David A Albertalli

7160105, Jan 9, 2007

May 31, 2002

10/479078

Charles O. Edwards - Pleasanton CA, US
David Albertalli - San Jose CA, US
Oleg Gratchev - San Jose CA, US

Litrex Corporation - Pleasanton CA

B23B 5/22

432258, 279 3

A temperature controllable vacuum chuck includes a mounting bracket, a porous plate, a heating element, and a temperature sensor. The porous plate is mounted to the mounting bracket and is configured for securing a substrate to the vacuum chuck when air is suctioned out of the vacuum chuck. The heating element is attached to the bottom of the porous plate and uniformly heats the porous plate, thereby heating any substrate mounted on the vacuum chuck and enabling control over the cure rate of fluid materials deposited on the substrate. The temperature sensor measures the temperature of the porous plate so that it can be adjusted when desired with a user controllable temperature control component.

7244310, Jul 17, 2007

May 31, 2002

10/479316

Charles O. Edwards - Pleasanton CA, US
David Albertalli - San Jose CA, US
Howard Walter Bielich - Brentwood CA, US
James Middleton - Brentwood CA, US

Litrex Corporation - Pleasanton CA

B05C 11/10

118669, 118698, 118702, 118703, 427 9, 427 10, 427 8

A microdeposition system () and method deposits precise amounts of fluid material onto a substrate. A microdeposition head () includes a plurality of spaced nozzles that fire droplets having a deposited width when deposited on the substrate. A positioning device moves the microdeposition head () relative to the substrate at a head speed. A controller () generates over-clocking signals at a rate that is substantially greater than the head speed divided by the droplet width to improve resolution. The controller () includes a positioning module that generates position control signals for the positioning device. The controller () includes a nozzle firing module () that generates nozzle firing commands based on the over-clocking rate to fire the nozzles to form droplets that define features on the substrate.

7270712, Sep 18, 2007

May 31, 2002

10/479318

Charles O. Edwards - Pleasanton CA, US
David Albertalli - San Jose CA, US
Howard Walter Bielich - Brentwood CA, US
James Middleton - Brentwood CA, US
Scott R. Bruner - San Jose CA, US

Litrex Corporation - Pleasanton CA

B05C 11/10

118669, 118698, 118702, 118703, 427 9, 427 10, 427 8, 347 5, 347 9, 347 10, 347 11

A microdeposition system () and method deposits precise amounts of fluid material onto a substrate. A microdeposition head () includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller () includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head () and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.

7449070, Nov 11, 2008

May 31, 2002

10/479323

Charles O. Edwards - Pleasanton CA, US
David Albertalli - San Jose CA, US
James Middleton - Brentwood CA, US
George Fellingham - San Jose CA, US

ULVAC, Inc. - Kanagawa

B05C 11/10

118665, 118669, 118699, 4274272, 347 9, 347 10, 347 11, 347 12, 347 13

A microdeposition system () and method includes a head with a plurality of nozzles (). A controller () generates nozzle firing commands that selectively fire the nozzles to create a desired feature pattern. Configuration memory stores voltage waveform parameters that define a voltage waveform () for each of the nozzles. A digital to analog converter (DAC) sequencer communicates with the configuration memory and the controller and outputs a first voltage waveform for a first nozzle when a nozzle firing command for the first nozzle is received from the controller (). A resistive ladder DAC receives the voltage waveforms from the DAC sequencer. An operational amplifier (opamp) communicates with the resistive ladder DAC and amplifies the voltage waveforms. The nozzles fire droplets when the voltage waveforms received from the opamp exceed a firing threshold of the nozzle ().

7611754, Nov 3, 2009

Nov 27, 2002

10/535997

Charles O. Edwards - Pleasanton CA, US
David Albertalli - San Jose CA, US

ULVAC, Inc.

B05D 1/32

427466, 427468, 427479, 427504, 118669, 118679, 118680

A microdeposition system microdeposit droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define subfeatures of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.

7757632, Jul 20, 2010

Oct 6, 2008

12/245893

Charles O. Edwards - Pleasanton CA, US
David Albertalli - San Jose CA, US
James Middleton - Brentwood CA, US
George Fellingham - San Jose CA, US

Ulvac, Inc. - Chigasaki, Kanagawa

B05C 11/10

118669, 118695, 118699, 4274272, 347 9, 347 10, 347 11, 347 12, 347 13

A microdeposition system and method includes a head with a plurality of nozzles. A controller generates nozzle firing commands that selectively fire the nozzles to create a desired feature pattern. Configuration memory stores voltage waveform parameters that define a voltage waveform for each of the nozzles. A digital to analog converter (DAC) sequencer communicates with the configuration memory and the controller and outputs a first voltage waveform for a first nozzle when a nozzle firing command for the first nozzle is received from the controller. A resistive ladder DAC receives the voltage waveforms from the DAC sequencer. An operational amplifier (opamp) communicates with the resistive ladder DAC and amplifies the voltage waveforms. The nozzles fire droplets when the voltage waveforms received from the opamp exceed a firing threshold of the nozzle.

7815965, Oct 19, 2010

Sep 18, 2009

12/562494

Charles O. Edwards - Pleasanton CA, US
David Albertalli - Santa Clara CA, US

Ulvac, Inc. - Kanagawa

B05D 1/32
B05D 5/12

427 66, 427 58, 427 79, 427 984, 427102, 427282, 427466, 427468, 427479, 427504, 118300, 118669, 118679, 118680, 118696

A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.

7887156, Feb 15, 2011

Apr 25, 2006

11/912217

James N. Middleton - Brentwood CA, US
David Albertalli - Santa Clara CA, US
Paul A. Parks - Austin TX, US
Daniel Sramek - San Jose CA, US

Ulvac, Inc. - Kanagawa

B41J 2/015

347 20, 347 40, 347 37, 347 5

The present invention relates to an integral printhead assembly for use in association with an industrial printing apparatus. The integral printhead assembly is a self-contained unit which can be quickly removed and replaced with another assembly with minimum downtime to the printing apparatus.