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Christian W Baks

from Pleasant Valley, NY
Age ~49
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Also known as:
Christian Fox
Phone and address:
1269 Salt Point Tpke, Pleasant Valley, NY 12569
Related to:
Mary Jane Murray, 85Daniel Paul Wickland, 34Thomas Wickland, 38Heidi L Baks, 54David W Gundlach, 54Heidi L Wickland, 54Marylyn L Wickland, 87Christopher T Gundlach, 34Thomas Wickland, 43
Connected to:
Esther Baks, 101Christina L Baksa, 51Lauren Baksa, 42Nancy B Baksa, 77Patrick M Baksa, 36Madhu Baksani, 43Vartan Baksarian, 64Marcie J Baksay, 59Adnan Baksh, 42Dexter W Baksh, 54

Christian Baks Phones & Addresses

  • 1269 Salt Point Tpke, Pleasant Vly, NY 12569
  • Pleasant Valley, NY
  • 6 Durocher Ter, Poughkeepsie, NY 12603
  • Scotia, NY

Work

Company: Ibm 2001 Position: Staff engineer

Education

School / High School: University at Albany, Suny 1998 to 2001

Skills

Semiconductors • Testing • Simulations • Electronics • R&D • Engineering Management • Perl • Research and Development • High Speed Pcb Design • High Speed Design • Packaging Design

Industries

Research

Resumes

Resumes

Christian Baks Photo 1

Advisory Engineer At Ibm

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Location:
15 Polk Ct, North Potomac, MD 20878
Industry:
Research
Work:
Ibm
Staff Engineer
Ibm
Advisory Engineer at Ibm
Education:
University at Albany, Suny 1998 - 2001
Skills:
Semiconductors
Testing
Simulations
Electronics
R&D
Engineering Management
Perl
Research and Development
High Speed Pcb Design
High Speed Design
Packaging Design

Publications

Us Patents

Integrated Electromechanical Relays

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US Patent:
8436701, May 7, 2013
Filed:
Feb 8, 2010
Appl. No.:
12/701957
Inventors:
Christian Wilhelmus Baks - Poughkeepsie NY, US
Richard A. John - Yorktown Heights NY, US
Young Hoon Kwark - Chappaqua NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01H 51/22
US Classification:
335 78, 200181
Abstract:
Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.

Integrated Electromechanical Relays

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US Patent:
8525623, Sep 3, 2013
Filed:
Mar 21, 2012
Appl. No.:
13/425896
Inventors:
Christian W. Baks - Poughkeepsie NY, US
Richard A. John - Yorktown Heights NY, US
Young H. Kwark - Chappaqua NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01H 51/22
US Classification:
335 78, 200181
Abstract:
Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.

High Performance Time Domain Reflectometry

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US Patent:
20120274338, Nov 1, 2012
Filed:
Apr 29, 2011
Appl. No.:
13/097595
Inventors:
Christian W. Baks - Poughkeepsie NY, US
Richard A. John - Yorktown Heights NY, US
Young H. Kwark - Chappaqua NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
G01R 27/28
G01R 1/06
US Classification:
324617, 324149
Abstract:
Methods and systems for high-bandwidth time domain reflectometry include a printed circuit board (PCB) and a probe. The PCB includes at least one signal terminal connected to at least one signal via at least three guide terminals arranged around the at least one high-frequency signal terminal. At least one of the guide terminals is connected to at least one ground via. The probe includes at least one biased pin to contact the at least one signal terminal and at least three fixed guide pins arranged about the at least one biased pin to facilitate alignment of said at least one biased pin by first engaging at least one guide terminal area, such that the at least one mechanically biased pin is guided to the at least one contact point.

Optical Transceiver Module

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US Patent:
7539366, May 26, 2009
Filed:
Jan 4, 2008
Appl. No.:
11/969374
Inventors:
Christian Wilhelmus Baks - Poughkeepsie NY, US
Fuad Elias Doany - Katonah NY, US
Clint Lee Schow - Ossining NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G02B 6/12
G02B 6/36
US Classification:
385 14, 385 33, 385 88, 385 92, 385 93
Abstract:
An optical module. The optical module includes a printed circuit board and an opto-chip. The opto-chip includes a transparent carrier with an optoelectronic device array and an associated integrated circuit array that are flip chip attached to the transparent carrier. The optoelectronic device array and the associated integrated circuit array are interconnected via surface wiring with bond sites. In addition, the associated integrated circuit array extends beyond the transparent carrier to provide direct flip chip attachment of the opto-chip to the printed circuit board.

