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Hideo M Kageyama

from Santa Clara, CA
Age ~55
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Related to:
Thanchanok Kageyama, 52
Connected to:
Naomi Kageyama, 82Yuji Kageyama, 58Moses Kaggwa, 55Hengameh Kaghazchi, 53Jamal W Kaghazwala, 35Christine Kagia, 41Ann C Kagie, 63Cloteal N Kagimu, 43Julia K Kagiwada, 56Roy C Kagiyama, 52

Hideo Kageyama Phones & Addresses

  • Santa Clara, CA
  • San Jose, CA
  • Morgan Hill, CA

Professional Records

Medicine Doctors

Hideo Kageyama Photo 1

Hideo Paul Kageyama

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Specialties:
Orthopaedic Surgery
Education:
Saint Louis University (1961)

Resumes

Resumes

Hideo Kageyama Photo 2

Senior Manager Of R And D Pilot Line And Equipment Development

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Location:
Santa Clara, CA
Industry:
Semiconductors
Work:
Lumileds
Senior Manager of R and D Pilot Line and Equipment Development
Education:
Osaka Electro - Communication University 1994 - 1996
Masters, Master of Engineering, Engineering
Hideo Kageyama Photo 3

Hideo Kageyama

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Publications

Us Patents

Methods Of Manufacturing Light-Emitting Devices With Metal Inlays And Bottom Contacts

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US Patent:
20210249398, Aug 12, 2021
Filed:
Jul 21, 2020
Appl. No.:
16/934911
Inventors:
- San Jose CA, US
Seng Huat LAU - Bayan Lepas, MY
Hideo KAGEYAMA - Santa Clara CA, US
Assignee:
LUMILEDS LLC - San Jose CA
International Classification:
H01L 25/00
H01L 23/00
H01L 25/16
H01L 25/18
Abstract:
Methods of manufacturing light-emitting devices are described herein. A method includes obtaining a packaging substrate. The packaging substrate includes an embedded metal inlay, vias in the packaging substrate and contacts on a bottom surface of the packaging substrate, each electrically coupled to a respective one of the vias. The method also includes forming a hybridized device, attaching a bottom surface of the hybridized device to a top surface of the metal inlay, and wirebonding a top surface of the hybridized device to a stop surface of the packaging substrate using a plurality of conductive connectors.

Light-Emitting Device With Metal Inlay And Bottom Contacts

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US Patent:
20210249574, Aug 12, 2021
Filed:
Jul 21, 2020
Appl. No.:
16/934905
Inventors:
- San Jose CA, US
Seng Huat LAU - Bayan Lepas, MY
Hideo KAGEYAMA - Santa Clara CA, US
Assignee:
LUMILEDS LLC - San Jose CA
International Classification:
H01L 33/62
H01L 33/56
H01L 33/48
Abstract:
Light-emitting devices are described herein. A light-emitting device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening in the packaging substrate and conductive vias. The metal inlay is thermally coupled to the bottom surface of the hybridized device. Conductive contacts are disposed on a bottom surface of the packaging substrate, each electrically coupled to one of the plurality of conductive vias. Conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate. Each of the conductive connectors is electrically coupled to a respective one of the conductive contacts on the bottom surface of the packaging substrate by a respective on of the conductive vias.

Wavelength Converted Light Emitting Device With Small Source Size

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US Patent:
20200295241, Sep 17, 2020
Filed:
Jun 2, 2020
Appl. No.:
16/890655
Inventors:
- San Jose CA, US
Brendan Jude MORAN - San Jose CA, US
Hideo KAGEYAMA - Santa Clara CA, US
Assignee:
LUMILEDS LLC - San Jose CA
International Classification:
H01L 33/50
H01L 33/60
Abstract:
A lighting structure according to embodiments of the invention includes a semiconductor light emitting device and a flat wavelength converting element attached to the semiconductor light emitting device. The flat wavelength converting element includes a wavelength converting layer for absorbing light emitted by the semiconductor light emitting device and emitting light of a different wavelength. The flat wavelength converting element further includes a transparent layer. The wavelength converting layer is formed on the transparent layer.

