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Gary K Yama

from Mountain View, CA
Age ~67
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Also known as:
Gary Te Yama, Gary J Yama
Phone and address:
1520 Gretel Ln, Mountain View, CA 94040
(650) 964-4527
Related to:
John S Heck, 62David A Dunlap, 73Carol S Conner, 62Mary Y Yama, 98Craig M YamaMaki N Yama, 60Geoffrey P Conner, 61Steven H YamaG Conner, 61
Connected to:
Armando Yama, 73Frank K Yama, 95John G Yama, 67Sadozai Yama, 38Sheri Yama, 51Issaku Yamaashi, 49Gilbert Y Yamabayashi, 94Kristen S Yamabe, 39Andrea S Yamada, 51Bradford J Yamada, 57

Gary Yama Phones & Addresses

  • 1520 Gretel Ln, Mountain View, CA 94040 (650) 964-4527
  • Salinas, CA
  • 540 N 6Th St APT 211, San Jose, CA 95112 (831) 424-6610
  • Millbrae, CA
  • Martinez, CA
  • Campbell, CA
  • 1520 Gretel Ln, Mountain View, CA 94040

Work

Company: Robert bosch llc 2001 Address: Palo Alto, CA Position: Mems engineer

Education

Degree: Bachelor of Science (B.S.) School / High School: UCSB Specialities: EECS

Emails

y***[email protected]

Industries

Research

Resumes

Resumes

Gary Yama Photo 1

Mems Engineer At Bosch

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Position:
MEMS Engineer at Robert Bosch LLC
Location:
San Francisco Bay Area
Industry:
Research
Work:
Robert Bosch LLC - Palo Alto, CA since 2001
MEMS Engineer
EG&G IC Sensors - Milpitas, CA 1995 - 2001
MEMS Engineer
Microflow, Inc. - Dublin, CA 1993 - 1995
MEMS Engineer
SMC - San Jose, CA 1989 - 1993
MEMS Engineer
Microsensor Technology - Fremont, CA 1987 - 1989
MEMS Engineer
Education:
UCSB
Bachelor of Science (B.S.), EECS

Business Records

Name / Title
Company / Classification
Phones & Addresses
Gary Yama
Engineer, Professional Engineer
Robert Bosch LLC
Research & Technology Center · All Other Motor Vehicle Parts Manufacturing · Marketing Research and Public Opinion Polling
4005 Miranda Ave, Palo Alto, CA 94304
4009 Miranda Ave, Palo Alto, CA 94304
(650) 320-2905, (650) 213-0087, (650) 320-2902, (650) 320-2930

Publications

Us Patents

Dual-Axis Yaw Rate Sensing Unit Having A Tuning Fork Gyroscope Arrangement

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US Patent:
7401517, Jul 22, 2008
Filed:
Aug 18, 2006
Appl. No.:
11/506712
Inventors:
Zhiyu Pan - San Jose CA, US
Christoph Lang - Los Altos CA, US
Gary Yama - Mountain View CA, US
Assignee:
Robert Bosch GmbH - Stuttgart
International Classification:
G01P 9/04
US Classification:
7350416, 7350412
Abstract:
A dual-axis tuning fork gyroscope includes four open-ended tuning forks arranged coplanarly in two opposite pairs, a first pair of open-ended tuning forks being arranged opposite one another along a first axis, a second pair of open-ended tuning forks being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another. The four open-ended tuning forks are mechanically coupled together so that all four tuning forks vibrate in the same manner in terms of frequency and phase.

Anti-Stiction Technique For Electromechanical Systems And Electromechanical Device Employing Same

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US Patent:
7449355, Nov 11, 2008
Filed:
Apr 27, 2005
Appl. No.:
11/115828
Inventors:
Markus Lutz - Palo Alto CA, US
Aaron Partridge - Palo Alto CA, US
Wilhelm Frey - Stuttgart, DE
Markus Ulm - Menlo Park CA, US
Matthias Metz - Palo Alto CA, US
Brian Stark - San Francisco CA, US
Gary Yama - Mountain View CA, US
Assignee:
Robert Bosch GmbH - Stuttgart
International Classification:
H01L 21/00
H01L 21/461
US Classification:
438 50, 438 52, 438706
Abstract:
A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure.

