The parts are heated from a storage temperature to a bonding temperature which is slightly above a first melting temperature that melts the chemical element layer of one of the first and second parts into a liquid mixture. The composition of liquid mixture varies with time during heating due to the formation of the intermetallic compound therein by progressive incorporation of the other one of the first and second chemical element layers into the mixture. The melting temperature of the liquid mixture increases with time as the composition changes until the melting temperature of the liquid mixture is about equal to the bonding temperature thereby soldifying the liquid mixture into a bond. The parts are then held at a holding temperature which is higher than the storage temperature to maintain diffusion of the other one of the first and second chemical element layers into the bond.

6371665, Apr 16, 2002

Jun 25, 1999

09/344656

Joseph P. Keska - Pittston Township, Luzerne County PA
Steven L. Moyer - Spring Township, Berks County PA
Mary J. Nadeau - Bethlehem PA
John William Osenbach - Kutztown PA
Renyi Yang - Santa Barbara CA

Lucent Technologies Inc. - Murray Hill NJ

G02B 636

385 93

The invention is an optoelectronic device including an optical subassembly enclosed within a plastic housing. The housing includes a wall with an aperture and a lens mounted therein. A plastic receptacle is mounted to the wall. The receptacle includes an opening which is aligned with the lens and which is capable of receiving an optical fiber so that the fiber is aligned with light emitted from the optical assembly. The receptacle is preferably mounted to the wall by means of epoxy.

6480633, Nov 12, 2002

Jun 17, 1999

09/335125

Robert McLemore Fleming - Chatham NJ
Rafael Nathan Kleiman - New York NY
John William Osenbach - Kutztown PA
Gordon Albert Thomas - Princeton NJ

Agere Systems Inc. - Orlando FL

G02F 1035

385 2, 385 8

An electro-optic device comprising an electro-optic crystal substrate, an optical waveguide path in the crystal adjacent the substrate surface and an electrode spaced from the surface by a buffer layer is provided with enhanced operating stability by forming the buffer layer of a transparent electronically conductive material. Preferred buffer materials are electronically conductive gallium-indium-oxide and electronically conductive zinc-indium-tin-oxide.

6489659, Dec 3, 2002

Apr 20, 2000

09/557015

Utpal Kumar Chakrabarti - Allentown PA
Robert Benedict Comizzoli - Belle Mead NJ
John William Osenbach - Kutztown PA
Christopher Theis - Macungie PA

Agere Systems Inc. - Allentown PA

H01L 3106

257460, 257461, 257438, 257447, 438 48, 438 91

A non-hermetic APD for operation in a moisture-containing ambient comprises an InP/InGaAsP-containing Group III-V compound semiconductor body and a p-n junction formed in the body. Typically the junction intersects a top surface of the body. A patterned dielectric layer is formed on the surface so as to cover at least those regions of the surface that are intersected by the junction. An electrode is formed in an opening in the dielectric layer so as to make electrical contact with one side of the junction. Importantly, the thickness of the dielectric layer is sufficient to reduce the leakage current through it to less than about 1 nA when the operating voltage is in the range of about 20-100 V. In accordance with a preferred embodiment, the thickness of the dielectric layer is greater than about 2 m when the applied voltage is in excess of about 20 V. Moreover, the composition of dielectric layer may be either inorganic (e. g.

6517258, Feb 11, 2003

Jun 25, 1999

09/344657

Joseph P. Keska - Pittston Township, Luzerne County PA
Steven L. Moyer - Spring Township, Berks County PA
Mary J. Nadeau - Bethlehem PA
Steven P. ONeill - Allentown PA
John William Osenbach - Kutztown PA
Duane S. Stackhouse - Lower Milford Township, Lehigh County PA
Katherine Anne Yanushefski - Hereford PA

Agere Systems Inc. - Allentown PA

G02B 636

385 92, 385 89, 385 93, 385 94

The invention is an optoelectronic device including a semiconductor photodetector enclosed within a plastic housing. The housing includes a wall with an aperture therein for receiving optical signals. The photodetector is mounted to a flexible film which is, in turn, mounted to the housing so that the photodetector is aligned with the aperture. The device may further include a receptacle mounted to the wall for receiving an optical fiber aligned with the aperture and the photodetector.

6580543, Jun 17, 2003

Dec 16, 1999

09/465468

Zhencan Frank Fan - Macungie PA
Hong-Tai Man - Bernards Township, Somerset County NJ
Arlen R. Martin - Maidencreek Township, Berks County PA
Steven L. Moyer - Spring Township, Berks County PA
Mary J. Nadeau - Bethlehem PA
Steven P. ONeill - Allentown PA
John William Osenbach - Kutztown PA
Edward A. Pitman - Grantville PA
Renyi Yang - Goleta CA
Craig A. Young - Nazareth PA

Tri Quint Technology Holding Co. - Hillsboro OR

G02B 630

359188, 359159, 359173, 385 31, 385 39, 385 88, 385 92

In accordance with the invention, a multimode optical fiber communication system is provided with offset illumination by disposing an optical pinhole adjacent an end of the multimode fiber core and offset from the center of the core. The pinhole permits direct offset illumination without the difficulty and expense of a conventional patch-cord assembly.

6623176, Sep 23, 2003

Aug 13, 2001

09/927372

Curtis A. Jack - Rockland Township PA
John W. Osenbach - Kutztown PA

Triquint Technology Holding Co. - Hillsboro OR

G02B 636

385 80, 385 78, 385 84

An optical fiber assembly including a ferrule which increases the glass transition temperature of an entire epoxy system resident within the ferrule and a method for suppressing optical instabilities of an optoelectronic package are described. One or more openings are made in a ferrule body to allow reaction gases from the epoxy caused during curing to escape, allowing a greater portion of the epoxy to fully cure, thereby raising the glass transition temperature of the epoxy system.

6770224, Aug 3, 2004

Mar 22, 2001

09/814909

Harvey Edward Bair - Chester NJ
John William Osenbach - Kutztown PA

TriQuint Technology Holding Co. - Hillsboro OR

B29D 1100

264 11, 264235, 26433112, 264346, 525537

A process for forming a polyphenylene sulfide (PPS) component is disclosed. The PPS is molded at a temperature of about 110Â C. to about 150Â C. After molding, the PPS has a morphology that is at least fifty percent polycrystalline. The component is then annealed to further increase the polycrystalline portion of the PPS morphology. To effect this increase, the component is annealed at a temperature that is at least above the glass transition temperature of the molded PPS component but below its melting temperature. The component is used in optical applications and other applications in which alignment tolerances are small.