US Patent:
20110017627, Jan 27, 2011
Inventors:
Michael P. Wade - Chesterfield VA, US
Donald L. Hodapp - Midlothian VA, US
International Classification:
B65D 73/00
Abstract:
A packaging structure is disclosed. In accordance with one aspect, the structure includes a blister () including a flange () and a body portion (), a front card () defining a blister receiving opening and a first hang tab notch () therein, the blister receiving opening being sized and shaped to receive the body portion therethrough and prevent passage of the flange OC therethrough. The structure also includes a rear card () defining a second hang tab notch () therein; and a hang tab reinforcement card () defining a third hang tab notch () therein, wherein the first, second and third hang tab. notches are generally aligned and the front card is sealed to the rear card to secure the flange and the hang tab reinforcement card therebetween. Various substrates may be used to form the packaging structure. The structure may be provided with internal or external coatings to provide strength, printability, and adhesion between the various parts.