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Habib S Karaki

from Sunnyvale, CA
Age ~41
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Also known as:
Sami Karaki Habib, Karaki Habib
Phone and address:
638 W Garland Ter, Sunnyvale, CA 94086
Related to:
Hala Karaki, 35Wafaa KarakiKaraki HabibSami Karaki Habib, 42
Connected to:
Yasser B Karaki, 65Emily N Karakis, 36Phaedra E Karakis, 55Sara A Karakis, 52Jennifer L Karakitsos, 48Danette T Karakla, 64Mustafa Karakoc, 49Brenda K Karakosta, 68Kathleen Karakostas, 68Vikram P Karakoti, 54

Habib Karaki Phones & Addresses

  • 638 W Garland Ter, Sunnyvale, CA 94086
  • Cupertino, CA
  • Tucson, AZ
  • Tempe, AZ

Work

Company: Texas instruments Sep 2009 to Oct 2014 Position: Analog and mixed signal design engineer

Education

Degree: Master of Science, Masters School / High School: Arizona State University 2015 to 2018

Skills

Sensors • Analog Circuit Design • Testing • Cmos • Electronics • Matlab • Labview • Electronics Hardware Design • Debugging • Semiconductor Industry • Mixed Signal Ic Design • Software Engineering • Hardware • Pcb Design • Simulations • Circuit Design • Research and Development • Integrated Circuits • Semiconductors • Silicon • Test Engineering • Electrical Engineering • Systems Design • Integrated Circuit Design • C++ • Altium • Cadence Virtuoso

Languages

English • Arabic

Interests

Politics • Soccer • Cars • Education • Environment • New Technologies • Science and Technology • Human Rights • Food • Arts and Culture • Health

Industries

Consumer Electronics

Resumes

Resumes

Habib Karaki Photo 1

Health Technologies Electrical Engineer

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Location:
638 west Garland Ter, Sunnyvale, CA 94086
Industry:
Consumer Electronics
Work:
Texas Instruments Sep 2009 - Oct 2014
Analog and Mixed Signal Design Engineer
Apple Sep 2009 - Oct 2014
Health Technologies Electrical Engineer
Texas Instruments Oct 2007 - Oct 2010
Test Engineer
Education:
Arizona State University 2015 - 2018
Master of Science, Masters Arizona State University 2005 - 2007
Master of Science, Masters, Design American University of Beirut 2001 - 2005
Bachelor of Engineering, Bachelors, Electronics Engineering Rawdah High School 2001
American University of Beirut (Aub)
Skills:
Sensors
Analog Circuit Design
Testing
Cmos
Electronics
Matlab
Labview
Electronics Hardware Design
Debugging
Semiconductor Industry
Mixed Signal Ic Design
Software Engineering
Hardware
Pcb Design
Simulations
Circuit Design
Research and Development
Integrated Circuits
Semiconductors
Silicon
Test Engineering
Electrical Engineering
Systems Design
Integrated Circuit Design
C++
Altium
Cadence Virtuoso
Interests:
Politics
Soccer
Cars
Education
Environment
New Technologies
Science and Technology
Human Rights
Food
Arts and Culture
Health
Languages:
English
Arabic

Publications

Us Patents

Heat Sensor Correction

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US Patent:
20130250998, Sep 26, 2013
Filed:
Mar 22, 2012
Appl. No.:
13/427521
Inventors:
Habib Sami Karaki - Tucson AZ, US
International Classification:
G01K 7/02
US Classification:
374179, 374E07004
Abstract:
A heat sensor has the ability to correct for errors introduced during temperature changes of the hot junction of the thermopile for the heat sensor. For example, the effect of temperature changes at the hot junction of the heat sensor relative to the cold junction is mathematically modeled such that the effect on the temperature determination can be corrected given certain information relating to the thermopile, its electrical output, and the temperature history and current temperature of the cold junction. By accounting for these factors, a processing device can modify the temperature determination output for the heat sensor while correcting for error introduced by temperature changes at the hot junction as determined by the mathematical model.

