David G Addison

20070107186, May 17, 2007

Nov 4, 2005

11/266208

David Addison - Baltimore MD, US
Travis Steinmetz - New Market MD, US

Symbol Technologies, Inc. - Holtsville NY

B21D 39/03

029428000

A method, system, and apparatus for transferring dies to respective substrates is described. Conventional techniques include vision-based systems that pick and place dies one at a time onto substrates. The present invention can transfer multiple dies simultaneously or consecutively. Dies are loaded in a channel of a die application device. The dies are moved through the channel using any of a variety of means, such as gravity, air, vibration, a brush, a spring, etc. The die application device dispenses the dies onto respective substrates. In an aspect, the die application device independently dispenses each of the dies. In another aspect, the die application device dispenses multiple dies at a time.

20070131016, Jun 14, 2007

Dec 13, 2005

11/299896

David Addison - Baltimore MD, US
William Bandy - Gambrills MD, US
David Eastin - Upton MA, US
Michael Arneson - Finksburg MD, US

Symbol Technologies, Inc. - Holtsville NY

B21J 7/16

072402000

Dies that are attached to a die plate can be transferred to a substrate. An actuator can be used to cause a die to be released from the die plate and to come into contact with the substrate. For example, the die may cover a corresponding hole in the die plate. The actuator can move a pin into the hole in the die plate, thereby pushing the die from the die plate. The actuator may be actuated by an electromagnetic stimulus. For instance, a solenoid having windings around a tubular core may provide the electromagnetic stimulus to the actuator. Current may be provided to the windings of the solenoid to generate the electromagnetic stimulus that actuates the actuator. The actuator may be provided in the tubular core of the solenoid.

20070158024, Jul 12, 2007

Jan 11, 2006

11/329134

David Addison - Baltimore MD, US
Travis Steinmetz - New Market MD, US

Symbol Technologies, Inc. - Holtsville NY

B29C 63/00

156344000

Methods, systems, and apparatuses for removing dies attached to a support element are described. The support element has a first surface to which the dies are attached and a second surface that opposes the first surface. In a first example, a first vacuum is applied to the second surface outside an area defined on the second surface. At least one force element applies a force to the second surface inside the area, thereby moving a plurality of dies with respect to other dies. In a second example, heat is applied to an adhesive between the first surface and the plurality of dies to at least partially deactivate the adhesive. A second vacuum is applied to the plurality of dies to remove the plurality of dies from the first surface.

20140272503, Sep 18, 2014

Mar 15, 2013

13/835263

SAFT - , US
Bridget DEVENEY - Baltimore MD, US
David ADDISON - Baltimore MD, US

SAFT - Bagnolet

H01M 10/04

429 94, 296231, 296234

An electrochemical cell including an electrode assembly including a winding core, a first electrode, a second electrode, and a separator, the first electrode, the second electrode, and the separator being wound around the winding core, a current collector connected to the first electrode, and a case that accommodates the wound electrode assembly and the current collector. The winding core is welded to the current collector.