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Eugene Segerson Phones & Addresses

  • Mesa, AZ
  • 329 Vaughn Ave, Gilbert, AZ 85234 (480) 813-9066
  • Tempe, AZ
  • Prescott, AZ

Publications

Us Patents

Connectorless Fiber Optic Package

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US Patent:
45332096, Aug 6, 1985
Filed:
Oct 24, 1983
Appl. No.:
6/544679
Inventors:
Eugene E. Segerson - Tempe AZ
Floyd L. Thomas - Mesa AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
G02B 726
US Classification:
350 9620
Abstract:
A package for optoelectronic devices is disclosed having means for receiving the end of an optical fiber. The package fastens to the fiber by means of a collet chuck which is part of the package. The chuck is closed by rotating a collar.

Lead Frame For Plastic Encapsulated Semiconductor Assemblies

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US Patent:
40127656, Mar 15, 1977
Filed:
Sep 24, 1975
Appl. No.:
5/616456
Inventors:
Leo L. Lehner - Scottsdale AZ
Eugene E. Segerson - Tempe AZ
Assignee:
Motorola, Inc. - Chicago IL
International Classification:
H01L 2348
H01L 2944
H01L 2952
H01L 2960
US Classification:
357 70
Abstract:
An improved lead frame is provided for the manufacture of high heat dissipating semiconductor devices having a large heat sink metallic portion exposed with plastic encapsulating material partially disposed thereabout. A semiconductor unit is mounted directly on the heat sink such that high heat dissipation is obtained. The lead frame provides for pairs of metallic heat sink portions joined to a interdigitated center lead frame portion such that the interdigitation of the semiconductor device leads associated with each of the opposed heat sink portions provides for a high density lead frame structure from which a minimum of material must be removed in the fabrication process. The center lead frame portion comprises two parallel interconnecting rails or tie bars which provide a dual function in that they provide a mold stop for subsequent plastic encapsulation fabrication steps while simultaneously providing a support for alignment hole means which provide indexing of the lead frame and associated opposed heat sink portions through various automated manufacturing steps. The use of a composite lead frame structure wherein the metallic heat sink portion is joined to the center lead frame structure allows great versatility in the types of material and the types of fabrication steps used to provide a semiconductor device thus allowing manufacture at greatly reduced cost.

Electrically Isolated Heatsink For Single-In-Line Package

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US Patent:
49611070, Oct 2, 1990
Filed:
Apr 3, 1989
Appl. No.:
7/331716
Inventors:
Henry E. Geist - Scottsdale AZ
Eugene E. Segerson - Tempe AZ
Assignee:
Motorola Inc. - Schaumburg IL
International Classification:
H01L 2340
H01L 2336
US Classification:
357 81
Abstract:
An improved semiconductor device package and method include, in a first embodiment, a die supporting leadframe having fingers inside the package body which are interleaved with mating fingers of a metallic heat extractor, without touching. A thermally conductive encapsulation fills the spaces between and around the fingers to provide thermal coupling and electrical isolation. The heat extractor extends outside the package body. Alternatively, the heat extractor and the leadframe have large parallel faces inside the package body which are arranged in a face-to-face relationship, without touching. An insulating spacer locks the opposing faces in the spaced-apart, electrically isolated relationship. An encapsulation fills any remaining space between the faces to provide efficient thermal coupling.

Shock Proof Steering Module Assembly

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US Patent:
48166731, Mar 28, 1989
Filed:
Sep 22, 1988
Appl. No.:
7/248322
Inventors:
Eugene E. Segerson - Tempe AZ
David L. Vowles - Phoenix AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
G01D 534
US Classification:
250239
Abstract:
A steering module assembly having a contoured housing unit to receive a PC board which has soldered to it a plurality of optoelectronic devices wherein neither said plurality of optoelectronic devices nor said PC board come in direct contact with the housing unit. The PC board also has a saddle element which contains snap retainers to receive each of said plurality of optoelectronic devices. A fitted cover encloses the housing unit.

Fiber Optic Tap Connector And Method

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US Patent:
47415843, May 3, 1988
Filed:
Dec 29, 1986
Appl. No.:
6/947231
Inventors:
Eugene A. Segerson - Tempe AZ
Assignee:
Motorola Inc. - Schaumburg IL
International Classification:
G02B 642
US Classification:
350 9615
Abstract:
A fiber optic tap connector which is inexpensive and easy to use to tap off an optical signal from the fiber optic line between emitter and detector points without causing a significant loss in the original signal. The fiber optic tap connector includes a shear having an outwardly extending cutting surface below a window through which the signal is emitted after the tapping procedure has been performed.

Fiber Optic Cable Retainer

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US Patent:
50077023, Apr 16, 1991
Filed:
Jan 30, 1990
Appl. No.:
7/472523
Inventors:
Eugene E. Segerson - Tempe AZ
International Classification:
G02B 626
US Classification:
350 9620
Abstract:
A fiber optic cable connection having easy cable insertion and greater pull strength is obtained by providing a cable connector (30) embodying a tapered, partially split sheath (38) around the cable (18) in a tapered hole (36) in the connector body (32) and a compression nut (34) for adjusting the compression of the partially split sheath (38). When the cable (18) is inserted, springy legs (42) on the tapered sheath (38) bend apart to allow easy insertion. When an attempt is made to withdraw the cable (18) ends (44) of legs (42) bite into the cable, resisting removal. The compression nut (34) permits disassembly of the connector (30) if desired and allows adjustment of the cable clamping force. The tapered sheath (38) may be easily removed without damage to the cable (18).

Apparatus Employing Reflective Optical Means

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US Patent:
49029037, Feb 20, 1990
Filed:
Oct 27, 1988
Appl. No.:
7/263652
Inventors:
Eugene E. Segerson - Tempe AZ
David L. Vowles - Phoenix AZ
David D. Hanson - Scottsdale AZ
International Classification:
G01N 2186
US Classification:
250561
Abstract:
An improved vehicle height sensor and automotive leveling system are described using, in a preferred embodiment, two optical emitter-receiver pairs mounted in the sidewall or dust cover of a standard automotive air shock. The emitter-receiver pairs are arranged to operate by reflecting light from the central shaft of the shock absorber. Each emitter-receiver pair provides a light path that lies in a plane substantially perpendicular to the extension direction of the shock. The two emitter receiver pairs are spaced apart along the extension direction of the shock. Movement of the internal piston of the shock successively interrupts (by absorption) the light paths of the emitter-receiver pairs so as to provide a positive indication of the location of the movable piston and hence the height of the shock and the height of vehicle body above the road. The emitter-receiver pairs are mounted in a common assembly and seal to the shock dust cover through a single hole. They are convenient to manufacture in a single module which includes the control logic needed to add to remove fluid from the shock to maintain it in reference position independent of the vehicle load.

Bracket For Attaching Pin-In-Hole Components To A Surface Mount Board

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US Patent:
58391894, Nov 24, 1998
Filed:
Apr 3, 1995
Appl. No.:
8/415714
Inventors:
Michael R. Pomeroy - Prescott AZ
Eugene E. Segerson - Gilbert AZ
Assignee:
Emerson Electric Co. - St. Louis MO
International Classification:
H07R 909
US Classification:
29839
Abstract:
A bracket assembly and method for attaching pin-in-hole components and daughter boards to a surface mount printed circuit board which alleviates the problem of the limited peel strength of the interconnect patterns on the surface of surface mount boards and also prevents these components from being subjected to the heat of soldering techniques such as reflow soldering.
Eugene E Segerson from Mesa, AZ, age ~96 Get Report