Inventors:
Steven R. Eskildsen - Folsom CA
Richard B. Foehringer - Shingle Springs CA
Deborah S. Kaller - Auburn CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 328
US Classification:
29841, 29827, 29832, 438111, 438112, 438126, 438127, 257778, 257779, 257791
Abstract:
A method of implementing a micro BGA is introduced. More specifically, the method discloses packaging an integrated circuit into an integrated circuit assembly. The method first mounts polyimide tape to a lead frame. The polyimide tape serves as a substrate for the integrated circuit package. Next, a piece of elastomer is coupled to said polyimide tape. Then an integrated circuit die is attached to said elastomer. Lead beams are then bonded from bond pads on said die to said lead frame. Solder balls are attached to said lead frame. The attached solder balls may be located beyond the area of said die.