John C Lau from 150 Font Blvd, San Francisco, CA 94132, age 62

Professional Records

Medicine Doctors

Dr. John C Lau, San Jose CA - MD (Doctor of Medicine)

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Specialties:

Diagnostic Radiology

Address:

SANTA CLARA VALLEY MEDICAL CTR
751 S Bascom Ave, San Jose, CA 95128
(408) 885-5000 (Phone), (408) 885-5418 (Fax)

Valley Medical Center Radiology
751 S Bascom Ave Suite 1M096, San Jose, CA 95128
(408) 885-6370 (Phone)

Certifications:

Diagnostic Radiology, 1996

Awards:

Healthgrades Honor Roll

Languages:

English

Hospitals:

SANTA CLARA VALLEY MEDICAL CTR
751 S Bascom Ave, San Jose, CA 95128

Valley Medical Center Radiology
751 S Bascom Ave Suite 1M096, San Jose, CA 95128

Santa Clara Valley Medical Center
751 South Bascom Avenue, San Jose, CA 95128

Stanford Hospital and Clinics
300 Pasteur Drive, Stanford, CA 94305

Education:

Medical School
University of California At San Francisco
Graduated: 1991

John S. Lau

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Specialties:

Internal Medicine

Work:

St Lucie Medical Center Hospitalist
1800 SE Tiffany Ave, Port Saint Lucie, FL 34952
(772) 335-4000 (phone), (772) 807-6228 (fax)

Education:

Medical School
Dalhousie Univ, Fac of Med, Halifax, Ns, Canada
Graduated: 1999

Conditions:

Acute Bronchitis
Acute Myocardial Infarction (AMI)
Acute Renal Failure
Acute Sinusitis
Acute Upper Respiratory Tract Infections

Languages:

English
Portuguese
Spanish

Description:

Dr. Lau graduated from the Dalhousie Univ, Fac of Med, Halifax, Ns, Canada in 1999. He works in Port Saint Lucie, FL and specializes in Internal Medicine. Dr. Lau is affiliated with Lawnwood Regional Medical Center & Heart Institute and Saint Lucie Medical Center.

John C. Lau

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Specialties:

Abdominal Radiology

Work:

Valley Medical Center Radiology
751 S Bascom Ave STE 1M096, San Jose, CA 95128
(408) 885-6370 (phone), (408) 885-6360 (fax)

Education:

Medical School
University of California, San Francisco School of Medicine
Graduated: 1991

Languages:

English

Description:

Dr. Lau graduated from the University of California, San Francisco School of Medicine in 1991. He works in San Jose, CA and specializes in Abdominal Radiology. Dr. Lau is affiliated with Santa Clara Valley Medical Center and Stanford Hospital.

Real Estate Brokers

John Lau, San Mateo CA

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Specialties:

Buyer's Agent
Listing Agent

Work:

Amerimac Golden Key
160 Bovet Rd., #308, San Mateo, CA 94402
(650) 341-1225 (Office)

Public records

Vehicle Records

John Lau

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Address:

600 Noriega St, San Francisco, CA 94122

VIN:

WBXPC93467WF08608

Make:

BMW

Model:

Year:

2007

Business Records

Name / Title

Company / Classification

Phones & Addresses

Mr John Lau
CEO

Lau Financial Services
Financial Services

181 Second Ave., Ste 600, San Mateo, CA 94401
(650) 344-1700, (650) 558-9656

John Lau
Owner

Peerless Cleaners
Janitors

2434 Kensington Rd NW, Calgary, AB T2N 3S1
(403) 283-5566

John Lau
Owner

Lau Financial Svc
Investment Advice

181 2Nd Ave, San Mateo, CA 94401
Website: laufinancial.com

John Lau
Manager

Ace Fixture
Groceries, General Line

7101 Lincoln Ave, Buena Park, CA 90620
Website: acefixture.com

John Lau
Manager

Skin Essentials By Vickie
Women's Clothing Stores

117 Town And Country Dr Ste 370, Danville, CA 94526

John Lau
Chief Financial Officer

Flowline, Inc.
Measuring and Controlling Devices

10500 Humbolt St, Los Alamitos, CA 90720

John Lau
Executive Officer

Golden West Technology

980 N Michigan Avenue, Fullerton, CA 92832

John Chin Lau
President

J W TRADING INC
Whol Nondurable Goods

3778 Rockwell Ave, El Monte, CA 91731
3788 Rockwell Ave, El Monte, CA 91731

John Lau
Owner

Lau Financial Svc
Investment Advice

181 2Nd Ave, San Mateo, CA 94401
Website: laufinancial.com

John Lau
Manager

Ace Fixture
Groceries, General Line

7101 Lincoln Ave, Buena Park, CA 90620
Website: acefixture.com

John Lau
Manager

Skin Essentials By Vickie
Women's Clothing Stores

117 Town And Country Dr Ste 370, Danville, CA 94526

John Lau
Chief Financial Officer

Flowline, Inc.
Measuring and Controlling Devices

10500 Humbolt St, Los Alamitos, CA 90720

John Lau
Executive Officer

Golden West Technology

980 N Michigan Avenue, Fullerton, CA 92832

Publications

Us Patents

Single-Core Two-Side Substrate With U-Strip And Co-Planar Signal Traces, And Power And Ground Planes Through Split-Wrap-Around (Swa) Or Split-Via-Connections (Svc) For Packaging Ic Devices

