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Deborah Kaller Phones & Addresses

  • Coronado, CA
  • Green Valley, AZ
  • Auburn, CA
  • Austin, TX
  • 762 E Desert Flower Ln, Phoenix, AZ 85048
  • Tucson, AZ

Business Records

Name / Title
Company / Classification
Phones & Addresses
Deborah Kaller
Manager
GAIN VENTURES, LLC
45 W Calle Escudilla, Green Valley, AZ 85614
PO Box 93266, Phoenix, AZ 85070
Deborah S Kaller
Manager
PARALLEL SEMICONDUCTOR, LLC
45 W Calle Escudilla, Green Valley, AZ 85614
PO Box 93266, Phoenix, AZ 85070

Publications

Us Patents

Implementing Micro Bga Assembly Techniques For Small Die

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US Patent:
6655022, Dec 2, 2003
Filed:
Sep 24, 1998
Appl. No.:
09/160535
Inventors:
Steven R. Eskildsen - Folsom CA
Richard B. Foehringer - Shingle Springs CA
Deborah S. Kaller - Auburn CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 328
US Classification:
29841, 29827, 29832, 438111, 438112, 438126, 438127, 257778, 257779, 257791
Abstract:
A method of implementing a micro BGA is introduced. More specifically, the method discloses packaging an integrated circuit into an integrated circuit assembly. The method first mounts polyimide tape to a lead frame. The polyimide tape serves as a substrate for the integrated circuit package. Next, a piece of elastomer is coupled to said polyimide tape. Then an integrated circuit die is attached to said elastomer. Lead beams are then bonded from bond pads on said die to said lead frame. Solder balls are attached to said lead frame. The attached solder balls may be located beyond the area of said die.

Implementing Micro Bgatm Assembly Techniques For Small Die

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US Patent:
20020079120, Jun 27, 2002
Filed:
Aug 30, 1999
Appl. No.:
09/385924
Inventors:
STEVEN R. ESKILDSEN - FOLSOM CA, US
RICHARD B. FOEHRINGER - SHINGLE SPRINGS CA, US
DEBORAH S. KALLER - AUBURN CA, US
International Classification:
H01L023/02
US Classification:
174/052400
Abstract:
The present invention introduces a method of implementing micro BGA. More specifically, the present invention discloses a method of packaging an integrated circuit into an integrated circuit assembly. The method of the present invention first mounts polyimide tape to a lead frame. The polyimide tape serves as a substrate for the integrated circuit package. Next, a piece of elastomer is coupled to said polyimide tape. Then an integrated circuit die is attached to said elastomer. Lead beams are then bonded from bond pads on said die to said lead frame. Solder balls are attached to said lead frame. The attached solder balls may be located beyond the area of said die.
Deborah Sue Kaller from Coronado, CA, age ~64 Get Report