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Elik A Gershenzon

from Daly City, CA
Age ~79

Elik Gershenzon Phones & Addresses

  • 1551 Southgate Ave, Daly City, CA 94015 (650) 991-4690
  • San Bruno, CA
  • Santa Clara, CA
  • San Francisco, CA
  • San Mateo, CA
  • 1551 Southgate Ave APT 327, Daly City, CA 94015 (650) 743-6698

Work

Position: Professional/Technical

Education

Degree: High school graduate or higher

Resumes

Resumes

Elik Gershenzon Photo 1

Sn Mechanical Engineer

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Location:
Daly City, CA
Industry:
Industrial Automation
Work:
Quartet Mechanics
Sn Mechanical Engineer
Education:
Moscow State University of Instrument Engineering and Computer Sciences (Mgupi) 1968 - 1974
Master of Science, Masters, Mechanical Engineering
Elik Gershenzon Photo 2

Elik Gershenzon

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Publications

Us Patents

Method And Apparatus For Preventing Transfer Of An Object Having Wrong Dimensions Or Orientation

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US Patent:
6831287, Dec 14, 2004
Filed:
Oct 15, 2001
Appl. No.:
09/976890
Inventors:
Boris Kesil - San Jose CA
David Margulis - Campbell CA
Elik Gershenzon - Daly City CA
Assignee:
MultiMetrixs, LLC - Santa Clara CA
International Classification:
G01N 2186
US Classification:
2505593, 25055915, 356638
Abstract:
The invention describes an apparatus for preventing gripping of objects having wrong dimensions or orientation. The apparatus comprises a part handler, e. g. , a holder for parts to be treated in a chemical reactor, where the parts has to be transferred from a working position to a temporary storage. The holder may have different shapes, e. g. , rectangular, elliptical, or circular, and is provided with positioning openings or recesses for engagement with pins or semispherical elements on the engaging surface of the part handler. The apparatus is provided with at least two through beam optical sensor units with adjustable divergence of the light beams emitted from the light emitting to the light-receiving element. The sensor units are located near the edge area of the holder. Position of the holder for aligning with the part handler is determined by combined interaction of the holder edge with the sensor units so that, depending on overlapping of one or two sensors and on the position of the overlapped zone, the apparatus determines whether or not the holder is aligned with the part handler or the gripping operation has to be rejected.

Apparatus And Method For Multiple Identical Continuous Records Of Characteristics On The Surface Of An Object After Selected Stages Of Manufacture And Treatment

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US Patent:
6842025, Jan 11, 2005
Filed:
Oct 29, 2003
Appl. No.:
10/695173
Inventors:
Elik Gershenzon - Daly City CA, US
Boris Kesil - San Jose CA, US
Leonid Velikov - San Carlos CA, US
Yuri Vorobyev - San Carlos CA, US
Assignee:
MultiMetrixs L.L.C. - Santa Clara CA
International Classification:
G01R 3102
G01N 2100
US Classification:
324759, 356 73
Abstract:
An apparatus of the invention is intended for multiple identical continuous records of characteristics on the surface of an object, e. g. , a semiconductor wafer, after selected stages of manufacture and treatment. The apparatus is provided with a rotary table for rotation of the wafer with a mechanism for installing the wafer in a predetermined initial position for starting measurements from the same point after each selected stage of manufacture or treatment. The measurements are synchronized for all sequential manufacturing stages of the wafer and are carried out with the use of a resonance sensor based on the principles of resonance sensor technology. The recorded information is stored on a memory device, and if the final product has a defect or deviations, the stored information can be easily retrieved for revealing the time, place on the product, and the source of the defect. The same records can also be used for correlation between the defects or deviations and the failure of the final product on quality control and even during exploitation of the chip in a semiconductor device.

Leveling And Aligning Device

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US Patent:
7588386, Sep 15, 2009
Filed:
Aug 30, 2006
Appl. No.:
11/468745
Inventors:
Grzegorz Kielczewski - Forney TX, US
Elik Gershenzon - Daly City CA, US
Bogdan Berlinski - San Jose CA, US
Assignee:
Silicon Valley Automation - Forney TX
International Classification:
F16B 5/02
F16M 7/00
US Classification:
4034081, 403 14, 4034091, 2481884, 248650, 411435
Abstract:
Leveling and aligning device by which the distance at which a member is supported with respect to a base may be altered and firmly locked in the given adjustment without creating stresses in either the body of the member and the base or the device by itself. The leveling and aligning device allows continuation of the adjustment process even in case of inadvertent disengagement of components of the device.

Soft-Touch Gripping Mechanism For Flat Objects

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US Patent:
20040102858, May 27, 2004
Filed:
Nov 24, 2003
Appl. No.:
10/719411
Inventors:
Boris Kesil - San Jose CA, US
Elik Gershenzon - Daly City CA, US
International Classification:
G05B011/01
US Classification:
700/011000
Abstract:
A soft-touch gripping mechanism of the invention contains three gripping fingers arranged circumferentially around a circular flat object such as, e.g., a semiconductor wafer. The soft-tough force applied to the wafer from the gripping posts on the ends of the gripping fingers is controlled from a common force measurement sensor, e.g., a special position sensor that consists of a moveable magnetic flag attached to a pusher plate on the end of the output shaft of a linear stepper motor and a sensitive member, e.g. a Hall sensor chip that responds to the position of the magnetic flag. The Hall sensor produces an output voltage signal that is proportion to the position of the flag relative to the Hall sensor chip. The sensor is connected to a controller that also controls operation of the aforementioned linear stepper motor. The soft touch is achieved by transmitting the movement of the pusher to the linear fingers through a spring. In order to facilitate insertion of the distal finger into narrow slots between the flat objects, such as semiconductor wafers in the storage cassette, the distal post can be turned by an angle less 90. Reduced rotary sliding movement minimizes a chance of contamination of the wafer with products of wear.

