Eric Edwin Phones & Addresses
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1830 Palace Dr, New Braunfels, TX 78130 (830) 620-8416
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203 Rosedale Ave, West Chester, PA 19382 (610) 918-7240
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Cypress, TX
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Cerritos, CA
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18818 Roselake Dr, Tomball, TX 77375
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Seguin, TX
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1830 Palace Dr, New Braunfels, TX 78130
Work
Position:
Professional/Technical
Emails
e***n@dcci.com
Business Records
Name / Title
Company / Classification
Phones & Addresses
President
BUSINESS PROCESS IMPROVEMENTS, LLC
1830 Palace Dr, New Braunfels, TX 78130
PO Box 312531, New Braunfels, TX 78131
PO Box 312531, New Braunfels, TX 78131
Owner
Business Process Imp
Business Services
Business Services
1830 Palace Dr, New Braunfels, TX 78130
VICE PRESI, Vice President
UNIWORLD CONSULTING INC
17785 Ctr Ct Dr N STE 700, Cerritos, CA 90703
1830 Palace Dr, New Braunfels, TX 78130
1830 Palace Dr, New Braunfels, TX 78130
Publications
Us Patents
Multilayer Rigid-Flex Printed Circuit Boards For Use In Infrared Reflow Oven And Method For Assembling Same
View pageUS Patent:
51783185, Jan 12, 1993
Filed:
Jun 6, 1991
Appl. No.:
7/711331
Inventors:
Eric R. Edwin - Tomball TX
James J. Tumlinson - Tomball TX
Jerome A. Wilson - Houston TX
Thad C. McMillan - Spring TX
Rollin G. Meyer - Hockley TX
Darryl J. McKenney - Milford NH
James J. Tumlinson - Tomball TX
Jerome A. Wilson - Houston TX
Thad C. McMillan - Spring TX
Rollin G. Meyer - Hockley TX
Darryl J. McKenney - Milford NH
Assignee:
Compaq Computer Corp. - Houston TX
International Classification:
H05K 334
US Classification:
2281802
Abstract:
A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.
Multilayer Rigid-Flex Printed Circuit Boards For Use In Infrared Reflow Oven And Method For Assembling Same
View pageUS Patent:
52625940, Nov 16, 1993
Filed:
Oct 12, 1990
Appl. No.:
7/596479
Inventors:
Eric R. Edwin - Tomball TX
James J. Tumlinson - Tomball TX
Jerome A. Wilson - Houston TX
Thad C. McMillan - Spring TX
Rollin G. Meyer - Hockley TX
Darryl J. McKenney - Milford NH
James J. Tumlinson - Tomball TX
Jerome A. Wilson - Houston TX
Thad C. McMillan - Spring TX
Rollin G. Meyer - Hockley TX
Darryl J. McKenney - Milford NH
Assignee:
Compaq Computer Corporation - Houston TX
Teledyne Industries, Inc. - Los Angeles CA
Teledyne Industries, Inc. - Los Angeles CA
International Classification:
H05K 100
US Classification:
174254
Abstract:
A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.