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John J Liutkus

from Waterbury, CT
Age ~77

John Liutkus Phones & Addresses

  • 20 Edwards St, Waterbury, CT 06708 (203) 575-9170
  • Yorktown Heights, NY
  • Yorktown Hts, NY
  • 20 Edwards St, Waterbury, CT 06708

Publications

Us Patents

Coated Means For Connecting A Chip And A Card

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US Patent:
6403892, Jun 11, 2002
Filed:
Jun 24, 1996
Appl. No.:
08/669598
Inventors:
Claudius Feger - Hopewell Junction NY
Teresita Ordonez Graham - Irvington NY
Kurt Rudolph Grebe - Beacon NY
Alphonso Philip Lanzetta - Marlboro NY
John Joseph Liutkus - Yorktown Heights NY
Linda Carolyn Matthew - Peekskill NY
Michael Jon Palmer - Walden NY
Nelson Russell Tanner - Harpursville NY
Ho-Ming Tong - Yorktown Heights NY
Charles Haile Wilson - Beckley WV
Helen Li Yeh - Katonah NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 100
US Classification:
174254, 174260, 361773, 361750
Abstract:
A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.

Polysiloxane Modified Cement

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US Patent:
47807547, Oct 25, 1988
Filed:
Sep 15, 1987
Appl. No.:
7/096701
Inventors:
John J. Liutkus - Yorktown Heights NY
Caroline A. Kovac - Ridgefield CT
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 4900
H01L 2700
US Classification:
357 80
Abstract:
A cement composition containing cement, water, and a silanol terminated polysiloxane, and cured products thereof exhibiting improved thermal stability and dielectric constant.

Flex Tape Protective Coating

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US Patent:
53609468, Nov 1, 1994
Filed:
Sep 17, 1991
Appl. No.:
7/761182
Inventors:
Claudius Feger - Hopewell Junction NY
Teresita O. Graham - Irvington NY
Kurt R. Grebe - Beacon NY
Alphonso P. Lanzetta - Marlboro NY
John J. Liutkus - Yorktown Heights NY
Linda C. Matthew - Peekskill NY
Michael J. Palmer - Walden NY
Nelson R. Tanner - Harpursville NY
Ho-Ming Tong - Yorktown Heights NY
Charles H. Wilson - Beckley WV
Helen L. Yeh - Katonah NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01R 909
US Classification:
174261
Abstract:
The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.

Halogenated Polystyrenes For Electron Beam, X-Ray And Photo Resists

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US Patent:
46788506, Jul 7, 1987
Filed:
Oct 19, 1984
Appl. No.:
6/662962
Inventors:
Michael Hatzakis - Chappaqua NY
John J. Liutkus - Yorktown Heights NY
Jane M. Shaw - Ridgefield CT
Assignee:
International Business Machines Corp. - Armonk NY
International Classification:
C08F 1402
C08F 1416
US Classification:
526293
Abstract:
Poly(halogenated styrene) compositions having a molecular weight range of from about 1. times. 10. sup. 5 to 1. times. 10. sup. 6 and a dispersivity of from about 1. 5 to about 2. 5 useful as negative resists.

High Density, High Performance Memory Circuit Package

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US Patent:
52688151, Dec 7, 1993
Filed:
Jul 30, 1992
Appl. No.:
7/922257
Inventors:
Thomas M. Cipolla - Katonah NY
Paul W. Coteus - Yorktown Heights NY
Brian C. Derdall - North York, CA
Christina M. Knoedler - Peekskill NY
Alphonso P. Lanzetta - Marlboro NY
John J. Liutkus - Yorktown Heights NY
Linda C. Matthew - Peekskill NY
Lawrence S. Mok - Brewster NY
Irene A. Sterian - Toronto, CA
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 720
US Classification:
361704
Abstract:
A high density circuit package includes a pair of planar packages, the planar packages exhibiting front and back surfaces and positioned back-to-back in the high density circuit package. Each planar package includes a flexible circuit carrier having a plurality of circuit chips mounted thereon. Front and back planar metallic heat sinks sandwich the circuit carriers, at least one of the heat sinks contacting a surface of the chips mounted on the sandwiched circuit carriers. Each heat sink is provided with air flow apertures formed in its planar surface and adjacent to each circuit chip. A circuit card interconnects with the circuit carriers in an interconnection region and is pluggable into a female connector. The planar metallic heat sinks and circuit carriers are mechanically packaged so as to provide a planar arrangement which aligns the apertures in both the front and rear heat sinks. A pair of planar packages are mechanically connected in a back-to-back arrangement so that the apertures therebetween are aligned.

Method Of Applying Flex Tape Protective Coating Onto A Flex Product

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US Patent:
55466559, Aug 20, 1996
Filed:
Oct 25, 1994
Appl. No.:
8/329066
Inventors:
Claudius Feger - Hopewell Junction NY
Teresita O. Graham - Irvington NY
Kurt R. Grebe - Beacon NY
Alphonso P. Lanzetta - Marlboro NY
John J. Liutkus - Yorktown Heights NY
Linda C. Matthew - Peekskill NY
Michael J. Palmer - Walden NY
Nelson R. Tanner - Harpursville NY
Ho-Ming Tong - Yorktown Heights NY
Charles H. Wilson - Beckley WV
Helen L. Yeh - Katonah NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 302
US Classification:
29846
Abstract:
A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.
John J Liutkus from Waterbury, CT, age ~77 Get Report