Glen L Zirbes

6696952, Feb 24, 2004

Aug 3, 2001

09/922245

Glen Zirbes - Silver Lake MN

HEI, Inc. - Victoria MN

G08B 1314

3405721, 257666, 361813, 3405727

Radio-frequency identification (RFID) devices are used in a variety of applications to facilitate the identification and tracking of people, objects, and animals. One problem with RFID devices or tags concerns manufacturing cost. Specifically, some tag designs use an integrated-circuit chip requiring three external connections, instead of two as do many other designs. Accordingly, the present inventor devised a unique RFID module which uses a three-terminal integrated circuit and two capacitors, but only requires two external leads. One exemplary embodiment of the module includes two external terminals for connection to an antenna coil and an internal terminal for connection to a center-tap of a dual (center-tapped) capacitor. Other aspects of the invention include subcomponents of the module and methods of tag assembly using the module.

20100060458, Mar 11, 2010

Sep 10, 2008

12/208144

Scott Stole - Waconia MN, US
Brian Bender - Victoria MN, US
Glen Zirbes - Silver Lake MN, US
Tom Holsapple - Silver Lake MN, US

Smartrac IP B.V. - Amsterdam

G08B 13/14

3405728

The present disclosure generally pertains to a transponder device () comprising a transponder unit (), which is arranged in a housing () and has an antenna device () and a chip (), the housing forming a receiving space between a transparent front wall () and a housing rear wall () having arranged therein an optically readable information carrier (), the housing rear wall having a fastening edge () defining a fastening plane () of the housing.

20100097280, Apr 22, 2010

Oct 20, 2008

12/254685

Glen Zirbes - Silver Lake MN, US
Scott Stole - Waconia MN, US
Martin Kuschewski - Marktoberdorf, DE

Smartrac IP B.V. - Amsterdam

H01Q 21/00
H01Q 1/00

343726, 343730

The present disclosure pertains to a transponder device () having an antenna arrangement and a chip () disposed on an antenna substrate (), wherein the antenna arrangement comprises at least a first antenna unit formed as a loop antenna () that is connected electrically conductively to contact surfaces () of the chip via conductor ends of an antenna conductor () that is used for the formation of the loop antenna, and wherein the antenna arrangement besides the first antenna unit comprises at least one further antenna unit formed as a dipole antenna ().

52238512, Jun 29, 1993

Nov 5, 1991

7/787828

Leonard D. Hadden - Minneapolis MN
Glen L. Zirbes - Silver Lake MN

Trovan Limited

H01Q 1400
H01Q 1270
G01S 13080
H01L 23060

343873

A method and apparatus for facilitating interconnection of antenna lead wires to an integrated circuit and encapsulating the assembly to form an improved miniature transponder device including the provision of an additional protective layer of insulation to the top of an integrated circuit chip or die and the provision of enlarged plated electrodes to the surface of the additional insulation to form enhanced bonding pads, such pads being electrically connected through the protective layers to the normal bonding pads of the integrated circuit device. The enhanced bonding pads are made of a soft conductive metal such that external wires to be attached thereto can be bonded to the pads using a thermal compression bonding technique, This invention also extends to a method of encapsulating a transponder in heat shrunk plastics material.

50255509, Jun 25, 1991

May 25, 1990

7/530047

Glen L. Zirbes - Silver Lake MN
Leonard D. Hadden - Minneapolis MN
Philip R. Troyk - Morton Grove IL

Trovan Limited - Isle of Man

H01F 4102

29605

An improved automated method for the manufacture of small implantable passive transponder devices is presented in which semiconductor wafer die are bonded to a conductively coated tape leadframe. This tape, with die attached, is injected molded to form a cap around the leads and the attached die, such that the exposed portion of the leads extend laterally from the cap. A ferrite core is attached to the base of the cap, and a fine coil wire, dispensed from a specially designed applicator, is automatically bonded to one of the leads protruding from the cap body. The wire is subsequently wound around the ferrite core and terminated by automatic attachment to another of the protruding leads. The assembled device is thereafter encapsulated within a small glass housing.

50502921, Sep 24, 1991

May 25, 1990

7/530048

Glen L. Zirbes - Silver Lake MN
Leonard D. Hadden - Minneapolis MN
Philip R. Troyk - Morton Grove IL

Trovan Limited - Douglas

H01F 706
H05K 702

29605

An improved automated method for the manufacture of alternatively sized passive transponder devices is presented which utilizes a single leadframe design and manufacturing process, including automated coil winding and wire-to-lead termination. A specially designed leadframe is prepared, with augmented leads, and is coated with a thin layer of silver. One or more semiconductor chips are bonded to individual assembly sites on the leadframe, after which the lead-die assembly is encapsulated by transfer molding. The cap and leads are singulated, and a bobbin is attached to the leads, which extend laterally from each individual molded cap. In an automated process, a conductive wire is attached to a first of the protruding leads, fly-wound around the bobbin core, and terminated by connection to a second of the protruding leads.

52818551, Jan 25, 1994

Jun 5, 1991

7/710786

Leonard D. Hadden - Minneapolis MN
Glen L. Zirbes - Silver Lake MN

Trovan Limited

A01K 1100
G01S 1380
H01L 2940

257784

A method and apparatus for facilitating interconnection of lead wires to an integrated circuit including the provision of an additional protective layer of insulation to the top of an integrated circuit chip or die and the provision of enlarged plated electrodes to the surface of the additional insulation to form enhanced bonding pads, such pads being electrically connected through the protective layers to the normal bonding pads of the integrated circuit device. The enhanced bonding pads are made of a soft conductive metal such that external wires to be attached thereto can be bonded to the pads using a thermal compression bonding technique.