US Patent:
20080179611, Jul 31, 2008
Inventors:
Ashay Chitnis - Goleta CA, US
James Ibbetson - Santa Barbara CA, US
Bernd Keller - Santa Barbara CA, US
David T. Emerson - Chapel Hill NC, US
John Edmond - Cary NC, US
Michael J. Bergmann - Chapel Hill NC, US
Jasper S. Cabalu - Cary NC, US
Jeffrey C. Britt - Cary NC, US
Arpan Chakraborty - Goleta CA, US
Eric Tarsa - Goleta CA, US
James Seruto - Goleta CA, US
Yankun Fu - Raleigh NC, US
International Classification:
H01L 33/00
US Classification:
257 98, 438 27, 257E33061
Abstract:
Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.