Inventors:
Donald F. Foust - Scotia NY
Edward J. Lamby - Scotia NY
Bradley R. Karas - Amsterdam NY
William V. Dumas - Delanson NY
Elihu C. Jerabek - Glenmont NY
Assignee:
General Electric Company - Schenectady NY
International Classification:
B32B 300
B32B 700
B44C 122
H05K 100
Abstract:
An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electrolytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.