Grigoriy I Basin

7352011, Apr 1, 2008

Mar 29, 2005

11/093961

Willem H. Smits - Veldhoven, NL
Robert F. M. Hendriks - Overlangel, NL
Grigoriy Basin - San Francisco CA, US
Frans H. Konijn - Huizen, NL
Robert Scott West - Morgan Hill CA, US
Paul S. Martin - Pleasanton CA, US
Gerard Harbers - Sunnyvale CA, US

Philips Lumileds Lighting Company, LLC - San Jose CA

H01L 29/22

257 99, 257100, 257E33056, 257E33058, 257E33059

Lenses and certain fabrication techniques are described. A wide-emitting lens refracts light emitted by an LED die to cause a peak intensity to occur within 50-80 degrees off the center axis and an intensity along the center axis to be between 5% and 33% of the peak intensity. The lens is particularly useful in a LCD backlighting application. In one embodiment, the lens is affixed to the backplane on which the LED die is mounted and surrounds the LED die. The lens has a hollow portion that forms an air gap between the LED die and the lens, where the light is bent towards the sides both at the air gap interface and the outer lens surface interface. The lens may be a secondary lens surrounding an interior lens molded directly over the LED die.

7452737, Nov 18, 2008

Nov 15, 2004

10/990208

Grigoriy Basin - San Francisco CA, US
Robert Scott West - Morgan Hill CA, US
Paul S. Martin - Pleasanton CA, US

Philips Lumileds Lighting Company, LLC - San Jose CA

H01L 21/00

438 27, 438 26, 257E33058

One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor.

7736945, Jun 15, 2010

Dec 15, 2006

11/611775

Stefano Schiaffino - Pleasanton CA, US
Daniel A. Steigerwald - Cupertino CA, US
Mari Holcomb - Half Moon Bay CA, US
Grigoriy Basin - San Francisco CA, US
Paul Martin - Pleasanton CA, US
John Epler - Milpitas CA, US

Philips Lumileds Lighting Company, LLC - San Jose CA
Koninklijke Philips Electronics N.V. - Eindhoven

H01L 21/00

438106, 438108, 257E21503

Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e. g. , sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process.

7791093, Sep 7, 2010

Sep 4, 2007

11/849930

Grigoriy Basin - San Francisco CA, US
Ashim Shatil Haque - San Jose CA, US
Ching-hui Chen - San Jose CA, US
Robert Scott West - Morgan Hill CA, US
Paul Martin - Pleasanton CA, US

Koninklijke Philips Electronics N.V. - Eindhoven
Philips Lumileds Lighting Company, LLC - San Jose CA

H01L 33/00

257 98

In one embodiment, sub-micron size granules of TiO, ZrO, or other white colored non-phosphor inert granules are mixed with a silicone encapsulant and applied over an LED. In one experiment, the granules increased the light output of a GaN LED more than 5% when the inert material was between about 2. 5-5% by weight of the encapsulant. Generally, a percentage of the inert material greater than 5% begins to reduce the light output. If the LED has a yellowish YAG phosphor coating, the white granules in the encapsulant make the LED appear whiter when the LED is in an off state, which is a more pleasing color when the LED is used as a white light flash in small cameras. The addition of the granules also reduces the variation of color temperature over the view angle and position over the LED, which is important for a camera flash and projection applications.

7847302, Dec 7, 2010

Aug 26, 2005

11/212280

Grigoriy Basin - San Francisco CA, US
Paul S. Martin - Pleasanton CA, US
Robert Scott West - Morgan Hill CA, US
Yasumasa Morita - Sunnyvale CA, US
Tewe Heemstra - Veldhoven, NL

Koninklijke Philips Electronics, N.V. - Eindhoven
Philips Lumileds Lighting, LLC - San Jose CA

H01L 33/00
H01J 1/62

257 88, 257 79, 257 89, 257 98, 257100, 257E33049, 257E33059, 257E33061, 257E33067, 438 22, 438 47, 438 48

A technique for forming a white light LED is disclosed. In one embodiment, the LED emits blue light. A first phosphor for producing red, yellow, yellow-green, or green light is formed to conformably coat the LED die. One suitable deposition technique is electrophoretic deposition (EPD). Over the resulting LED structure is deposited another phosphor (to add the remaining color component) in a binder (e. g. , silicone) for encapsulating the die. The blue LED light combines with the two phosphor colors to create white light. Since the two different deposition techniques are independent and easily controllable, the resulting white light temperature is highly controllable and the color emission is substantially uniform.

7858408, Dec 28, 2010

Feb 26, 2007

11/679143

Gerd O. Mueller - San Jose CA, US
Grigoriy Basin - San Francisco CA, US
Robert Scott West - Morgan Hill CA, US
Paul S. Martin - Pleasanton CA, US
Tze-Sen Lim - Bayan Lepas, MY
Stefan Eberle - Mountain View CA, US

Koninklijke Philips Electronics N.V. - Eindhoven
Philips Lumilends Lighting Company, LLC - San Jose CA

H01L 33/50
H01L 21/56

438 27, 257E21504, 257E33059, 257E33061

Overmolded lenses and certain fabrication techniques are described for LED structures. In one embodiment, thin YAG phosphor plates are formed and affixed over blue LEDs mounted on a submount wafer. A clear lens is then molded over each LED structure during a single molding process. The LEDs are then separated from the wafer. The molded lens may include red phosphor to generate a warmer white light. In another embodiment, the phosphor plates are first temporarily mounted on a backplate, and a lens containing a red phosphor is molded over the phosphor plates. The plates with overmolded lenses are removed from the backplate and affixed to the top of an energizing LED. A clear lens is then molded over each LED structure. The shape of the molded phosphor-loaded lenses may be designed to improve the color vs. angle uniformity.

7867793, Jan 11, 2011

Jul 9, 2007

11/775059

Grigoriy Basin - San Francisco CA, US
Robert S. West - Morgan Hill CA, US
Paul S. Martin - Pleasanton CA, US

Koninklijke Philips Electronics N.V. - Eindhoven
Philips Lumileds Lighting Company LLC - San Jose CA

H01L 21/00

438 26, 438 22, 257E21056

A light emitting diode (LED) is fabricated using an underfill layer that is deposited on either the LED or the submount prior to mounting the LED to a submount. The deposition of the underfill layer prior to mounting the LED to the submount provides for a more uniform and void free support, and increases underfill material options to permit improved thermal characteristics. The underfill layer may be used as support for the thin and brittle LED layers during the removal of the growth substrate prior to mounting the LED to the submount. Additionally, the underfill layer may be patterned to and/or polished back so that only the contact areas of the LED and/or submount are exposed. The patterns in the underfill may also be used as a guide to assist in the singulating of the devices.

8203161, Jun 19, 2012

Nov 23, 2009

12/624156

Dmitri Simonian - Sunnyvale CA, US
Grigoriy Basin - San Francisco CA, US

Koninklijke Philips Electronics N.V. - Eindhoven
Philips Lumileds Lighting Company LLC - San Jose CA

H01L 33/00

257 98, 257 99, 438 29

A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. A luminescent material is positioned in a path of light emitted by the light emitting layer. A thermal coupling material is disposed in a transparent material. The thermal coupling material has a thermal conductivity greater than a thermal conductivity of the transparent material. The thermal coupling material is positioned to dissipate heat from the luminescent material.