US Patent:
20110272173, Nov 10, 2011
Inventors:
Keizo Shiotsuki - Settsu-shi, JP
Hideki Kono - Decatur AL, US
kenji Ishii - Settsu-shi, JP
Kengo Ito - Settsu-shi, JP
Kenjiro Tanimoto - Settsu-shi, JP
Takahiro Kitahara - Settsu-shi, JP
Assignee:
DAIKIN INDUSTRIES, LTD. - Osaka-Shi, Osaka
International Classification:
H01B 3/30
C08L 27/20
Abstract:
It is an object of the present invention to provide a fluororesin composition which hardly causes molding defects even when high-speed molding is performed in covering extrusion molding within a relatively broad molding temperature range and which can give covered electric wires, in particular foamed electric wires, excellent in surface smoothness.A fluororesin composition comprising a polytetrafluoroethylene [PTFE] having a standard specific gravity of 2.15 to 2.30 and a tetrafluoroethylene/hexafluoropropylene-based copolymer [FEP],