Doohan Lee Phones & Addresses
-
350 Elan Village Ln, San Jose, CA 95134 (408) 435-9243
-
903 Cherrywood Ct, San Jose, CA 95129 (408) 517-0370
-
Santa Clara, CA
-
Ithaca, NY
Business Records
Name / Title
Company / Classification
Phones & Addresses
CTO
M T H Engineers Inc
Engineering Services
Engineering Services
3350 Scott Blvd BLDG 11, Santa Clara, CA 95054
(408) 986-8558
(408) 986-8558
Publications
Us Patents
Methods For Reducing Delamination During Chemical Mechanical Polishing
View pageUS Patent:
7244168, Jul 17, 2007
Filed:
Mar 30, 2006
Appl. No.:
11/393278
Inventors:
Yufei Chen - San Jose CA, US
Lizhong Sun - San Jose CA, US
Doohan Lee - San Jose CA, US
Lizhong Sun - San Jose CA, US
Doohan Lee - San Jose CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B24B 49/00
B24B 1/00
B24B 1/00
US Classification:
451 5, 451 11, 451 41, 451285, 451286, 451287, 451288
Abstract:
Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.
Methods For Reducing Delamination During Chemical Mechanical Polishing
View pageUS Patent:
20040116052, Jun 17, 2004
Filed:
Oct 3, 2003
Appl. No.:
10/678906
Inventors:
Yufei Chen - San Jose CA, US
Lizhong Sun - San Jose CA, US
Doohan Lee - San Jose CA, US
Lizhong Sun - San Jose CA, US
Doohan Lee - San Jose CA, US
Assignee:
APPLIED MATERIALS, INC.
International Classification:
B24B049/00
US Classification:
451/057000
Abstract:
Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.