End Effector With Force Controlling Mechanism

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US Patent:
20050281661, Dec 22, 2005
Filed:
Aug 8, 2005
Appl. No.:
11/197860
Inventors:
Boris Kesil - San Jose CA, US
Elik Gershenzon - Daly City CA, US
International Classification:
B66C023/00
US Classification:
414744500
Abstract:
A precision soft-touch end effector has a mounting plate attached to a robot arm. The plate supports a stepper motor. The output shaft of the stepper motor is connected through a spring to an elongated finger that slides in a central longitudinal slot of the plate and supports a first wafer gripping post, while on the end opposite to the first wafer gripping post the mounting plate pivotally supports two L-shaped fingers with a second and third wafer gripping posts on their respective ends. The mounting plate in combination with the first sliding finger and two pivotal fingers forms the end effector of the robot arm which is thin enough for insertion into a wafer-holding slot of a wafer cassette. The end effector is equipped with a mapping sensor for detecting the presence or absence of the preceding wafer, wafer position sensors for determining positions of the wafer with respect to the end effector, and force sensors for controlling the wafer gripping force. Several embodiments relate to different arrangements of gripping rollers and mechanisms for control of the gripping force and speed of gripping required for gripping the wafer with a soft and reliable touch.

Contamination-Free Edge Gripping Mechanism And Method For Loading/Unloading And Transferring Flat Objects

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US Patent:
20060157998, Jul 20, 2006
Filed:
Jan 18, 2005
Appl. No.:
11/036870
Inventors:
Elik Gershenzon - Daly City CA, US
Boris Kesil - San Jose CA, US
International Classification:
B25J 15/08
US Classification:
294103100
Abstract:
The griping mechanism of the present invention comprises a thin flat body having two linearly moveable side fingers and a pair of rotating and linearly moveable distal fingers. In contrast to gripper of conventional design, the gripping mechanism of the invention is positioned over the object. In spite of an overhead position, the gripper is contamination-free since it has a completely closed design. In the vicinity of the gripping fingers, the mechanism is provided with soft edge-supporting pads having tapered surfaces for self-alignment and centering of the circular objects. The pads also eliminate surface contact between the wafer and the surface of the gripper body. The overhead position of the gripper makes it possible to simplify the construction of a wafer-holding chuck, e.g., on wafer processing stations. The gripper has auxiliary object-uplifting means in the form of vacuum suction ports or blowing nozzles that generate a vortex effect for uplifting the objects to the level required for edge gripping.

Contamination-Free Edge Gripping Mechanism With Withdrawable Pads And Method For Loading/Unloading And Transferring Flat Objects

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US Patent:
20070018469, Jan 25, 2007
Filed:
Jul 25, 2005
Appl. No.:
11/188249
Inventors:
Elik Gershenzon - Daly City CA, US
Boris Kesil - San Jose CA, US
International Classification:
B65G 49/07
US Classification:
294103100
Abstract:
A wafer gripping mechanism of the invention comprises a thin flat body having one linearly moveable and rotating finger for gripping an edge of the flat object and a pair of soft withdrawable object supporting pads. A distinguishing feature of the mechanism of the invention is that the wafer supporting pads are withdrawable for placing the pads into position where they do not project beyond the outlines of the external surface of the insertable portion of the gripper. The absence of elements projecting from the surface of the gripper portion insertable into narrow spaces with high speed protects the gripping mechanism, wafer, chuck, etc. from damage due to possible collision. All the drive and actuation mechanisms that are used for rotation and axial movement of the gripping finger, as well as for rotation of the withdrawable pads are enclosed in a thin hollow casing made from a thin and light-weight sheet metal.

Method And Apparatus For Measuring Thickness Of Conductive Films With The Use Of Inductive And Capacitive Sensors

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US Patent:
6593738, Jul 15, 2003
Filed:
Sep 17, 2001
Appl. No.:
09/954550
Inventors:
Boris Kesil - San Jose CA, 95124
David Margulis - Campbell CA, 95130
Elik Gershenzon - Daly City CA, 94015
International Classification:
G01B 710
US Classification:
324230, 324226
Abstract:
The invention relates to an apparatus for measuring thickness and deviations from the thickness of thin conductive coatings on various substrates, e. g. , metal coating films in semiconductor wafer or hard drive disks. The thickness films may be as small as fractions of microns. The apparatus consists of an inductive sensor and a proximity sensor, which are rigidly interconnected though a piezo-actuator used for displacements of the inductive sensor with respect to the surface of the object being measured. Based on the results of the operation of the proximity sensor, the inductive sensor is maintained at a constant distance from the controlled surface. Variations in the thickness of the coating film and in the distance between the inductive sensor and the coating film change the current in the inductive coil of the sensor. The inductive sensor is calibrated so that, for a predetermined object with a predetermined metal coating and thickness of the coating, variations in the amplitude of the inductive sensor current reflect fluctuations in the thickness of the coating. The distinguishing feature of the invention resides in the actuating mechanism of microdisplacements and in the measurement and control units that realize interconnection between the proximity sensor and the inductive sensor via the actuating mechanism.
Elik A Gershenzon from Daly City, CA, age ~79 Get Report