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Chenzhou L Lian

from Oakland, NJ
Age ~44
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Related to:
Li LinJin Lan Lin, 61
Connected to:
Catherine Y Lian, 37Chang J Lian, 76Eric C Lian, 86Hwa W Lian, 42Irene M Lian, 98Isaac T Lian, 45Ivey Lian, 45Jen T Lian, 69Josephine M Lian, 98Julie Lian, 38

Chenzhou Lian Phones & Addresses

  • 20 Boulder Run, Oakland, NJ 07436
  • Kinnelon, NJ
  • 41 Flagler Rd, Poughquag, NY 12570 (765) 426-8695
  • Atlanta, GA
  • Zionsville, IN
  • West Lafayette, IN
  • Dearborn Heights, MI
  • W Lafayette, IN

Work

Company: Ibm Aug 2010 Address: Hopewell Junction, NY Position: Thermal engineer

Education

Degree: PhD School / High School: Purdue University 2004 to 2009 Specialities: Mechanical Engineering

Skills

Simulations • Cfd • Matlab • Characterization • Fortran • Modeling • Design of Experiments • Mechanical Engineering • Aerodynamics • R&D • Testing • Labview • Thermal Analysis • Experimentation • Materials Science • Latex • Thermal • Numerical Simulation • Physics • High Performance Computing • C++ • Combustion • Python • Failure Analysis • Mathematica • Computational Fluid Dynamics • Research • C • Packaging Engineering • Thermal Engineering • Research and Development • Thermal Mechanical Electronic Packaging • Fourier Transform Infrared Spectroscopy ... • Thermal Measurement and Data Acquisition...

Languages

Mandarin

Awards

Ibm first invention plateau award, 2013 ... • Ibm 1st patent application invention ach... • The best of ibm – bravo award - Ibm • Willis h. carrier/ashrae fellowship - As...

Interests

Material Characterization • Combustion • Aerodynamics • Computational Fluid Dynamics (Cfd) • Thermal Testing

Industries

Aviation & Aerospace

Resumes

Resumes

Chenzhou Lian Photo 1

Staff Engineer, Aeronautical

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Location:
20 Boulder Run, Oakland, NJ 07436
Industry:
Aviation & Aerospace
Work:
IBM - Hopewell Junction, NY since Aug 2010
Thermal Engineer
Purdue University - West Lafayette, IN Aug 2009 - Aug 2010
Visiting Scholar
Purdue University - West Lafayette, IN Aug 2004 - Aug 2009
Research Assistant
Education:
Purdue University 2004 - 2009
PhD, Mechanical Engineering Tsinghua University 2001 - 2004
MS, Thermal Engineering Tsinghua University 1997 - 2001
BS, Thermal Engineering
Skills:
Simulations
Cfd
Matlab
Characterization
Fortran
Modeling
Design of Experiments
Mechanical Engineering
Aerodynamics
R&D
Testing
Labview
Thermal Analysis
Experimentation
Materials Science
Latex
Thermal
Numerical Simulation
Physics
High Performance Computing
C++
Combustion
Python
Failure Analysis
Mathematica
Computational Fluid Dynamics
Research
C
Packaging Engineering
Thermal Engineering
Research and Development
Thermal Mechanical Electronic Packaging
Fourier Transform Infrared Spectroscopy and Thermogravimetry
Thermal Measurement and Data Acquisition System Setup
Interests:
Material Characterization
Combustion
Aerodynamics
Computational Fluid Dynamics (Cfd)
Thermal Testing
Languages:
Mandarin
Awards:
IBM First Invention Plateau Award, 2013
IBM
IBM 1st Patent Application Invention Achievement Award
IBM
The Best of IBM – Bravo Award
IBM
Willis H. Carrier/ASHRAE Fellowship
ASHRAE

Publications

Us Patents

Electronic Device Console With Natural Draft Cooling

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US Patent:
20140024465, Jan 23, 2014
Filed:
Jul 18, 2012
Appl. No.:
13/551693
Inventors:
Paul F. BODENWEBER - Kingston NY, US
Jon A. CASEY - Poughkeepsie NY, US
Chenzhou LIAN - Poughquag NY, US
Kathryn C. RIVERA - Hopewell Junction NY, US
Kamal K. SIKKA - Poughkeepsie NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
F24F 7/04
H05K 7/20
H05K 13/00
H05K 5/02
A63F 11/00
US Classification:
463 46, 454 1, 295921, 361694
Abstract:
An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.