Phosphor Converter Structures For Thin Film Packages And Method Of Manufacture

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US Patent:
20200098950, Mar 26, 2020
Filed:
Sep 26, 2018
Appl. No.:
16/142247
Inventors:
- Schiphol, NL
Lex Alan KOSOWSKY - San Jose CA, US
Hideo KAGEYAMA - Santa Clara CA, US
Assignee:
Lumileds Holding B.V. - Schiphol
International Classification:
H01L 33/50
H01L 33/46
Abstract:
Light emitting devices (LEDs) and methods of manufacturing LEDs are described. A method includes providing a layer of a wavelength converting material on a temporary tape. The wavelength converting material includes at least a binder or matrix material, particles of a non-luminescent material, and phosphor particles and has a concentration of 60%-90% by volume particles of the non-luminescent material and phosphor particles. The layer of the wavelength converting material is separated on the temporary tape to form multiple wavelength converting structures, which are provided on an array type frame. Heat and pressure are applied to the wavelength converting structures on the array type frame.

Wavelength Converted Light Emitting Device With Small Source Size

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US Patent:
20180331261, Nov 15, 2018
Filed:
Jul 23, 2018
Appl. No.:
16/042660
Inventors:
- San Jose CA, US
Brendan Jude Moran - San Jose CA, US
Hideo Kageyama - Santa Clara CA, US
Assignee:
Lumileds LLC - San Jose CA
International Classification:
H01L 33/50
H01L 33/60
Abstract:
A lighting structure according to embodiments of the invention includes a semiconductor light emitting device and a flat wavelength converting element attached to the semiconductor light emitting device. The flat wavelength converting element includes a wavelength converting layer for absorbing light emitted by the semiconductor light emitting device and emitting light of a different wavelength. The flat wavelength converting element further includes a transparent layer. The wavelength converting layer is formed on the transparent layer.

Wavelength Converted Light Emitting Device With Small Source Size

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US Patent:
20170133559, May 11, 2017
Filed:
Jun 5, 2015
Appl. No.:
15/318143
Inventors:
- Eindhoven, NL
Brendan Jude Moran - San Jose CA, US
Hideo Kageyama - Santa Clara CA, US
International Classification:
H01L 33/50
H01L 33/60
Abstract:
A lighting structure according to embodiments of the invention includes a semiconductor light emitting device and a flat wavelength converting element attached to the semiconductor light emitting device. The flat wavelength converting element includes a wavelength converting layer for absorbing light emitted by the semiconductor light emitting device and emitting light of a different wavelength. The flat wavelength converting element further includes a transparent layer. The wavelength converting layer is formed on the transparent layer.

Pc Led With Optical Element And Without Ssubstrate Carrier

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US Patent:
20160172554, Jun 16, 2016
Filed:
Jul 17, 2014
Appl. No.:
14/906256
Inventors:
- Eindhoven, NL
Ashim Shatil Haque - San Jose CA, US
Hideo Kageyama - San Jose CA, US
Brendan Jude Moran - San Jose CA, US
Jyoli Kiron Bhardwaj - San Jose CA, US
International Classification:
H01L 33/58
H01L 33/50
H01L 33/52
H01L 25/075
H01L 33/00
H01L 33/62
H01L 33/60
Abstract:
Intermediate removable placement and processing structures are provided to enable the formation of optical elements upon light emitting elements, including the formation of a reflective layer beneath the optical elements. These removable placement and processing structures are substantially independent of the particular dimensions of the produced light emitting device, allowing their re-use in a variety of applications. The resultant light emitting device includes the light emitting element,the optical element with reflector, and, optionally, a wavelength conversion material, but does not include remnants of the placement and processing structures, such as a carrier substrate.
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Hideo M Kageyama from Santa Clara, CA, age ~55 Get Report