Daniel Kai Yeh Huang

6435350, Aug 20, 2002

Mar 23, 1998

09/046027

Frank F. J. Huang - Tustin CA
Daniel Huang - Tustin CA

Durabag Co., Inc. - Tustin CA

B65D 3314

206554, 383 37

A pack of self-opening plastic bags adapted for use with a bagging rack. Each plastic bag preferably has an extension portion extending above an open mouth of the bag. At least one bag pack suspension aperture is formed at an upper region of the bag and is adapted for use in suspending the bag pack on a bagging rack. A carrying handle aperture is formed through an upper region of the bag pack. Areas of compression bonds are formed adjacent upper regions of the bag pack, the handle carrying apertures, and/or the suspension aperture.

6438928, Aug 27, 2002

Dec 15, 2000

09/738489

Daniel C. Huang - Tustin CA
Frank F. J. Huang - Tustin CA
Frank Pannier - Irvine CA

Supertonics, LLC - Tustin CA

B65B 506

53473, 53249

A device for use in boxing pliable objects having a footprint into boxes. The boxing device includes a trapdoor unit, a box conveying unit, a tamping unit, and a control unit. The trapdoor unit has coplanar sliding trays that are adapted to be rapidly and simultaneously moved apart from a horizontal closed position, wherein the trays are close together with each, to a horizontal opened position, wherein the trays are slid apart by a distance sufficiently large to pass the footprint of the plurality of objects and permit the objects to fall therethrough in a flat manner into open boxes below. The box conveying unit moves empty open boxes to a position underneath the trapdoor unit. The tamping unit has tamping plates which tamps the objects into the box, and the control unit which controls the operation of the trapdoor unit, the box conveying unit, and the tamping unit.

6446810, Sep 10, 2002

Dec 18, 2000

09/740347

Daniel C. Huang - Tustin CA
Frank F. J. Huang - Tustin CA

Durabag Co., Inc. - Tustin CA

B65D 3314

206554, 383 9

A pack of self-opening bags with a front, rear, and co-joined side walls, with front and rear tabs extending from top edges of the front and rear walls. The tabs have a curved aperture slits therein, and the tabs are frangibly adhered together with contact adhesive. The slit has a main cut section, a first curved end section at one end, and a second curved end section at the opposite end. The first curved section has a curve that extends upwardly and inwardly from the main cut section. The second curved section has a substantially semi-circular curve that extends from the main cut section in a direction towards the bottom edge of the tab and has an end that is substantially perpendicular to and adjacent the main cut section. In one embodiment, the first curved section is dashed.

6560108, May 6, 2003

Feb 16, 2000

09/504637

Ching P. Lo - Rancho Palos Verdes CA
Daniel A. Huang - West Hills CA
Pete Hudson - Escondido CA

Hughes Electronics Corporation - El Segundo CA

H05K 720

361704, 361702, 257707, 174 163

A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink assembly has an integrated circuit die coupled to a second printed wiring board. Preferably, the heat sink assembly and the chip scale package assembly are assembled separately then assembled together. The circuit pads on the first printed wiring board correspond with circuit pads on the second printed wiring board. The circuit pads may be coupled together by solder or adhesive bonding. The circuit pads on the first printed wiring board may have solder balls formed of high temperature solder that do not melt when the heat sink assembly is assembled with chip scale package assembly. The solder balls allow chip scale package assembly to maintain a predetermined distance from the circuit pads on the second printed wiring board.

6573124, Jun 3, 2003

May 3, 1999

09/304459

Shih Chou - Cerritos CA
Steven R. Felstein - Redondo Beach CA
Ching P. Lo - Rancho Palos Verdes CA
Daniel A. Huang - Canoga Park CA
Richard Fanucchi - Fountain Valley CA
Gregory L. Mayhew - El Segundo CA
Lydia H. Simanyi - late of Santa Ana CA

Hughes Electronics Corp. - Los Angeles CA

H01L 2148

438126, 438127, 295272, 29841, 29855

A chip-on-board electronic device includes an electronic device die affixed to a printed circuit board, and electrically interconnected thereto by wirebonds. The electronic device is protected by coating it with a layer of silicon oxynitride and, optionally, an overlying thin layer of a conformal coating such as parylene. Under some circumstances, a protective layer of an organic material may be used instead of the layer of silicon oxynitride. The chip-on-board electronic device may be protected with an overlying layer of the conformal coating.

6757968, Jul 6, 2004

Aug 30, 2002

10/232273

Ching P. Lo - Rancho Palos Verdes CA
Daniel A. Huang - West Hills CA
Pete Hudson - Escondido CA

The Boeing Company - Chicago IL

H05K 334

29840, 29831, 29832, 29847, 29852, 361702, 361704, 361719, 257E2151, 257E23063, 174 163, 174260

A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink assembly has an integrated circuit die coupled to a second printed wiring board. Preferably, the heat sink assembly and the chip scale package assembly are assembled separately then assembled together. The circuit pads on the first printed wiring board correspond with circuit pads on the second printed wiring board. The circuit pads may be coupled together by solder or adhesive bonding. The circuit pads on the first printed wiring board may have solder balls formed of high temperature solder that do not melt when the heat sink assembly is assembled with chip scale package assembly. The solder balls allow chip scale package assembly to maintain a predetermined distance from the circuit pads on the second printed wiring board.

D616360, May 25, 2010

Mar 30, 2009

29/334607

Daniel Huang - Santa Ana CA, US

1302

D13103

D616361, May 25, 2010

Mar 30, 2009

29/334612

Daniel Huang - Santa Ana CA, US

1302

D13103