Donald G. Lockard - East Greenwich RI Karl S. Seelig - Jamestown RI
Assignee:
American Iron & Metal Company, Inc. - Montreal La Compagnie Americanine de Fer et Metaux, Inc. - Quebec
International Classification:
B08B 700 B08B 704
US Classification:
134 2
Abstract:
The invention provides methods for wiping metal contaminants from a surface, especially a circuit board assembly, or other surface exposed to solder paste, and solubilizing the wiping material. Metal contaminants are then easily and safely removed from the solubilized material for safe recycling and/or disposal.
Lead-Free Bismuth Free Tin Alloy Solder Composition
Karl F. Seelig - Jamestown RI Donald G. Lockard - North Providence RI
International Classification:
C22C 1300
US Classification:
420561
Abstract:
A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 93-98% tin, 1. 5-3. 5% silver, 0. 2-2. 0% copper, and 0. 2-2. 0% antimony. The alloy composition has a melting temperature of 210. degree. -215. degree. C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.
Lead-Free And Bismuth-Free Tin Alloy Solder Composition
Karl F. Seelig - Jamestown RI Donald G. Lockard - North Providence RI
International Classification:
C22C 1300
US Classification:
420561
Abstract:
A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 90. 3-99. 2% tin, 0. 5-3. 5% silver, 0. 1-2. 8% copper, and 0. 2-2. 0% antimony. The alloy composition has a melting temperature of 210. degree. -216. degree. C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.