Co-Packaged Optical Module

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US Patent:
20220328375, Oct 13, 2022
Filed:
Apr 7, 2021
Appl. No.:
17/225075
Inventors:
- Armonk NY, US
Fuad Elias Doany - Katonah NY, US
Benjamin Giles Lee - Ridgefield CT, US
Daniel M. Kuchta - Patterson NY, US
Christian Wilhelmus Baks - Pleasant Valley NY, US
International Classification:
H01L 23/367
H01L 25/16
G02B 6/42
Abstract:
An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.

Phased Array System-In Package Supporting Spatio-Spectral Division Multiplexing

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US Patent:
20230074376, Mar 9, 2023
Filed:
Sep 7, 2021
Appl. No.:
17/468586
Inventors:
- Armonk NY, US
- Tokyo, JP
Bodhisatwa Sadhu - Peekskill NY, US
Jean-Olivier Plouchart - New York NY, US
Xiaoxiong Gu - Scarsdale NY, US
Christian Wilhelmus Baks - Pleasant Valley NY, US
Yo Yamaguchi - Chiba, JP
Kiyoshi Kobayashi - Chiba, JP
Yoshiharu Fujisaku - Chiba, JP
Ning Guan - Chiba, JP
International Classification:
H01Q 3/26
H04B 7/06
H01Q 1/24
Abstract:
A phased array antenna includes an antenna array substrate having a plurality of antenna elements. At least two beamformers are coupled to the plurality of antenna elements. At least two filters support different frequency bands and are respectively coupled to the at least two beamformers. A frequency converter is coupled to the at least two filters, the frequency converter including one intermediate frequency (IF) port and at least two radio frequency (RF) ports. The one IF port of the frequency converter is configured to support the at least two beamformers via the at least two RF ports. A first beamformer of the at least two beamformers is coupled to a first filter of the at least two filters to form a first beam in a direction different than a second beamformer of the first two beamformers coupled to a second filter of the at least two filters.

Integrated Antenna Array Packaging Structures And Methods

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US Patent:
20190319338, Oct 17, 2019
Filed:
Apr 13, 2018
Appl. No.:
15/953075
Inventors:
- Armonk NY, US
Duixian Liu - Scarsdale NY, US
Christian W. Baks - Pleasant Valley NY, US
Alberto Valdes Garcia - Chappaqua NY, US
International Classification:
H01Q 1/22
H01Q 21/06
H01L 21/66
H01L 23/367
H01L 23/538
H01L 23/66
H01L 23/00
H01L 21/48
H01Q 21/00
Abstract:
An apparatus includes an antenna array package cover comprising a radiating surface, a mating surface disposed opposite the radiating surface, and an array of antenna array sub-patterns wherein each antenna array sub-pattern comprises at least one antenna element. The antenna array package also includes an array of sub-pattern interface packages mated to the mating surface of the antenna array package cover. Each sub-pattern interface package of the array of sub-pattern interface packages comprises a package carrier, a sub-pattern integrated circuit electrically and mechanically coupled to the package carrier, and a set of interface lines corresponding to the antenna elements of the antenna array sub-pattern that corresponds to the sub-pattern interface package. Methods for mounting the above apparatus into a host circuit are also disclosed herein.

Scalable Phased Array Package

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US Patent:
20190260109, Aug 22, 2019
Filed:
Feb 21, 2018
Appl. No.:
15/901371
Inventors:
- Armonk NY, US
Wooram Lee - Briarcliff Manor NY, US
Duixian Liu - Scarsdale NY, US
Christian Wilhelmus Baks - Pleasant Valley NY, US
Alberto Valdes-Garcia - Chappaqua NY, US
International Classification:
H01Q 1/22
H01L 23/367
H01L 23/66
H01L 23/00
H05K 1/18
H01Q 23/00
H01Q 21/00
H01Q 21/06
Abstract:
Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
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Christian W Baks from Pleasant Valley, NY, age ~49 Get Report