James Lee Bierschenk

7619158, Nov 17, 2009

Jul 22, 2004

10/897871

Jeffrey W. Sharp - Richardson TX, US
James L. Bierschenk - Rowlett TX, US
Joshua E. Moczygemba - Wylie TX, US

Marlow Industries, Inc. - Dallas TX

H01L 35/34
H01L 21/00

136201, 438113

A method of forming a thermoelectric device includes extruding a P/N-type billet to form a P/N-type extrusion having a first plurality of P-type regions and a first plurality of N-type regions. The P/N-type extrusion is sliced into a plurality of P/N-type wafers. A diffusion barrier metallization is applied to at least a subset of the P-type regions and N-type regions. One side of at least one P/N-type wafer is attached to a temporary substrate. The P/N-type regions of the P/N-type wafer are separated into an array of isolated P-type and N-type elements. The array of elements are coupled to a first plate having a first patterned metallization to form a thermoelectric circuit. The temporary substrate and bonding media may be detached from the P-type and N-type elements. The thermoelectric circuit may be coupled with a second plate at a second end of the thermoelectric circuit, second plate having a second patterned metallization.

7763792, Jul 27, 2010

Feb 14, 2005

11/058029

Jeffrey W. Sharp - Richardson TX, US
James L. Bierschenk - Rowlett TX, US

Marlow Industries, Inc. - Dallas TX

H01L 35/28

136224, 136200

A thermoelectric module is provided that includes a first thermally conductive plate with a first array of thermoelectric elements coupled to it. The first array of thermoelectric elements includes a first plurality of thermoelectric elements. The thermoelectric module also includes a second thermally conductive plate coupled to the first array of thermoelectric elements, and a second array of thermoelectric elements coupled to the second plate. The second array of thermoelectric elements includes a second plurality of thermoelectric elements. A third thermally conductive plate is coupled to the second array of thermoelectric elements. The thermoelectric module also includes a portion of each thermoelectric element of the first and second pluralities of thermoelectric elements being coplanar with at least a portion of every other thermoelectric element of the first and second pluralities of thermoelectric elements.

8359871, Jan 29, 2013

Feb 10, 2010

12/658541

Mark C. Woods - Richardson TX, US
Leonard J. Recine - Plano TX, US
James L. Bierschenk - Rowlett TX, US
Overton L. Parish - Frisco TX, US

Marlow Industries, Inc. - Dallas TX

F25B 21/02

62 32, 62 33, 62 37

A temperature control device includes a thermoelectric device and a first sink. The thermoelectric device includes a plurality of thermoelectric elements electrically interconnected with one another by a plurality of electrical interconnects which are coupled between an interior surface of a first plate and an interior surface of a second plate. The first sink has a flat bottom and a plurality of generally parallel fins extending out of the flat bottom. Also, the flat bottom is coupled to an exterior surface of the first plate by a coupling media that includes a resilient and thermally-conductive pad.

20060107989, May 25, 2006

Nov 24, 2004

10/998113

James Bierschenk - Rowlett TX, US
Joshua Moczygemba - Wylie TX, US
Tracy Aydelott - Sumner TX, US

H01L 35/30
H01L 35/28

136212000, 136205000

In accordance with one embodiment of the present invention, a method of manufacturing a thermoelectric device is disclosed. The method includes forming a wafer of thermoelectric material and coupling the wafer to a stiff backing such that a bottom side of the wafer faces the stiff backing and a top side of the wafer faces away from the stiff backing. The method also includes reducing a thickness of the wafer by removing a portion of the wafer from the top side, and dicing the wafer into a plurality of blocks. At least a portion of the plurality of blocks are then coupled with a permanent substrate.

20060124165, Jun 15, 2006

Dec 9, 2004

11/008025

James Bierschenk - Rowlett TX, US
Joshua Moczygemba - Wylie TX, US
Tracy Aydelott - Sumner TX, US

H01L 35/28

136212000, 136211000

A thermoelectric device is provided that includes a top plate with surface including a first and second portion. A first plurality of thermoelectric elements are coupled to the first portion, and a second plurality of thermoelectric elements are coupled to the second portion. A base plate is coupled to the first and second plurality of thermoelectric elements. The first and second plurality of thermoelectric elements are operable to transfer thermal energy from the top plate to the base plate when an electrical current is passed through the first and second plurality of thermoelectric elements. The second plurality of thermoelectric elements receives a higher electrical current density than the first plurality of thermoelectric elements, and the second plurality of thermoelectric elements transfer more thermal energy per unit area of the top plate than the first plurality of thermoelectric elements.

20080245397, Oct 9, 2008

Apr 4, 2007

11/696581

Joshua E. Moczygemba - Wylie TX, US
James L. Bierschenk - Rowlett TX, US

Marlow Industries, Inc. - Dallas TX

H01L 37/00
H01L 21/44
H01L 35/30
H01L 35/34

136201, 136205, 438666

A method of forming an P/N-type array of P-type and N-type material includes stacking a plurality of P-type material wafers and a plurality of N-type material wafers into a P/N-type array. At least one spacer is provided between adjacent wafers. The P-type material wafers and the N-type material wafers are boned together the into a composite P/N-type brick. The method may also include providing a second composite P/N-type brick. A plurality of channels and fingers are created in the first and second composite P/N-type bricks. The first and second composite P/N-type bricks are fit together to form a P/N-type mosaic. Alternatively, the method may include providing a single P/N-type brick. A plurality of channels is created in the composite P/N-type brick. The channels are then back filled with an electrically and thermally insulating adhesive so that a P/N-type grid of P-type elements and N-type elements is formed.

20130032189, Feb 7, 2013

Aug 3, 2011

13/197260

Joshua E. Moczygemba - Wylie TX, US
James L. Bierschenk - Rowlett TX, US
Jeffrey W. Sharp - Murphy TX, US

MARLOW INDUSTRIES, INC. - Dallas TX

H01L 35/32
B23K 1/20
B23K 11/16
H01L 35/34

136224, 136201, 228203, 219118

In accordance with one embodiment of the present disclosure, a thermoelectric device includes a plurality of thermoelectric elements that each include a diffusion barrier. The diffusion barrier includes a refractory metal. The thermoelectric device also includes a plurality of conductors coupled to the plurality of thermoelectric elements. The plurality of conductors include aluminum. In addition, the thermoelectric device includes at least one plate coupled to the plurality of thermoelectric elements using a braze. The braze includes aluminum.

20130139866, Jun 6, 2013

Dec 1, 2011

13/309220

Joshua E. Moczygemba - Wylie TX, US
James L. Bierschenk - Rowlett TX, US

MARLOW INDUSTRIES, INC. - Dallas TX

H01L 35/30
C23C 4/08
H05K 13/00
C23C 4/18
C23C 4/12
H01L 35/02
C23F 1/02

136230, 427456, 216 95, 427448, 295921

In one embodiment, a method for forming a metallized ceramic includes thermal spraying metal directly onto a first side of a ceramic plate. The metal comprising aluminum. The method also includes densifying the thermally ceramic plate after spraying the metal onto the first side of the ceramic plate.