Search

Daniel E Shier

from Olympia, WA
Age ~59
Get Report
Also known as:
Daniel Edward Shier, Daniel S Shier, Daniel A Shier, Dan E Shier, Daniel E Pratt, Amy Shier, Dan Sheir
Phone and address:
8121 Ski View Ln, Olympia, WA 98512
(360) 357-9946
Related to:
Hannah Shier, 22
Connected to:
Alexandra L Shier, 32Cathy C Shier, 66Cheryl K Shier, 76David G Shier, 83Janice M Shier, 44Jonathan T Shier, 36Laura B Shier, 35Lisa M Shier, 57Sara E Shier, 35Stephanie L Shier, 40

Daniel Shier Phones & Addresses

  • 8121 Ski View Ln, Olympia, WA 98512 (360) 357-9946
  • 7514 Cattail Ln SW, Olympia, WA 98512
  • 10710 7Th Ave SE, Olympia, WA 98513
  • Tumwater, WA
  • Shelton, WA
  • Dallas, TX
  • Manson, WA
  • San Mateo, CA

Work

Position: Machine Operators, Assemblers, and Inspectors Occupations

Education

Degree: Associate degree or higher

Emails

d***[email protected]

Specialities

International Law • Corporate Law

Professional Records

Lawyers & Attorneys

Daniel Shier Photo 1

Daniel Shier - Lawyer

View page
Specialties:
International Law
Corporate Law
ISLN:
903768021
Admitted:
1983
University:
Columbia University, B.A., 1977
Law School:
Emory University, J.D., 1982

Publications

Us Patents

Design And Assembly Methodology For Reducing Bridging In Bonding Electronic Components To Pads Connected To Vias

View page
US Patent:
20020084312, Jul 4, 2002
Filed:
Dec 29, 2000
Appl. No.:
09/751433
Inventors:
Daniel Shier - Olympia WA, US
Phil Geng - Portland OR, US
Scott Dixon - Portland OR, US
International Classification:
B23K031/02
B23K020/14
US Classification:
228/180220, 228/180100, 228/041000
Abstract:
An apparatus, comprising a substrate having a surface, comprising one or more solder pads, each having a center and connected to a via, each via having a center; positioned relative to the surface such that at least one of the one or more solder pad centers is offset from the connecting via center and an area of the at least one of the one or more solder pads overlaps an area of the connecting via.

Integrated Circuit Chip Attachment Using Local Heat Source

View page
US Patent:
20160351526, Dec 1, 2016
Filed:
Mar 29, 2014
Appl. No.:
15/117500
Inventors:
- Santa Clara CA, US
Daniel Edward Shier - Olympia WA, US
Viktor Vogman - Olympia WA, US
Jonathan William Thibado - Beaverton OR, US
Joshua David Heppner - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/00
Abstract:
Integrated circuit chip attachment is described using a local heat source. In one example an interposer has a top side to connect to a silicon component and a bottom side to connect to a circuit board, the top side having a plurality of contact pads to electrically connect to the silicon component using solder. The interposer a plurality of heater traces having connection terminals. A removable control module attaches over the interposer and silicon component to conduct a current to the heater connection terminals to heat the heater traces, to melt a solder on the contact pads of the interposer and to form a solder joint between the component and the interposer.
Control profile
Daniel E Shier from Olympia, WA, age ~59 Get Report