Daoji Gan Phones & Addresses
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s
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5831 Marble Cir, Johnston, IA 50131
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5842 NW 52Nd St, Johnston, IA 50131
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Normal, IL
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Prospect, KY
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Louisville, KY
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9268 Cranmere St, Indianapolis, IN 46229 (317) 895-6735
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Broadview Heights, OH
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Atlanta, GA
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Saint Louis, MO
Publications
Us Patents
Photosensitive Dielectric Resin Compositions, Films Formed Therefrom And Semiconductor And Display Devices Encompassing Such Films
View pageUS Patent:
7858721, Dec 28, 2010
Filed:
Apr 27, 2009
Appl. No.:
12/387025
Inventors:
Dino Amoroso - Medina OH, US
Brian Bedwell - Brecksville OH, US
Andrew Bell - Lakewood OH, US
Edmund Elce - Lakewood OH, US
Rajesh Raja Puthenkovilakom - North Royalton OH, US
Ramakrishna Ravikiran - Strongsville OH, US
Robert Shick - Strongsville OH, US
Xiaoming Wu - Strongsville OH, US
Hiroaki Makabe - Tokyo, JP
Yasunori Takahashi - Tokyo, JP
Etsu Takeuchi - Tokyo, JP
Daoji Gan - Indianapolis IN, US
Seok Ho Kang - Marlborough MA, US
Brian Bedwell - Brecksville OH, US
Andrew Bell - Lakewood OH, US
Edmund Elce - Lakewood OH, US
Rajesh Raja Puthenkovilakom - North Royalton OH, US
Ramakrishna Ravikiran - Strongsville OH, US
Robert Shick - Strongsville OH, US
Xiaoming Wu - Strongsville OH, US
Hiroaki Makabe - Tokyo, JP
Yasunori Takahashi - Tokyo, JP
Etsu Takeuchi - Tokyo, JP
Daoji Gan - Indianapolis IN, US
Seok Ho Kang - Marlborough MA, US
Assignee:
Promerus LLC - Brecksville OH
International Classification:
C08F 232/02
G03F 7/004
G03F 7/004
US Classification:
526281, 4302701, 430905
Abstract:
Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
Photosensitive Dielectric Resin Compositions, Films Formed Therefrom And Semiconductor And Display Devices Encompassing Such Films
View pageUS Patent:
20060008734, Jan 12, 2006
Filed:
Jul 1, 2005
Appl. No.:
11/171391
Inventors:
Dino Amoroso - Medina OH, US
Brian Bedwell - Brecksville OH, US
Andrew Bell - Lakewood OH, US
Edmund Elce - Lakewood OH, US
Rajesh Puthenkovilakom - North Royalton OH, US
Ramakrishna Ravikiran - Strongsville OH, US
Robert Shick - Strongsville OH, US
Xiaoming Wu - Strongsville OH, US
Hiroaki Makabe - Tokyo, JP
Yasunori Takahashi - Tokyo, JP
Etsu Takeuchi - Tokyo, JP
Daoji Gan - Indianapolis IN, US
Seok Kang - Marlborough MA, US
Brian Bedwell - Brecksville OH, US
Andrew Bell - Lakewood OH, US
Edmund Elce - Lakewood OH, US
Rajesh Puthenkovilakom - North Royalton OH, US
Ramakrishna Ravikiran - Strongsville OH, US
Robert Shick - Strongsville OH, US
Xiaoming Wu - Strongsville OH, US
Hiroaki Makabe - Tokyo, JP
Yasunori Takahashi - Tokyo, JP
Etsu Takeuchi - Tokyo, JP
Daoji Gan - Indianapolis IN, US
Seok Kang - Marlborough MA, US
International Classification:
G03C 1/492
US Classification:
430270100
Abstract:
Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.