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US Patent:

58250840, Oct 20, 1998

Filed:

Feb 11, 1997

Appl. No.:

8/795478

Inventors:

John H. Lau - Palo Alto CA
Yung Shih Chen - San Jose CA
Tai-Yu Chou - Pleasanto CA
Frank H. Wu - Sunnyvale CA
Kuan Luen Chen - San Jose CA
Wei H. Koh - Irvine CA

Assignee:

Express Packaging Systems, Inc. - Palo Alto CA

International Classification:

H01L 2312
H01L 2350
H01L 2328

US Classification:

257700

Abstract:

The present invention discloses a new substrate with two metal layer circuit structure and layout for semiconductor packaging. The speed and performance characteristics of the semiconductor device are optimized while the packaging structure is simplified by utilizing only one dielectric layer and conventional printed circuit board fabrication process. The difficulties encountered due to the complexities and higher cost of production required for the multiple layer and high density configuration are thus avoided. The improved circuit structure is achieved by implementing a segmented ring on one side of a substrate and a split plane on the other side thus forming a single layer substrate structure. The edges of the substrate are coated with metal layer to provide inter-layer connections. In addition to the benefits of high performance, low cost, the improved circuit structure and package layout provide flexibility allowing higher degree of freedom for selecting the location and number of input and output signal lines and connections to the ground and power planes from the semiconductor device.

Heat Spreader With A Placement Recess And Bottom Saw-Teeth For Connection To Ground Planes On A Thin Two-Sided Single-Core Bga Substrate

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US Patent:

60576014, May 2, 2000

Filed:

Nov 27, 1998

Appl. No.:

9/200691

Inventors:

John H. Lau - Palo Alto CA
Tzyy Jang Tseng - Hsinchu, TW
Chen-Hua Cheng - Taoyuan Hsien, TW

Assignee:

Express Packaging Systems, Inc. - Palo Alto CA

International Classification:

H01L 2348

US Classification:

257738

Abstract:

The present invention discloses a new semiconductor ball grid array package for integrated circuits which have input and output counts higher than 250. The speed and performance characteristics of the semiconductor device contained in the package assembly are optimized while the packaging structure is simplified by utilizing only one dielectric layer and regular printed circuit board fabrication process. The complexities and higher cost for production of a multiple layer substrate for high-density interconnection configuration are thus resolved. The improved package assembly is achieved by implementing a segmented ring on one side of a substrate and a split plane on the other side thus forming a single layer substrate structure. The edges of the substrate are coated with metal layer to provide interlayer connections. The package assembly applies a cavity down configuration with an integrated heat spreader attached.

Low-Cost Surface-Mount Compatible Land-Grid Array (Lga) Chip Scale Package (Csp) For Packaging Solder-Bumped Flip Chips

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US Patent:

60757108, Jun 13, 2000

Filed:

Feb 11, 1999

Appl. No.:

9/248875

Inventors:

John H. Lau - Palo Alto CA

Assignee:

Express Packaging Systems, Inc. - Palo Alto CA

International Classification:

H05K 118

US Classification:

361760

Abstract:

The present invention discloses a novel electronic package. This semiconductor packaging assembly is for supporting and containing an integrated circuit (IC) chip. The IC chip is supported on a single core double-layer substrate as a flip chip which is solder-bumped with low melting point solder, e. g. , a 63 wt % Sn-37 wt % Pb eutectic solder. The flip chip is supported on a single core double-sided FR-4/5 or BT substrate provided with via holes to form via connections interconnecting the solder bumps to a land grid array disposed on the bottom surface of the substrate. The substrate is then surface mounted and soldered onto a printed circuit board which again is provided with low temperature 63 wt % Sn-37 wt % Pb eutectic solder paste for securely attaching the LGA CSP. Simplified processes are employed to assemble the electronic package with high yield processing steps, which can be conveniently carried out. CSP package with high reliability and improved performance characteristics can be achieved with a reduced production cost.

Positioning Method For Attaching A Solder Ball To An Electrical Connector And The Connector Using The Same

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US Patent:

62990586, Oct 9, 2001

Filed:

Apr 30, 1999

Appl. No.:

9/302695

Inventors:

John H. Lau - Palo Alto CA
Scott Lin - Fremont CA
Ming-Lun Szu - Taipei, TW

Assignee:

Hon Hai Precision Ind. Co., Ltd. - Taipei Hsien

International Classification:

B23K 3102

US Classification:

2282481

Abstract:

A method for positioning a solder ball onto a contact tail of an electrical connector comprises several steps. Firstly, arrange the contact tail into a center region and a peripheral region surrounding the center region. Secondly, attach solder paste onto the center region of the contact tail via a first mesh painting procedure. Thirdly, attach solder resist onto the peripheral region of the contact tail via a second mesh painting procedure. Fourthly, position a solder ball on the center region of the contact tail via a screen board. Fifthly, apply a reflow soldering procedure on the solder ball so that the solder ball can be soldered on the solder paste attached to the center region of the contact tail.

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