Inventors:
Paul D. Wohlfarth - Vernonia OR
Douglas R. Malech - Portland OR
Assignee:
Credence Systems Corporation - Fremont CA
International Classification:
G01R 3102
Abstract:
A probe assembly contacts pins of a flat pack or other integrated circuit (IC) package having a body with a flat upper surface and a plurality of pins extending horizontally outward from the IC package body. The probe assembly includes a base that is bonded to the upper surface of the IC package body by a thermal-releasing adhesive when the base is pressed onto the IC package body. A set of probes (spring pins) extending downward from the base contact the IC pins when the base is bonded to the IC package body. The base includes a heating element for supplying heat to warm the adhesive and weaken the adhesive bond when the probe assembly is to be removed from the IC package. The heating element generates the heat in response to a current pulse passing through the heating element or alternatively receives the heat from an external source and conducts it to the adhesive. The probe assembly also provides a base for mounting intelligent interface circuits that facilitate testing of the IC being probed and reduce the required number of connections between the probe assembly and external test equipment.