Temperature Gradient Sensing In Portable Electronic Devices

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US Patent:
20220373404, Nov 24, 2022
Filed:
Aug 5, 2022
Appl. No.:
17/882423
Inventors:
- Cupertino CA, US
Chad A. Bossetti - Santa Clara CA, US
Habib S. Karaki - Sunnyvale CA, US
Paul Mansky - San Francisco CA, US
International Classification:
G01K 7/02
G01K 3/14
Abstract:
An electronic device housing encloses a temperature sensing system including a temperature sensor and a differential temperature probe. The differential temperature probe includes a flexible substrate defining two ends. A first end is thermally coupled to the temperature sensor and a second end is thermally coupled to a surface, volume, or component of the electronic device. The temperature probe is an in-plane thermopile including a series-coupled set of thermocouples extending from the first end to the second end. A temperature measured at the temperature sensor can be a first measured temperature and a voltage difference across leads of the differential temperature probe can be correlated to a differential temperature relative to the first measured temperature. A sum of the differential temperature and the first measured temperature is a second measured temperature, quantifying a temperature of the second end of the differential temperature probe.

Temperature Sensing Systems And Methods Including Multiple Temperature Sensors

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US Patent:
20230098236, Mar 30, 2023
Filed:
Sep 6, 2022
Appl. No.:
17/930041
Inventors:
- Cupertino CA, US
Habib S. KARAKI - Sunnyvale CA, US
James C. CLEMENTS - Campbell CA, US
Chin S. HAN - San Jose CA, US
Craig C. D'SOUZA - Pacifica CA, US
Daniel W. LABOVE - San Francisco CA, US
Esther CHEN - Fremont CA, US
Joseph R. LEE - Millbrae CA, US
Kuo Jen HUANG - San Jose CA, US
Wanfeng HUANG - Fremont CA, US
Fred Y. CHOU - Cupertino CA, US
Hongling CHENG - San Jose CA, US
Ali M. AMIN - Sunnyvale CA, US
Chia-Hsien LIN - San Jose CA, US
International Classification:
G01K 17/20
G01K 7/02
Abstract:
Robust estimation of temperatures inside and outside a device can be achieved using one or more absolute temperature sensors optionally in conjunction with thermopile heat flux sensors. Thermopile temperature sensing systems can measure a temperature gradient across two locations within the device, to estimate absolute temperature at locations that are impractical to measure using absolute temperature sensors. Using heat flux models associated with the device, the thermopile temperature sensing system can be used to estimate temperature associated with objects that contact an outer surface of the device, such as a user's skin temperature. Additionally, the thermopile temperature sensing system can be used to estimate ambient air temperature. Within a device, temperature measurements from the thermopile temperature sensors can be used to compensate sensor measurements, such as when the accuracy or reliability of a sensor varies with temperature.

Cuff Designs And Methods

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US Patent:
20180153418, Jun 7, 2018
Filed:
Jun 16, 2016
Appl. No.:
15/578624
Inventors:
- Cupertino CA, US
Habib S. KARAKI - Sunnyvale CA, US
Richard C. KIMOTO - Fremont CA, US
Richard H. KOCH - Cupertino CA, US
Tobias J. HARRISON-NOONAN - San Francisco CA, US
R. Keith MONTGOMERY - Campbell CA, US
International Classification:
A61B 5/022
Abstract:
A low-profile blood pressure measurement system and methods of use are disclosed. The system includes an expandable member or structure that has a multi-compartment structure and/or is mounted on a rigid surface or structure. The system is incorporated into a portable multi-function device, or is configured to communicate with a portable multi-function device.

On-Chip Circuit And Method For Accurately Measuring Die Temperature Of An Integrated Circuit

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US Patent:
20160178450, Jun 23, 2016
Filed:
Oct 28, 2015
Appl. No.:
14/925703
Inventors:
- Dallas TX, US
Habib Sami Karaki - Sunnyvale CA, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
G01K 7/16
Abstract:
An integrated circuit and method are provided for accurately measuring the temperature of a die of the integrated circuit. Pairs of diodes are driven with different currents in order to generate a series of thermal voltages. The ADC measures the series of thermal voltages against an external reference voltage. Based on these thermal voltage measurements, the ADC calculates the die temperature. The different currents used to generate the series of thermal voltages are selected at specific ratios to each other in order to promote the ability of the ability of the ADC to calculate the die temperature using standard components and logic of an ADC. These thermal voltages are generated and measured using integrated components of the die for which a temperature measurement is being provided, thus reducing several sources of inaccuracies in conventional die temperature measurement techniques. Addition embodiments are provided for detecting defective diodes based on comparisons of the thermal voltage outputs.
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Habib S Karaki from Sunnyvale, CA, age ~41 Get Report