Inventors:
Clyde L. Zachry - La Habra CA
Andrew J. Niedzwiecke - Perris CA
Assignee:
Rockwell International Corporation - El Segundo CA
International Classification:
B41M 308
Abstract:
A process for making an interconnect system for a multilayer circuit pattern. The interconnect system is formed having minimized through-hole space consumption so as to be suitable for high density, closely meshed circuit patterns.