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Donglai Lu Phones & Addresses

  • San Diego, CA
  • Campo, CA
  • Imlay, NV
  • La Habra, CA
  • Chandler, AZ
  • Tempe, AZ
  • Walpole, MA
  • Richland, WA
  • Manson, WA
  • Imperial, CA

Work

Company: Pacific northwest national laboratory 2009 Position: Postdoctoral fellow

Education

School / High School: Arizona State University- Tempe, AZ 2009 Specialities: Ph.D. in Chemical Engineering

Resumes

Resumes

Donglai Lu Photo 1

Engineer

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Location:
Phoenix, AZ
Industry:
Chemicals
Work:
Intel Corporation - Phoenix, Arizona Area since 2012
Process TD Engineer

Beckman Coulter 2012 - 2012
Sr. Development Scientist

Siemens - Greater Boston Area 2011 - 2012
Sr Scientist

US Department of Energy - Richland/Kennewick/Pasco, Washington Area 2009 - 2011
Chemical Engineer

Arizona State University - Tempe, Arizona Aug 2004 - Oct 2009
Research associate
Education:
Arizona State University 2004 - 2009
Ph.D, Chemical engineering
Tianjin University 1997 - 2004
BS,MS, Chemical Engineering
Skills:
Materials Science
Electrochemistry
Design of Experiments
Chemical Engineering
Characterization
Nanotechnology
Chemistry
Thin Films
Process Simulation
R&D
Matlab
Materials
Scanning Electron Microscopy
Spectroscopy
Process Engineering
Powder X Ray Diffraction
Afm
Simulations
Polymers
Biotechnology
Uv/Vis
Technology Transfer
Medical Devices
Minitab
Cvd
Donglai Lu Photo 2

Customer Service Manager

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Location:
San Diego, CA
Industry:
Hospital & Health Care
Work:
Bd
Customer Service Manager

Philips Jan 2011 - Jun 2014
Delivery Project Manager

Ge Healthcare Jan 2010 - Dec 2010
Service It Solution Manager

Ge Healthcare Feb 2008 - Dec 2009
Hcit Service Leader

Ge Healthcare Apr 2005 - Jan 2008
Technical Support Engineer
Skills:
Training
Healthcare Information Technology
Troubleshooting
Technical Support
Healthcare
Leadership
Product Development
Dicom
Cross Functional Team Leadership
Donglai Lu Photo 3

Donglai Lu Tempe, AZ

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Work:
Pacific Northwest National Laboratory

2009 to 2000
Postdoctoral Fellow

Arizona State University
Tempe, AZ
2004 to 2009
Research Assistant

Tianjin HeHe Coating Inc

2001 to 2004
Process Engineer and R&D Manager

Education:
Arizona State University
Tempe, AZ
2009
Ph.D. in Chemical Engineering

Tianjin University
2004
M.S. in Chemical Engineering , China

Tianjin University
2001
B.S. in Chemical Engineering

Business Records

Name / Title
Company / Classification
Phones & Addresses
Donglai Lu
Board of Directors
Arizona State University
College/University
1001 S Mcallister Ave, Tempe, AZ 85287
(480) 965-9696

Publications

Us Patents

Luminescent Oxygen Channeling Immunoassay Utilizing Three Antibodies And Methods Of Production And Use Thereof

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US Patent:
20170176419, Jun 22, 2017
Filed:
Mar 24, 2015
Appl. No.:
15/128479
Inventors:
- Tarrytown NY, US
David J. LEDDEN - Medway MA, US
Eric Scott COWDEN - Waltham MA, US
Donglai LU - Chandler AZ, US
Assignee:
Siemens Healthcare Diagnostics Inc. - Tarrytown NY
International Classification:
G01N 33/53
G01N 21/76
G01N 33/58
G01N 33/543
G01N 33/542
Abstract:
A chemiluminescent detection system, as well as kits and microfluidics devices containing same, are disclosed. Methods of using the system, kits, and devices are also disclosed. The first, second, and third antibodies or binding fragments thereof may be provided in any form that allows these antibodies/binding fragments to function in accordance with the presently disclosed and claimed inventive concept(s). For example, each of the first, second, and third antibodies/binding fragments may be a polyclonal antibody/binding fragment or a monoclonal antibody/binding fragment.

Thermocompression Bonding Using Plasma Gas

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US Patent:
20170179070, Jun 22, 2017
Filed:
Dec 18, 2015
Appl. No.:
14/974823
Inventors:
Donglai David Lu - Chandler AZ, US
Jimin Yao - Chandler AZ, US
Amrita Mallik - Chandler AZ, US
George S. Kostiew - Chandler AZ, US
Shawna M. Liff - Scottsdale AZ, US
International Classification:
H01L 23/00
Abstract:
Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.
Donglai Lu from San Diego, CA, age ~47 Get Report