Uniform Solder Reflow Fixture

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US Patent:
8444043, May 21, 2013
Filed:
Jan 31, 2012
Appl. No.:
13/362228
Inventors:
William E. Bernier - Endwell NY, US
Marcus E. Interrante - New Paltz NY, US
Rajneesh Kumar - Poughkeepsie NY, US
Chenzhou Lian - Poughquag NY, US
Janak G. Patel - South Burlington VT, US
Peter Slota, Jr. - Vestal NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B23K 31/00
B23K 31/02
US Classification:
22818022, 2281791, 2282332, 438612
Abstract:
An array of solder balls is attached to solder pads of one of a first substrate and a second substrate. After aligning the array of solder balls relative to solder pads of the other of the first substrate and the second substrate, a thermal-mass-increasing fixture is placed on a surface of the second substrate to form an assembly of the first substrate, the second substrate, and the array of the solder balls therebetween, and the thermal-mass-increasing fixture. The thermal-mass-increasing fixture is in physical contact with at least a surface of a periphery of the second substrate. The thermal-mass-increasing fixture reduces the cool-down rate of peripheral solder balls after a reflow step, thereby increasing time for deformation of peripheral solder balls during the cool-down and reducing the mechanical stress on the solder balls after the cool-down.

Electronic Device Console With Natural Draft Cooling

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US Patent:
20210022239, Jan 21, 2021
Filed:
Oct 5, 2020
Appl. No.:
17/062926
Inventors:
- Armonk NY, US
Chenzhou LIAN - Poughquag NY, US
Kathryn C. RIVERA - Hopewell junction NY, US
Paul F. BODENWEBER - Kingston NY, US
Jon A. CASEY - Poughkeepsie NY, US
International Classification:
H05K 1/02
H05K 7/20
Abstract:
An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.

Electronic Device Console With Natural Draft Cooling

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US Patent:
20160021731, Jan 21, 2016
Filed:
Sep 28, 2015
Appl. No.:
14/867413
Inventors:
- Armonk NY, US
Jon A. CASEY - Poughkeepsie NY, US
Chenzhou LIAN - Poughquag NY, US
Kathryn C. RIVERA - Hopewell Junction NY, US
Kamal K. SIKKA - Poughkeepsie NY, US
International Classification:
H05K 1/02
H05K 7/20
Abstract:
An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.

Heat Spreading Layer With High Thermal Conductivity

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US Patent:
20150371917, Dec 24, 2015
Filed:
Aug 27, 2015
Appl. No.:
14/837491
Inventors:
- Armonk NY, US
Taryn J. Davis - Beacon NY, US
Chenzhou Lian - Poughquag NY, US
Yi Pan - Poughkeepsie NY, US
Kamal K. Sikka - Poughkeepsie NY, US
Jeffrey A. Zitz - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 23/34
Abstract:
Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

Heat Spreading Layer With High Thermal Conductivity

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US Patent:
20150371918, Dec 24, 2015
Filed:
Aug 27, 2015
Appl. No.:
14/837871
Inventors:
- Armonk NY, US
Taryn J. Davis - Beacon NY, US
Chenzhou Lian - Poughquag NY, US
Yi Pan - Poughkeepsie NY, US
Kamal K. Sikka - Poughkeepsie NY, US
Jeffrey A. Zitz - Poughkeepsie NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
H01L 23/367
Abstract:
Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

Heat Spreading Layer With High Thermal Conductivity

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US Patent:
20150371919, Dec 24, 2015
Filed:
Aug 28, 2015
Appl. No.:
14/838524
Inventors:
- Armonk NY, US
Taryn J. Davis - Beacon NY, US
Chenzhou Lian - Poughquag NY, US
Yi Pan - Poughkeepsie NY, US
Kamal K. Sikka - Poughkeepsie NY, US
Jeffrey A. Zitz - Poughkeepsie NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
H01L 23/367
Abstract:
Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

Heat Spreading Layer With High Thermal Conductivity

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US Patent:
20150371922, Dec 24, 2015
Filed:
Aug 28, 2015
Appl. No.:
14/838461
Inventors:
- Armonk NY, US
Taryn J. Davis - Beacon NY, US
Chenzhou Lian - Poughquag NY, US
Yi Pan - Poughkeepsie NY, US
Kamal K. Sikka - Poughkeepsie NY, US
Jeffrey A. Zitz - Poughkeepsie NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
H01L 23/373
Abstract:
Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.
Control profile
Chenzhou L Lian from Oakland, NJ, age ~44 Get Report