Anti-Stiction Technique For Electromechanical Systems And Electromechanical Device Employing Same

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US Patent:
7625773, Dec 1, 2009
Filed:
Nov 4, 2008
Appl. No.:
12/264774
Inventors:
Markus Lutz - Palo Alto CA, US
Aaron Partridge - Palo Alto CA, US
Wilhelm Frey - Stuttgart, DE
Markus Ulm - Menlo Park CA, US
Matthias Metz - Palo Alto CA, US
Brian Stark - San Francisco CA, US
Gary Yama - Mountain View CA, US
Assignee:
Robert Bosch GmbH - Stuttgart
International Classification:
H01L 21/00
H01L 21/461
H01L 27/14
H01L 29/84
H01L 29/82
US Classification:
438 50, 438 52, 438706, 257414, 257415, 257417
Abstract:
A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure.

Microelectromechanical Devices And Fabrication Methods

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US Patent:
7671515, Mar 2, 2010
Filed:
Nov 7, 2006
Appl. No.:
11/594525
Inventors:
Matthias Metz - Palo Alto CA, US
Zhiyu Pan - Palo Alto CA, US
Brian Stark - Palo Alto CA, US
Markus Ulm - Wannweil, DE
Gary Yama - Palo Alto CA, US
Assignee:
Robert Bosch, GmbH - Stuttgart
International Classification:
H01L 41/053
US Classification:
310340, 310338, 310344
Abstract:
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.

Multi-Ring Resonator System And Method

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US Patent:
7750758, Jul 6, 2010
Filed:
Sep 5, 2007
Appl. No.:
11/850625
Inventors:
Pan Zhiyu - Shanghai, CN
Robert Candler - Palo Alto CA, US
Markus Lutz - Los Altos CA, US
Aaron Partridge - Cupertino CA, US
Gary Yama - Palo Alto CA, US
Assignee:
Robert Bosch GmbH - Stuttgart
International Classification:
H03H 9/46
H03H 9/48
US Classification:
333186, 333199
Abstract:
A system and method are provided which includes ring resonator structures coupled together with beam structure(s). The ring resonators are configured to operate in the contour or breathe mode. The center of the coupling beam structure is used as a nodal anchor point for anchoring the ring resonators and the beam structures, and also provides a reflecting interface. In an embodiment, the coupling beam structure includes two quarter-wavelength matched beams and an anchor located at a nodal point for coupling the two quarter-wavelength matched beams and ring resonator structures. The symmetric ring design also provides a differential drive and sense configuration while balancing the driving forces about the anchor located at the center of the beam structure. The system exhibits low energy losses while providing large sensing signals and a high quality factor (Q) of about 186,000 at a resonant frequency of about twenty-nine (29) MHz.

Tri-Axis Accelerometer Having A Single Proof Mass And Fully Differential Output Signals

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US Patent:
7757555, Jul 20, 2010
Filed:
Aug 30, 2006
Appl. No.:
11/513669
Inventors:
Zhiyu Pan - San Jose CA, US
Christoph Lang - Los Altos CA, US
Gary Yama - Mountain View CA, US
Matthias Metz - Palo Alto CA, US
Markus Ulm - Wann Weil, DE
Assignee:
Robert Bosch GmbH - Stuttgart
International Classification:
G01P 15/08
US Classification:
7351424, 7351401, 7351429
Abstract:
A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.

Substrate With Multiple Encapsulated Pressures

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US Patent:
7875482, Jan 25, 2011
Filed:
Mar 19, 2009
Appl. No.:
12/407639
Inventors:
Robert N. Candler - Los Angeles CA, US
Gary Yama - Mountain View CA, US
Assignee:
Robert Bosch GmbH - Stuttgart
International Classification:
H01L 21/00
US Classification:
438 51, 438 55, 257E21499, 257E29324
Abstract:
A method of forming a device with multiple encapsulated pressures is disclosed herein. In accordance with one embodiment of the present invention, there is provided a method of forming a device with multiple encapsulated pressures, including providing a substrate, forming a functional layer on top of a surface of the substrate, the functional layer including a first device portion at a first location, and a second device portion at a second location adjacent to the first location, encapsulating the functional layer, forming at least one diffusion resistant layer above the encapsulated functional layer at a location above the first location and not above the second location, modifying an environment adjacent the at least one diffusion resistant layer, and diffusing a gas into the second location as a result of the modified environment.

Microelectromechanical Devices And Fabrication Methods

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US Patent:
7956428, Jun 7, 2011
Filed:
Aug 16, 2005
Appl. No.:
11/205702
Inventors:
Gary Yama - Palo Alto CA, US
Assignee:
Robert Bosch GmbH - Stuttgart
International Classification:
H01L 29/84
US Classification:
257415, 257417, 257419, 257E33056, 257E33058, 257E33059
Abstract:
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes a buried polysilicon layer and a “protective layer” deposited over the buried polysilicon layer to prevent possible erosion of, or damage to the buried polysilicon layer during processing steps. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.
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Gary K Yama from Mountain View, CA, age ~67 Get Report